BOARD_DESIGN_SETTINGS::BOARD_DESIGN_SETTINGS() :
m_Pad_Master( 0 )
{
m_EnabledLayers = ALL_LAYERS; // All layers enabled at first.
// SetCopperLayerCount() will adjust this.
SetVisibleLayers( FULL_LAYERS );
// set all but hidden text as visible.
m_VisibleElements = ~( 1 << MOD_TEXT_INVISIBLE );
SetCopperLayerCount( 2 ); // Default design is a double sided board
// via type (VIA_BLIND_BURIED, VIA_THROUGH VIA_MICROVIA).
m_CurrentViaType = VIA_THROUGH;
// if true, when creating a new track starting on an existing track, use this track width
m_UseConnectedTrackWidth = false;
m_BlindBuriedViaAllowed = false; // true to allow blind/buried vias
m_MicroViasAllowed = false; // true to allow micro vias
m_DrawSegmentWidth = DEFAULT_GRAPHIC_THICKNESS; // current graphic line width (not EDGE layer)
m_EdgeSegmentWidth = DEFAULT_PCB_EDGE_THICKNESS; // current graphic line width (EDGE layer only)
m_PcbTextWidth = DEFAULT_TEXT_PCB_THICKNESS; // current Pcb (not module) Text width
m_PcbTextSize = wxSize( DEFAULT_TEXT_PCB_SIZE,
DEFAULT_TEXT_PCB_SIZE ); // current Pcb (not module) Text size
m_TrackMinWidth = DMils2iu( 100 ); // track min value for width ((min copper size value
m_ViasMinSize = DMils2iu( 350 ); // vias (not micro vias) min diameter
m_ViasMinDrill = DMils2iu( 200 ); // vias (not micro vias) min drill diameter
m_MicroViasMinSize = DMils2iu( 200 ); // micro vias (not vias) min diameter
m_MicroViasMinDrill = DMils2iu( 50 ); // micro vias (not vias) min drill diameter
// Global mask margins:
m_SolderMaskMargin = DEFAULT_SOLDERMASK_CLEARANCE; // Solder mask margin
m_SolderMaskMinWidth = DEFAULT_SOLDERMASK_MIN_WIDTH; // Solder mask min width
m_SolderPasteMargin = 0; // Solder paste margin absolute value
m_SolderPasteMarginRatio = 0.0; // Solder pask margin ratio value of pad size
// The final margin is the sum of these 2 values
// Usually < 0 because the mask is smaller than pad
m_ModuleTextSize = wxSize( DEFAULT_TEXT_MODULE_SIZE,
DEFAULT_TEXT_MODULE_SIZE );
m_ModuleTextWidth = DEFAULT_GR_MODULE_THICKNESS;
m_ModuleSegmentWidth = DEFAULT_GR_MODULE_THICKNESS;
// Layer thickness for 3D viewer
m_boardThickness = Millimeter2iu( DEFAULT_BOARD_THICKNESS_MM );
}
BOARD_DESIGN_SETTINGS::BOARD_DESIGN_SETTINGS() :
m_Pad_Master( NULL )
{
LSET all_set = LSET().set();
m_enabledLayers = all_set; // All layers enabled at first.
// SetCopperLayerCount() will adjust this.
SetVisibleLayers( all_set );
// set all but hidden text as visible.
m_visibleElements = ~( 1 << MOD_TEXT_INVISIBLE );
SetCopperLayerCount( 2 ); // Default design is a double sided board
// via type (VIA_BLIND_BURIED, VIA_THROUGH VIA_MICROVIA).
m_CurrentViaType = VIA_THROUGH;
// if true, when creating a new track starting on an existing track, use this track width
m_UseConnectedTrackWidth = false;
m_BlindBuriedViaAllowed = false; // true to allow blind/buried vias
m_MicroViasAllowed = false; // true to allow micro vias
m_DrawSegmentWidth = Millimeter2iu( DEFAULT_GRAPHIC_THICKNESS ); // current graphic line width (not EDGE layer)
m_EdgeSegmentWidth = Millimeter2iu( DEFAULT_PCB_EDGE_THICKNESS ); // current graphic line width (EDGE layer only)
m_PcbTextWidth = Millimeter2iu(DEFAULT_TEXT_PCB_THICKNESS ); // current Pcb (not module) Text width
m_PcbTextSize = wxSize( Millimeter2iu( DEFAULT_TEXT_PCB_SIZE ),
Millimeter2iu( DEFAULT_TEXT_PCB_SIZE ) ); // current Pcb (not module) Text size
m_useCustomTrackVia = false;
m_customTrackWidth = Millimeter2iu( DEFAULT_CUSTOMTRACKWIDTH );
m_TrackMinWidth = Millimeter2iu( DEFAULT_TRACKMINWIDTH ); // track min width
m_ViasMinSize = Millimeter2iu( DEFAULT_VIASMINSIZE ); // via (not uvia) min diam
m_ViasMinDrill = Millimeter2iu( DEFAULT_VIASMINDRILL ); // via (not uvia) min drill diam
m_MicroViasMinSize = Millimeter2iu( DEFAULT_MICROVIASMINSIZE );// uvia (not via) min diam
m_MicroViasMinDrill = Millimeter2iu( DEFAULT_MICROVIASMINDRILL );// uvia (not via) min drill diam
// Global mask margins:
m_SolderMaskMargin = Millimeter2iu( DEFAULT_SOLDERMASK_CLEARANCE ); // Solder mask margin
m_SolderMaskMinWidth = Millimeter2iu( DEFAULT_SOLDERMASK_MIN_WIDTH ); // Solder mask min width
m_SolderPasteMargin = 0; // Solder paste margin absolute value
m_SolderPasteMarginRatio = 0.0; // Solder pask margin ratio value of pad size
// The final margin is the sum of these 2 values
// Usually < 0 because the mask is smaller than pad
// Layer thickness for 3D viewer
m_boardThickness = Millimeter2iu( DEFAULT_BOARD_THICKNESS_MM );
m_viaSizeIndex = 0;
m_trackWidthIndex = 0;
// Default values for the footprint editor and fp creation
// (also covers footprints created on the fly by micor-waves tools)
m_ModuleTextSize = wxSize( Millimeter2iu( DEFAULT_TEXT_MODULE_SIZE ),
Millimeter2iu( DEFAULT_TEXT_MODULE_SIZE ) );
m_ModuleTextWidth = Millimeter2iu( DEFAULT_GR_MODULE_THICKNESS );
m_ModuleSegmentWidth = Millimeter2iu( DEFAULT_GR_MODULE_THICKNESS );
// These values will be overriden by config values after reading the config
// Default ref text on fp creation. if empty, use footprint name as default
m_RefDefaultText = wxT( "REF**" );
m_RefDefaultVisibility = true; // Default ref text visibility on fp creation
m_RefDefaultlayer = int( F_SilkS ); // Default ref text layer on fp creation
// Default value text on fp creation. if empty, use footprint name as default
m_ValueDefaultText = wxEmptyString;
m_ValueDefaultVisibility = true;
m_ValueDefaultlayer = int( F_Fab );
}
BOARD_DESIGN_SETTINGS::BOARD_DESIGN_SETTINGS() :
m_Pad_Master( NULL )
{
LSET all_set = LSET().set();
m_enabledLayers = all_set; // All layers enabled at first.
// SetCopperLayerCount() will adjust this.
SetVisibleLayers( all_set );
// set all but hidden text as visible.
m_visibleElements = ~( 1 << GAL_LAYER_INDEX( LAYER_MOD_TEXT_INVISIBLE ) );
SetCopperLayerCount( 2 ); // Default design is a double sided board
m_CurrentViaType = VIA_THROUGH;
// if true, when creating a new track starting on an existing track, use this track width
m_UseConnectedTrackWidth = false;
m_BlindBuriedViaAllowed = false;
m_MicroViasAllowed = false;
m_LineThickness[ LAYER_CLASS_SILK ] = Millimeter2iu( DEFAULT_SILK_LINE_WIDTH );
m_TextSize[ LAYER_CLASS_SILK ] = wxSize( Millimeter2iu( DEFAULT_SILK_TEXT_SIZE ),
Millimeter2iu( DEFAULT_SILK_TEXT_SIZE ) );
m_TextThickness[ LAYER_CLASS_SILK ] = Millimeter2iu( DEFAULT_SILK_TEXT_WIDTH );
m_TextItalic[ LAYER_CLASS_SILK ] = false;
m_TextUpright[ LAYER_CLASS_SILK ] = true;
m_LineThickness[ LAYER_CLASS_COPPER ] = Millimeter2iu( DEFAULT_COPPER_LINE_WIDTH );
m_TextSize[ LAYER_CLASS_COPPER ] = wxSize( Millimeter2iu( DEFAULT_COPPER_TEXT_SIZE ),
Millimeter2iu( DEFAULT_COPPER_TEXT_SIZE ) );
m_TextThickness[ LAYER_CLASS_COPPER ] = Millimeter2iu( DEFAULT_COPPER_TEXT_WIDTH );
m_TextItalic[ LAYER_CLASS_COPPER ] = false;
m_TextUpright[ LAYER_CLASS_COPPER ] = true;
// Edges & Courtyards; text properties aren't used but better to have them holding
// reasonable values than not.
m_LineThickness[ LAYER_CLASS_EDGES ] = Millimeter2iu( DEFAULT_EDGE_WIDTH );
m_TextSize[ LAYER_CLASS_EDGES ] = wxSize( Millimeter2iu( DEFAULT_TEXT_SIZE ),
Millimeter2iu( DEFAULT_TEXT_SIZE ) );
m_TextThickness[ LAYER_CLASS_EDGES ] = Millimeter2iu( DEFAULT_TEXT_WIDTH );
m_TextItalic[ LAYER_CLASS_EDGES ] = false;
m_TextUpright[ LAYER_CLASS_EDGES ] = true;
m_LineThickness[ LAYER_CLASS_COURTYARD ] = Millimeter2iu( DEFAULT_COURTYARD_WIDTH );
m_TextSize[ LAYER_CLASS_COURTYARD ] = wxSize( Millimeter2iu( DEFAULT_TEXT_SIZE ),
Millimeter2iu( DEFAULT_TEXT_SIZE ) );
m_TextThickness[ LAYER_CLASS_COURTYARD ] = Millimeter2iu( DEFAULT_TEXT_WIDTH );
m_TextItalic[ LAYER_CLASS_COURTYARD ] = false;
m_TextUpright[ LAYER_CLASS_COURTYARD ] = true;
m_LineThickness[ LAYER_CLASS_OTHERS ] = Millimeter2iu( DEFAULT_LINE_WIDTH );
m_TextSize[ LAYER_CLASS_OTHERS ] = wxSize( Millimeter2iu( DEFAULT_TEXT_SIZE ),
Millimeter2iu( DEFAULT_TEXT_SIZE ) );
m_TextThickness[ LAYER_CLASS_OTHERS ] = Millimeter2iu( DEFAULT_TEXT_WIDTH );
m_TextItalic[ LAYER_CLASS_OTHERS ] = false;
m_TextUpright[ LAYER_CLASS_OTHERS ] = true;
m_useCustomTrackVia = false;
m_customTrackWidth = Millimeter2iu( DEFAULT_CUSTOMTRACKWIDTH );
m_customViaSize.m_Diameter = Millimeter2iu( DEFAULT_VIASMINSIZE );
m_customViaSize.m_Drill = Millimeter2iu( DEFAULT_VIASMINDRILL );
m_useCustomDiffPair = false;
m_customDiffPair.m_Width = Millimeter2iu( DEFAULT_CUSTOMDPAIRWIDTH );
m_customDiffPair.m_Gap = Millimeter2iu( DEFAULT_CUSTOMDPAIRGAP );
m_customDiffPair.m_ViaGap = Millimeter2iu( DEFAULT_CUSTOMDPAIRVIAGAP );
m_TrackMinWidth = Millimeter2iu( DEFAULT_TRACKMINWIDTH );
m_ViasMinSize = Millimeter2iu( DEFAULT_VIASMINSIZE );
m_ViasMinDrill = Millimeter2iu( DEFAULT_VIASMINDRILL );
m_MicroViasMinSize = Millimeter2iu( DEFAULT_MICROVIASMINSIZE );
m_MicroViasMinDrill = Millimeter2iu( DEFAULT_MICROVIASMINDRILL );
m_CopperEdgeClearance = Millimeter2iu( DEFAULT_COPPEREDGECLEARANCE );
// Global mask margins:
m_SolderMaskMargin = Millimeter2iu( DEFAULT_SOLDERMASK_CLEARANCE );
m_SolderMaskMinWidth = Millimeter2iu( DEFAULT_SOLDERMASK_MIN_WIDTH );
m_SolderPasteMargin = 0; // Solder paste margin absolute value
m_SolderPasteMarginRatio = 0.0; // Solder paste margin as a ratio of pad size
// The final margin is the sum of these 2 values
// Usually < 0 because the mask is smaller than pad
// Layer thickness for 3D viewer
m_boardThickness = Millimeter2iu( DEFAULT_BOARD_THICKNESS_MM );
m_viaSizeIndex = 0;
m_trackWidthIndex = 0;
m_diffPairIndex = 0;
// Default ref text on fp creation. If empty, use footprint name as default
m_RefDefaultText = wxT( "REF**" );
m_RefDefaultVisibility = true;
m_RefDefaultlayer = int( F_SilkS );
// Default value text on fp creation. If empty, use footprint name as default
m_ValueDefaultText = wxEmptyString;
m_ValueDefaultVisibility = true;
m_ValueDefaultlayer = int( F_Fab );
}
