D_PAD::D_PAD( MODULE* parent ) :
BOARD_CONNECTED_ITEM( parent, PCB_PAD_T )
{
m_NumPadName = 0;
m_Size.x = m_Size.y = DMils2iu( 600 ); // Default pad size 60 mils.
m_Drill.x = m_Drill.y = DMils2iu( 300 ); // Default drill size 30 mils.
m_Orient = 0; // Pad rotation in 1/10 degrees.
m_LengthPadToDie = 0;
if( m_Parent && m_Parent->Type() == PCB_MODULE_T )
{
m_Pos = GetParent()->GetPosition();
}
SetShape( PAD_SHAPE_CIRCLE ); // Default pad shape is PAD_CIRCLE.
SetDrillShape( PAD_DRILL_SHAPE_CIRCLE ); // Default pad drill shape is a circle.
m_Attribute = PAD_ATTRIB_STANDARD; // Default pad type is NORMAL (thru hole)
m_LocalClearance = 0;
m_LocalSolderMaskMargin = 0;
m_LocalSolderPasteMargin = 0;
m_LocalSolderPasteMarginRatio = 0.0;
m_ZoneConnection = PAD_ZONE_CONN_INHERITED; // Use parent setting by default
m_ThermalWidth = 0; // Use parent setting by default
m_ThermalGap = 0; // Use parent setting by default
// Set layers mask to default for a standard thru hole pad.
m_layerMask = StandardMask();
SetSubRatsnest( 0 ); // used in ratsnest calculations
m_boundingRadius = -1;
}
void D_PAD::ImportSettingsFromMaster( const D_PAD& aMasterPad )
{
SetShape( aMasterPad.GetShape() );
SetLayerSet( aMasterPad.GetLayerSet() );
SetAttribute( aMasterPad.GetAttribute() );
// The pad orientation, for historical reasons is the
// pad rotation + parent rotation.
// So we have to manage this parent rotation
double pad_rot = aMasterPad.GetOrientation();
if( aMasterPad.GetParent() )
pad_rot -= aMasterPad.GetParent()->GetOrientation();
if( GetParent() )
pad_rot += GetParent()->GetOrientation();
SetOrientation( pad_rot );
SetSize( aMasterPad.GetSize() );
SetDelta( wxSize( 0, 0 ) );
SetOffset( aMasterPad.GetOffset() );
SetDrillSize( aMasterPad.GetDrillSize() );
SetDrillShape( aMasterPad.GetDrillShape() );
SetRoundRectRadiusRatio( aMasterPad.GetRoundRectRadiusRatio() );
switch( aMasterPad.GetShape() )
{
case PAD_SHAPE_TRAPEZOID:
SetDelta( aMasterPad.GetDelta() );
break;
case PAD_SHAPE_CIRCLE:
// ensure size.y == size.x
SetSize( wxSize( GetSize().x, GetSize().x ) );
break;
default:
;
}
switch( aMasterPad.GetAttribute() )
{
case PAD_ATTRIB_SMD:
case PAD_ATTRIB_CONN:
// These pads do not have hole (they are expected to be only on one
// external copper layer)
SetDrillSize( wxSize( 0, 0 ) );
break;
default:
;
}
// Add or remove custom pad shapes:
SetPrimitives( aMasterPad.GetPrimitives() );
SetAnchorPadShape( aMasterPad.GetAnchorPadShape() );
MergePrimitivesAsPolygon();
}
D_PAD::D_PAD( MODULE* parent ) :
BOARD_CONNECTED_ITEM( parent, PCB_PAD_T )
{
m_Size.x = m_Size.y = Mils2iu( 60 ); // Default pad size 60 mils.
m_Drill.x = m_Drill.y = Mils2iu( 30 ); // Default drill size 30 mils.
m_Orient = 0; // Pad rotation in 1/10 degrees.
m_LengthPadToDie = 0;
if( m_Parent && m_Parent->Type() == PCB_MODULE_T )
{
m_Pos = GetParent()->GetPosition();
}
SetShape( PAD_SHAPE_CIRCLE ); // Default pad shape is PAD_CIRCLE.
SetAnchorPadShape( PAD_SHAPE_CIRCLE ); // Default shape for custom shaped pads
// is PAD_CIRCLE.
SetDrillShape( PAD_DRILL_SHAPE_CIRCLE ); // Default pad drill shape is a circle.
m_Attribute = PAD_ATTRIB_STANDARD; // Default pad type is NORMAL (thru hole)
m_LocalClearance = 0;
m_LocalSolderMaskMargin = 0;
m_LocalSolderPasteMargin = 0;
m_LocalSolderPasteMarginRatio = 0.0;
// Parameters for round rect only:
m_padRoundRectRadiusScale = 0.25; // from IPC-7351C standard
// Parameters for chamfered rect only:
m_padChamferRectScale = 0.2; // Size of chamfer: ratio of smallest of X,Y size
m_chamferPositions = RECT_NO_CHAMFER; // No chamfered corner
m_ZoneConnection = PAD_ZONE_CONN_INHERITED; // Use parent setting by default
m_ThermalWidth = 0; // Use parent setting by default
m_ThermalGap = 0; // Use parent setting by default
m_customShapeClearanceArea = CUST_PAD_SHAPE_IN_ZONE_OUTLINE;
// Set layers mask to default for a standard thru hole pad.
m_layerMask = StandardMask();
SetSubRatsnest( 0 ); // used in ratsnest calculations
m_boundingRadius = -1;
}
