static void export_vrml_via( BOARD* pcb, SEGVIA* via ) //{{{ { double x, y, r, hole; int top_layer, bottom_layer; r = via->GetWidth() / 2; hole = via->GetDrillValue() / 2; x = via->GetStart().x; y = via->GetStart().y; via->ReturnLayerPair( &top_layer, &bottom_layer ); // Export the via padstack export_round_padstack( pcb, x, y, r, bottom_layer, top_layer ); // Drill a hole export_vrml_hole( via_triangles[via->GetShape()], top_layer, bottom_layer, x, y, hole ); }
static void export_vrml_via( MODEL_VRML& aModel, BOARD* pcb, const VIA* via ) { double x, y, r, hole; LAYER_ID top_layer, bottom_layer; hole = via->GetDrillValue() * aModel.scale / 2.0; r = via->GetWidth() * aModel.scale / 2.0; x = via->GetStart().x * aModel.scale; y = via->GetStart().y * aModel.scale; via->LayerPair( &top_layer, &bottom_layer ); // do not render a buried via if( top_layer != F_Cu && bottom_layer != B_Cu ) return; // Export the via padstack export_round_padstack( aModel, pcb, x, y, r, bottom_layer, top_layer, hole ); }