// Sort vias for uniqueness
static int ViaSort( const void* aRefptr, const void* aObjptr )
{
VIA* padref = *(VIA**) aRefptr;
VIA* padcmp = *(VIA**) aObjptr;
if( padref->GetWidth() != padcmp->GetWidth() )
return padref->GetWidth() - padcmp->GetWidth();
if( padref->GetDrillValue() != padcmp->GetDrillValue() )
return padref->GetDrillValue() - padcmp->GetDrillValue();
if( padref->GetLayerSet() != padcmp->GetLayerSet() )
return padref->GetLayerSet().FmtBin().compare( padcmp->GetLayerSet().FmtBin() );
return 0;
}
/* Extract the D356 record from the vias */
static void build_via_testpoints( BOARD *aPcb,
std::vector <D356_RECORD>& aRecords )
{
wxPoint origin = aPcb->GetAuxOrigin();
// Enumerate all the track segments and keep the vias
for( TRACK *track = aPcb->m_Track; track; track = track->Next() )
{
if( track->Type() == PCB_VIA_T )
{
VIA *via = (VIA*) track;
NETINFO_ITEM *net = track->GetNet();
D356_RECORD rk;
rk.smd = false;
rk.hole = true;
if( net )
rk.netname = net->GetNetname();
else
rk.netname = wxEmptyString;
rk.refdes = wxT("VIA");
rk.pin = wxT("");
rk.midpoint = true; // Vias are always midpoints
rk.drill = via->GetDrillValue();
rk.mechanical = false;
LAYER_ID top_layer, bottom_layer;
via->LayerPair( &top_layer, &bottom_layer );
rk.access = via_access_code( aPcb, top_layer, bottom_layer );
rk.x_location = via->GetPosition().x - origin.x;
rk.y_location = origin.y - via->GetPosition().y;
rk.x_size = via->GetWidth();
rk.y_size = 0; // Round so height = 0
rk.rotation = 0;
rk.soldermask = 3; // XXX always tented?
aRecords.push_back( rk );
}
}
}
void EXCELLON_WRITER::BuildHolesList( LAYER_PAIR aLayerPair,
bool aGenerateNPTH_list )
{
HOLE_INFO new_hole;
m_holeListBuffer.clear();
m_toolListBuffer.clear();
wxASSERT( aLayerPair.first < aLayerPair.second ); // fix the caller
// build hole list for vias
if( ! aGenerateNPTH_list ) // vias are always plated !
{
for( VIA* via = GetFirstVia( m_pcb->m_Track ); via; via = GetFirstVia( via->Next() ) )
{
int hole_sz = via->GetDrillValue();
if( hole_sz == 0 ) // Should not occur.
continue;
new_hole.m_Tool_Reference = -1; // Flag value for Not initialized
new_hole.m_Hole_Orient = 0;
new_hole.m_Hole_Diameter = hole_sz;
new_hole.m_Hole_NotPlated = false;
new_hole.m_Hole_Size.x = new_hole.m_Hole_Size.y = new_hole.m_Hole_Diameter;
new_hole.m_Hole_Shape = 0; // hole shape: round
new_hole.m_Hole_Pos = via->GetStart();
via->LayerPair( &new_hole.m_Hole_Top_Layer, &new_hole.m_Hole_Bottom_Layer );
// LayerPair() returns params with m_Hole_Bottom_Layer > m_Hole_Top_Layer
// Remember: top layer = 0 and bottom layer = 31 for through hole vias
// Any captured via should be from aLayerPair.first to aLayerPair.second exactly.
if( new_hole.m_Hole_Top_Layer != aLayerPair.first ||
new_hole.m_Hole_Bottom_Layer != aLayerPair.second )
continue;
m_holeListBuffer.push_back( new_hole );
}
}
if( aLayerPair == LAYER_PAIR( F_Cu, B_Cu ) )
{
// add holes for thru hole pads
for( MODULE* module = m_pcb->m_Modules; module; module = module->Next() )
{
for( D_PAD* pad = module->Pads(); pad; pad = pad->Next() )
{
if( !m_merge_PTH_NPTH )
{
if( !aGenerateNPTH_list && pad->GetAttribute() == PAD_ATTRIB_HOLE_NOT_PLATED )
continue;
if( aGenerateNPTH_list && pad->GetAttribute() != PAD_ATTRIB_HOLE_NOT_PLATED )
continue;
}
if( pad->GetDrillSize().x == 0 )
continue;
new_hole.m_Hole_NotPlated = (pad->GetAttribute() == PAD_ATTRIB_HOLE_NOT_PLATED);
new_hole.m_Tool_Reference = -1; // Flag is: Not initialized
new_hole.m_Hole_Orient = pad->GetOrientation();
new_hole.m_Hole_Shape = 0; // hole shape: round
new_hole.m_Hole_Diameter = std::min( pad->GetDrillSize().x, pad->GetDrillSize().y );
new_hole.m_Hole_Size.x = new_hole.m_Hole_Size.y = new_hole.m_Hole_Diameter;
if( pad->GetDrillShape() != PAD_DRILL_SHAPE_CIRCLE )
new_hole.m_Hole_Shape = 1; // oval flag set
new_hole.m_Hole_Size = pad->GetDrillSize();
new_hole.m_Hole_Pos = pad->GetPosition(); // hole position
new_hole.m_Hole_Bottom_Layer = B_Cu;
new_hole.m_Hole_Top_Layer = F_Cu; // pad holes are through holes
m_holeListBuffer.push_back( new_hole );
}
}
}
// Sort holes per increasing diameter value
sort( m_holeListBuffer.begin(), m_holeListBuffer.end(), CmpHoleSettings );
// build the tool list
int last_hole = -1; // Set to not initialized (this is a value not used
// for m_holeListBuffer[ii].m_Hole_Diameter)
bool last_notplated_opt = false;
DRILL_TOOL new_tool( 0, false );
unsigned jj;
for( unsigned ii = 0; ii < m_holeListBuffer.size(); ii++ )
{
if( m_holeListBuffer[ii].m_Hole_Diameter != last_hole ||
m_holeListBuffer[ii].m_Hole_NotPlated != last_notplated_opt )
{
new_tool.m_Diameter = m_holeListBuffer[ii].m_Hole_Diameter;
new_tool.m_Hole_NotPlated = m_holeListBuffer[ii].m_Hole_NotPlated;
m_toolListBuffer.push_back( new_tool );
last_hole = new_tool.m_Diameter;
last_notplated_opt = new_tool.m_Hole_NotPlated;
}
jj = m_toolListBuffer.size();
if( jj == 0 )
continue; // Should not occurs
m_holeListBuffer[ii].m_Tool_Reference = jj; // Tool value Initialized (value >= 1)
m_toolListBuffer.back().m_TotalCount++;
if( m_holeListBuffer[ii].m_Hole_Shape )
m_toolListBuffer.back().m_OvalCount++;
}
}
void EXCELLON_WRITER::BuildHolesList( int aFirstLayer,
int aLastLayer,
bool aExcludeThroughHoles,
bool aGenerateNPTH_list,
bool aMerge_PTH_NPTH )
{
HOLE_INFO new_hole;
int hole_value;
m_holeListBuffer.clear();
m_toolListBuffer.clear();
if( (aFirstLayer >= 0) && (aLastLayer >= 0) )
{
if( aFirstLayer > aLastLayer )
std::swap( aFirstLayer, aLastLayer );
}
if ( aGenerateNPTH_list && aMerge_PTH_NPTH )
{
return;
}
// build hole list for vias
if( ! aGenerateNPTH_list ) // vias are always plated !
{
for( VIA* via = GetFirstVia( m_pcb->m_Track ); via; via = GetFirstVia( via->Next() ) )
{
hole_value = via->GetDrillValue();
if( hole_value == 0 ) // Should not occur.
continue;
new_hole.m_Tool_Reference = -1; // Flag value for Not initialized
new_hole.m_Hole_Orient = 0;
new_hole.m_Hole_Diameter = hole_value;
new_hole.m_Hole_Size.x = new_hole.m_Hole_Size.y = new_hole.m_Hole_Diameter;
new_hole.m_Hole_Shape = 0; // hole shape: round
new_hole.m_Hole_Pos = via->GetStart();
via->LayerPair( &new_hole.m_Hole_Top_Layer, &new_hole.m_Hole_Bottom_Layer );
// LayerPair return params with m_Hole_Bottom_Layer > m_Hole_Top_Layer
// Remember: top layer = 0 and bottom layer = 31 for through hole vias
// the via should be at least from aFirstLayer to aLastLayer
if( (new_hole.m_Hole_Top_Layer > aFirstLayer) && (aFirstLayer >= 0) )
continue; // via above the first layer
if( (new_hole.m_Hole_Bottom_Layer < aLastLayer) && (aLastLayer >= 0) )
continue; // via below the last layer
if( aExcludeThroughHoles && (new_hole.m_Hole_Bottom_Layer == B_Cu)
&& (new_hole.m_Hole_Top_Layer == F_Cu) )
continue;
m_holeListBuffer.push_back( new_hole );
}
}
// build hole list for pads (assumed always through holes)
if( !aExcludeThroughHoles || aGenerateNPTH_list )
{
for( MODULE* module = m_pcb->m_Modules; module; module = module->Next() )
{
// Read and analyse pads
for( D_PAD* pad = module->Pads(); pad; pad = pad->Next() )
{
if( ! aGenerateNPTH_list &&
pad->GetAttribute() == PAD_HOLE_NOT_PLATED &&
! aMerge_PTH_NPTH )
continue;
if( aGenerateNPTH_list && pad->GetAttribute() != PAD_HOLE_NOT_PLATED )
continue;
if( pad->GetDrillSize().x == 0 )
continue;
new_hole.m_Hole_NotPlated = (pad->GetAttribute() == PAD_HOLE_NOT_PLATED);
new_hole.m_Tool_Reference = -1; // Flag is: Not initialized
new_hole.m_Hole_Orient = pad->GetOrientation();
new_hole.m_Hole_Shape = 0; // hole shape: round
new_hole.m_Hole_Diameter = std::min( pad->GetDrillSize().x, pad->GetDrillSize().y );
new_hole.m_Hole_Size.x = new_hole.m_Hole_Size.y = new_hole.m_Hole_Diameter;
if( pad->GetDrillShape() != PAD_DRILL_CIRCLE )
new_hole.m_Hole_Shape = 1; // oval flag set
new_hole.m_Hole_Size = pad->GetDrillSize();
new_hole.m_Hole_Pos = pad->GetPosition(); // hole position
new_hole.m_Hole_Bottom_Layer = B_Cu;
new_hole.m_Hole_Top_Layer = F_Cu;// pad holes are through holes
m_holeListBuffer.push_back( new_hole );
}
}
}
// Sort holes per increasing diameter value
sort( m_holeListBuffer.begin(), m_holeListBuffer.end(), CmpHoleDiameterValue );
// build the tool list
int LastHole = -1; /* Set to not initialized (this is a value not used
* for m_holeListBuffer[ii].m_Hole_Diameter) */
DRILL_TOOL new_tool( 0 );
unsigned jj;
for( unsigned ii = 0; ii < m_holeListBuffer.size(); ii++ )
{
if( m_holeListBuffer[ii].m_Hole_Diameter != LastHole )
{
new_tool.m_Diameter = ( m_holeListBuffer[ii].m_Hole_Diameter );
m_toolListBuffer.push_back( new_tool );
LastHole = new_tool.m_Diameter;
}
jj = m_toolListBuffer.size();
if( jj == 0 )
continue; // Should not occurs
m_holeListBuffer[ii].m_Tool_Reference = jj; // Tool value Initialized (value >= 1)
m_toolListBuffer.back().m_TotalCount++;
if( m_holeListBuffer[ii].m_Hole_Shape )
m_toolListBuffer.back().m_OvalCount++;
}
}
void EDA_3D_CANVAS::buildBoardThroughHolesPolygonList( SHAPE_POLY_SET& allBoardHoles,
int aSegCountPerCircle, bool aOptimizeLargeCircles )
{
// hole diameter value to change seg count by circle:
int small_hole_limit = Millimeter2iu( 1.0 );
int copper_thickness = GetPrm3DVisu().GetCopperThicknessBIU();
BOARD* pcb = GetBoard();
// Build holes of through vias:
for( TRACK* track = pcb->m_Track; track; track = track->Next() )
{
if( track->Type() != PCB_VIA_T )
continue;
VIA *via = static_cast<VIA*>( track );
if( via->GetViaType() != VIA_THROUGH )
continue;
int holediameter = via->GetDrillValue();
int hole_outer_radius = (holediameter + copper_thickness) / 2;
TransformCircleToPolygon( allBoardHoles,
via->GetStart(), hole_outer_radius,
aSegCountPerCircle );
}
// Build holes of through pads:
for( MODULE* footprint = pcb->m_Modules; footprint; footprint = footprint->Next() )
{
for( D_PAD* pad = footprint->Pads(); pad; pad = pad->Next() )
{
// Calculate a factor to apply to segcount for large holes ( > 1 mm)
// (bigger pad drill size -> more segments) because holes in pads can have
// very different sizes and optimizing this segcount gives a better look
// Mainly mounting holes have a size bigger than small_hole_limit
wxSize padHole = pad->GetDrillSize();
if( ! padHole.x ) // Not drilled pad like SMD pad
continue;
// we use the hole diameter to calculate the seg count.
// for round holes, padHole.x == padHole.y
// for oblong holes, the diameter is the smaller of (padHole.x, padHole.y)
int diam = std::min( padHole.x, padHole.y );
int segcount = aSegCountPerCircle;
if( diam > small_hole_limit )
{
double segFactor = (double)diam / small_hole_limit;
segcount = (int)(aSegCountPerCircle * segFactor);
// limit segcount to 48. For a circle this is a very good approx.
if( segcount > 48 )
segcount = 48;
}
// The hole in the body is inflated by copper thickness.
int inflate = copper_thickness;
// If not plated, no copper.
if( pad->GetAttribute () == PAD_HOLE_NOT_PLATED )
inflate = 0;
pad->BuildPadDrillShapePolygon( allBoardHoles, inflate, segcount );
}
}
allBoardHoles.Simplify();
}
void EDA_3D_CANVAS::buildBoard3DView( GLuint aBoardList, GLuint aBodyOnlyList,
REPORTER* aErrorMessages, REPORTER* aActivity )
{
BOARD* pcb = GetBoard();
// If FL_RENDER_SHOW_HOLES_IN_ZONES is true, holes are correctly removed from copper zones areas.
// If FL_RENDER_SHOW_HOLES_IN_ZONES is false, holes are not removed from copper zones areas,
// but the calculation time is twice shorter.
bool remove_Holes = isEnabled( FL_RENDER_SHOW_HOLES_IN_ZONES );
bool realistic_mode = isRealisticMode();
bool useTextures = isRealisticMode() && isEnabled( FL_RENDER_TEXTURES );
// Number of segments to convert a circle to polygon
// We use 2 values: the first gives a good shape (for instanes rond pads)
// the second is used to speed up calculations, when a poor approximation is acceptable (holes)
const int segcountforcircle = 18;
double correctionFactor = 1.0 / cos( M_PI / (segcountforcircle * 2.0) );
const int segcountLowQuality = 12; // segments to draw a circle with low quality
// to reduce time calculations
// for holes and items which do not need
// a fine representation
double correctionFactorLQ = 1.0 / cos( M_PI / (segcountLowQuality * 2.0) );
SHAPE_POLY_SET bufferPolys; // copper areas: tracks, pads and filled zones areas
// when holes are removed from zones
SHAPE_POLY_SET bufferPcbOutlines; // stores the board main outlines
SHAPE_POLY_SET bufferZonesPolys; // copper filled zones areas
// when holes are not removed from zones
SHAPE_POLY_SET currLayerHoles; // Contains holes for the current layer
SHAPE_POLY_SET allLayerHoles; // Contains holes for all layers
// Build a polygon from edge cut items
wxString msg;
if( !pcb->GetBoardPolygonOutlines( bufferPcbOutlines, allLayerHoles, &msg ) )
{
if( aErrorMessages )
{
msg << wxT("\n") << _("Unable to calculate the board outlines.\n"
"Therefore use the board boundary box.") << wxT("\n\n");
aErrorMessages->Report( msg, REPORTER::RPT_WARNING );
}
}
// Build board holes, with optimization of large holes shape.
buildBoardThroughHolesPolygonList( allLayerHoles, segcountLowQuality, true );
LSET cu_set = LSET::AllCuMask( GetPrm3DVisu().m_CopperLayersCount );
glNewList( aBoardList, GL_COMPILE );
for( LSEQ cu = cu_set.CuStack(); cu; ++cu )
{
LAYER_ID layer = *cu;
// Skip non enabled layers in normal mode,
// and internal layers in realistic mode
if( !is3DLayerEnabled( layer ) )
continue;
if( aActivity )
aActivity->Report( wxString::Format( _( "Build layer %s" ), LSET::Name( layer ) ) );
bufferPolys.RemoveAllContours();
bufferZonesPolys.RemoveAllContours();
currLayerHoles.RemoveAllContours();
// Draw track shapes:
for( TRACK* track = pcb->m_Track; track; track = track->Next() )
{
if( !track->IsOnLayer( layer ) )
continue;
track->TransformShapeWithClearanceToPolygon( bufferPolys,
0, segcountforcircle,
correctionFactor );
// Add blind/buried via holes
if( track->Type() == PCB_VIA_T )
{
VIA *via = static_cast<VIA*>( track );
if( via->GetViaType() == VIA_THROUGH )
continue; // already done
int holediameter = via->GetDrillValue();
int thickness = GetPrm3DVisu().GetCopperThicknessBIU();
int hole_outer_radius = (holediameter + thickness) / 2;
TransformCircleToPolygon( currLayerHoles,
via->GetStart(), hole_outer_radius,
segcountLowQuality );
}
}
// draw pad shapes
for( MODULE* module = pcb->m_Modules; module; module = module->Next() )
{
// Note: NPTH pads are not drawn on copper layers when the pad
// has same shape as its hole
module->TransformPadsShapesWithClearanceToPolygon( layer,
bufferPolys,
0,
segcountforcircle,
correctionFactor, true );
// Micro-wave modules may have items on copper layers
module->TransformGraphicShapesWithClearanceToPolygonSet( layer,
bufferPolys,
0,
segcountforcircle,
correctionFactor );
// pad holes are already in list.
}
// Draw copper zones. Note:
// * if the holes are removed from copper zones
// the polygons are stored in bufferPolys (which contains all other polygons)
// * if the holes are NOT removed from copper zones
// the polygons are stored in bufferZonesPolys
if( isEnabled( FL_ZONE ) )
{
for( int ii = 0; ii < pcb->GetAreaCount(); ii++ )
{
ZONE_CONTAINER* zone = pcb->GetArea( ii );
LAYER_NUM zonelayer = zone->GetLayer();
if( zonelayer == layer )
{
zone->TransformSolidAreasShapesToPolygonSet(
remove_Holes ? bufferPolys : bufferZonesPolys,
segcountLowQuality, correctionFactorLQ );
}
}
}
// draw graphic items on copper layers (texts)
for( BOARD_ITEM* item = pcb->m_Drawings; item; item = item->Next() )
{
if( !item->IsOnLayer( layer ) )
continue;
switch( item->Type() )
{
case PCB_LINE_T: // should not exist on copper layers
( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon(
bufferPolys, 0, segcountforcircle, correctionFactor );
break;
case PCB_TEXT_T:
( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet(
bufferPolys, 0, segcountLowQuality, correctionFactor );
break;
default:
break;
}
}
// bufferPolys contains polygons to merge. Many overlaps .
// Calculate merged polygons
if( bufferPolys.IsEmpty() )
continue;
// Use Clipper lib to subtract holes to copper areas
if( currLayerHoles.OutlineCount() )
{
currLayerHoles.Append(allLayerHoles);
currLayerHoles.Simplify();
bufferPolys.BooleanSubtract( currLayerHoles );
}
else
bufferPolys.BooleanSubtract( allLayerHoles );
int thickness = GetPrm3DVisu().GetLayerObjectThicknessBIU( layer );
int zpos = GetPrm3DVisu().GetLayerZcoordBIU( layer );
float zNormal = 1.0f; // When using thickness it will draw first the top and then botton (with z inverted)
// If we are not using thickness, then the z-normal has to match the layer direction
// because just one plane will be drawn
if( !thickness )
zNormal = Get3DLayer_Z_Orientation( layer );
if( realistic_mode )
{
setGLCopperColor();
}
else
{
EDA_COLOR_T color = g_ColorsSettings.GetLayerColor( layer );
SetGLColor( color );
}
// If holes are removed from copper zones, bufferPolys contains all polygons
// to draw (tracks+zones+texts).
Draw3D_SolidHorizontalPolyPolygons( bufferPolys, zpos, thickness,
GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
zNormal );
// If holes are not removed from copper zones (for calculation time reasons,
// the zone polygons are stored in bufferZonesPolys and have to be drawn now:
if( !bufferZonesPolys.IsEmpty() )
{
Draw3D_SolidHorizontalPolyPolygons( bufferZonesPolys, zpos, thickness,
GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
zNormal );
}
}
if( aActivity )
aActivity->Report( _( "Build board body" ) );
// Draw plated vertical holes inside the board, but not always. They are drawn:
// - if the board body is not shown, to show the holes.
// - or if the copper thickness is shown
if( !isEnabled( FL_SHOW_BOARD_BODY ) || isEnabled( FL_USE_COPPER_THICKNESS ) )
{
// Draw vias holes (vertical cylinders)
for( const TRACK* track = pcb->m_Track; track; track = track->Next() )
{
if( track->Type() == PCB_VIA_T )
{
const VIA *via = static_cast<const VIA*>(track);
draw3DViaHole( via );
}
}
// Draw pads holes (vertical cylinders)
for( const MODULE* module = pcb->m_Modules; module; module = module->Next() )
{
for( D_PAD* pad = module->Pads(); pad; pad = pad->Next() )
if( pad->GetAttribute () != PAD_HOLE_NOT_PLATED )
draw3DPadHole( pad );
}
}
glEndList();
// Build the body board:
glNewList( aBodyOnlyList, GL_COMPILE );
if( isRealisticMode() )
{
setGLEpoxyColor( 1.00 );
}
else
{
EDA_COLOR_T color = g_ColorsSettings.GetLayerColor( Edge_Cuts );
SetGLColor( color, 0.7 );
}
float copper_thickness = GetPrm3DVisu().GetCopperThicknessBIU();
// a small offset between substrate and external copper layer to avoid artifacts
// when drawing copper items on board
float epsilon = Millimeter2iu( 0.01 );
float zpos = GetPrm3DVisu().GetLayerZcoordBIU( B_Cu );
float board_thickness = GetPrm3DVisu().GetLayerZcoordBIU( F_Cu )
- GetPrm3DVisu().GetLayerZcoordBIU( B_Cu );
// items on copper layers and having a thickness = copper_thickness
// are drawn from zpos - copper_thickness/2 to zpos + copper_thickness
// therefore substrate position is copper_thickness/2 to
// substrate_height - copper_thickness/2
zpos += (copper_thickness + epsilon) / 2.0f;
board_thickness -= copper_thickness + epsilon;
bufferPcbOutlines.BooleanSubtract( allLayerHoles );
if( !bufferPcbOutlines.IsEmpty() )
{
Draw3D_SolidHorizontalPolyPolygons( bufferPcbOutlines, zpos + board_thickness / 2.0,
board_thickness, GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
1.0f );
}
glEndList();
}
void BOARD_ITEM::SwapData( BOARD_ITEM* aImage )
{
if( aImage == NULL )
{
return;
}
EDA_ITEM * pnext = Next();
EDA_ITEM * pback = Back();
switch( Type() )
{
case PCB_MODULE_T:
{
MODULE* tmp = (MODULE*) aImage->Clone();
( (MODULE*) aImage )->Copy( (MODULE*) this );
( (MODULE*) this )->Copy( tmp );
delete tmp;
}
break;
case PCB_ZONE_AREA_T:
{
ZONE_CONTAINER* tmp = (ZONE_CONTAINER*) aImage->Clone();
( (ZONE_CONTAINER*) aImage )->Copy( (ZONE_CONTAINER*) this );
( (ZONE_CONTAINER*) this )->Copy( tmp );
delete tmp;
}
break;
case PCB_LINE_T:
std::swap( *((DRAWSEGMENT*)this), *((DRAWSEGMENT*)aImage) );
break;
case PCB_TRACE_T:
case PCB_VIA_T:
{
TRACK* track = (TRACK*) this;
TRACK* image = (TRACK*) aImage;
EXCHG(track->m_Layer, image->m_Layer );
// swap start, end, width and shape for track and image.
wxPoint exchp = track->GetStart();
track->SetStart( image->GetStart() );
image->SetStart( exchp );
exchp = track->GetEnd();
track->SetEnd( image->GetEnd() );
image->SetEnd( exchp );
int atmp = track->GetWidth();
track->SetWidth( image->GetWidth() );
image->SetWidth( atmp );
if( Type() == PCB_VIA_T )
{
VIA *via = static_cast<VIA*>( this );
VIA *viaimage = static_cast<VIA*>( aImage );
VIATYPE_T viatmp = via->GetViaType();
via->SetViaType( viaimage->GetViaType() );
viaimage->SetViaType( viatmp );
int drilltmp = via->GetDrillValue();
if( via->IsDrillDefault() )
drilltmp = -1;
int itmp = viaimage->GetDrillValue();
if( viaimage->IsDrillDefault() )
itmp = -1;
EXCHG(itmp, drilltmp );
if( drilltmp > 0 )
via->SetDrill( drilltmp );
else
via->SetDrillDefault();
if( itmp > 0 )
viaimage->SetDrill( itmp );
else
viaimage->SetDrillDefault();
}
}
break;
case PCB_TEXT_T:
std::swap( *((TEXTE_PCB*)this), *((TEXTE_PCB*)aImage) );
break;
case PCB_TARGET_T:
std::swap( *((PCB_TARGET*)this), *((PCB_TARGET*)aImage) );
break;
case PCB_DIMENSION_T:
std::swap( *((DIMENSION*)this), *((DIMENSION*)aImage) );
break;
case PCB_ZONE_T:
default:
wxLogMessage( wxT( "SwapData() error: unexpected type %d" ), Type() );
break;
}
if( pnext != Next() || pback != Back() )
{
Pnext = pnext;
Pback = pback;
#ifdef DEBUG
wxLogMessage( wxT( "SwapData Error: %s Pnext or Pback pointers modified" ),
GetClass().GetData() );
#endif
}
}
void BOARD_ITEM::SwapData( BOARD_ITEM* aImage )
{
if( aImage == NULL )
return;
// Remark: to create images of edited items to undo, we are using Clone method
// which can duplication of items foe copy, but does not clone all members
// mainly pointers in chain and time stamp, which is set to new, unique value.
// So we have to use the current values of these parameters.
EDA_ITEM * pnext = Next();
EDA_ITEM * pback = Back();
DHEAD* mylist = m_List;
time_t timestamp = GetTimeStamp();
switch( Type() )
{
case PCB_MODULE_T:
{
MODULE* tmp = (MODULE*) aImage->Clone();
( (MODULE*) aImage )->Copy( (MODULE*) this );
( (MODULE*) this )->Copy( tmp );
delete tmp;
}
break;
case PCB_ZONE_AREA_T:
{
ZONE_CONTAINER* tmp = (ZONE_CONTAINER*) aImage->Clone();
( (ZONE_CONTAINER*) aImage )->Copy( (ZONE_CONTAINER*) this );
( (ZONE_CONTAINER*) this )->Copy( tmp );
delete tmp;
}
break;
case PCB_LINE_T:
std::swap( *((DRAWSEGMENT*)this), *((DRAWSEGMENT*)aImage) );
break;
case PCB_TRACE_T:
case PCB_VIA_T:
{
TRACK* track = (TRACK*) this;
TRACK* image = (TRACK*) aImage;
std::swap(track->m_Layer, image->m_Layer );
// swap start, end, width and shape for track and image.
wxPoint exchp = track->GetStart();
track->SetStart( image->GetStart() );
image->SetStart( exchp );
exchp = track->GetEnd();
track->SetEnd( image->GetEnd() );
image->SetEnd( exchp );
int atmp = track->GetWidth();
track->SetWidth( image->GetWidth() );
image->SetWidth( atmp );
if( Type() == PCB_VIA_T )
{
VIA *via = static_cast<VIA*>( this );
VIA *viaimage = static_cast<VIA*>( aImage );
VIATYPE_T viatmp = via->GetViaType();
via->SetViaType( viaimage->GetViaType() );
viaimage->SetViaType( viatmp );
int drilltmp = via->GetDrillValue();
if( via->IsDrillDefault() )
drilltmp = -1;
int itmp = viaimage->GetDrillValue();
if( viaimage->IsDrillDefault() )
itmp = -1;
std::swap(itmp, drilltmp );
if( drilltmp > 0 )
via->SetDrill( drilltmp );
else
via->SetDrillDefault();
if( itmp > 0 )
viaimage->SetDrill( itmp );
else
viaimage->SetDrillDefault();
}
}
break;
case PCB_TEXT_T:
std::swap( *((TEXTE_PCB*)this), *((TEXTE_PCB*)aImage) );
break;
case PCB_TARGET_T:
std::swap( *((PCB_TARGET*)this), *((PCB_TARGET*)aImage) );
break;
case PCB_DIMENSION_T:
std::swap( *((DIMENSION*)this), *((DIMENSION*)aImage) );
break;
case PCB_ZONE_T:
default:
wxLogMessage( wxT( "SwapData() error: unexpected type %d" ), Type() );
break;
}
// Restore pointers and time stamp, to be sure they are not broken
Pnext = pnext;
Pback = pback;
m_List = mylist;
SetTimeStamp( timestamp );
}
// Emit PADS and PADSTACKS. They are sorted and emitted uniquely.
// Via name is synthesized from their attributes, pads are numbered
static void CreatePadsShapesSection( FILE* aFile, BOARD* aPcb )
{
std::vector<D_PAD*> pads;
std::vector<D_PAD*> padstacks;
std::vector<VIA*> vias;
std::vector<VIA*> viastacks;
padstacks.resize( 1 ); // We count pads from 1
// The master layermask (i.e. the enabled layers) for padstack generation
LSET master_layermask = aPcb->GetDesignSettings().GetEnabledLayers();
int cu_count = aPcb->GetCopperLayerCount();
fputs( "$PADS\n", aFile );
// Enumerate and sort the pads
if( aPcb->GetPadCount() > 0 )
{
pads = aPcb->GetPads();
qsort( &pads[0], aPcb->GetPadCount(), sizeof( D_PAD* ),
PadListSortByShape );
}
// The same for vias
for( VIA* via = GetFirstVia( aPcb->m_Track ); via;
via = GetFirstVia( via->Next() ) )
{
vias.push_back( via );
}
qsort( &vias[0], vias.size(), sizeof(VIA*), ViaSort );
// Emit vias pads
TRACK* old_via = 0;
for( unsigned i = 0; i < vias.size(); i++ )
{
VIA* via = vias[i];
if( old_via && 0 == ViaSort( &old_via, &via ) )
continue;
old_via = via;
viastacks.push_back( via );
fprintf( aFile, "PAD V%d.%d.%s ROUND %g\nCIRCLE 0 0 %g\n",
via->GetWidth(), via->GetDrillValue(),
fmt_mask( via->GetLayerSet() ).c_str(),
via->GetDrillValue() / SCALE_FACTOR,
via->GetWidth() / (SCALE_FACTOR * 2) );
}
// Emit component pads
D_PAD* old_pad = 0;
int pad_name_number = 0;
for( unsigned i = 0; i<pads.size(); ++i )
{
D_PAD* pad = pads[i];
pad->SetSubRatsnest( pad_name_number );
if( old_pad && 0==D_PAD::Compare( old_pad, pad ) )
continue; // already created
old_pad = pad;
pad_name_number++;
pad->SetSubRatsnest( pad_name_number );
fprintf( aFile, "PAD P%d", pad->GetSubRatsnest() );
padstacks.push_back( pad ); // Will have its own padstack later
int dx = pad->GetSize().x / 2;
int dy = pad->GetSize().y / 2;
switch( pad->GetShape() )
{
default:
case PAD_SHAPE_CIRCLE:
fprintf( aFile, " ROUND %g\n",
pad->GetDrillSize().x / SCALE_FACTOR );
/* Circle is center, radius */
fprintf( aFile, "CIRCLE %g %g %g\n",
pad->GetOffset().x / SCALE_FACTOR,
-pad->GetOffset().y / SCALE_FACTOR,
pad->GetSize().x / (SCALE_FACTOR * 2) );
break;
case PAD_SHAPE_RECT:
fprintf( aFile, " RECTANGULAR %g\n",
pad->GetDrillSize().x / SCALE_FACTOR );
// Rectangle is begin, size *not* begin, end!
fprintf( aFile, "RECTANGLE %g %g %g %g\n",
(-dx + pad->GetOffset().x ) / SCALE_FACTOR,
(-dy - pad->GetOffset().y ) / SCALE_FACTOR,
dx / (SCALE_FACTOR / 2), dy / (SCALE_FACTOR / 2) );
break;
case PAD_SHAPE_OVAL: // Create outline by 2 lines and 2 arcs
{
// OrCAD Layout call them OVAL or OBLONG - GenCAD call them FINGERs
fprintf( aFile, " FINGER %g\n",
pad->GetDrillSize().x / SCALE_FACTOR );
int dr = dx - dy;
if( dr >= 0 ) // Horizontal oval
{
int radius = dy;
fprintf( aFile, "LINE %g %g %g %g\n",
(-dr + pad->GetOffset().x) / SCALE_FACTOR,
(-pad->GetOffset().y - radius) / SCALE_FACTOR,
(dr + pad->GetOffset().x ) / SCALE_FACTOR,
(-pad->GetOffset().y - radius) / SCALE_FACTOR );
// GenCAD arcs are (start, end, center)
fprintf( aFile, "ARC %g %g %g %g %g %g\n",
(dr + pad->GetOffset().x) / SCALE_FACTOR,
(-pad->GetOffset().y - radius) / SCALE_FACTOR,
(dr + pad->GetOffset().x) / SCALE_FACTOR,
(-pad->GetOffset().y + radius) / SCALE_FACTOR,
(dr + pad->GetOffset().x) / SCALE_FACTOR,
-pad->GetOffset().y / SCALE_FACTOR );
fprintf( aFile, "LINE %g %g %g %g\n",
(dr + pad->GetOffset().x) / SCALE_FACTOR,
(-pad->GetOffset().y + radius) / SCALE_FACTOR,
(-dr + pad->GetOffset().x) / SCALE_FACTOR,
(-pad->GetOffset().y + radius) / SCALE_FACTOR );
fprintf( aFile, "ARC %g %g %g %g %g %g\n",
(-dr + pad->GetOffset().x) / SCALE_FACTOR,
(-pad->GetOffset().y + radius) / SCALE_FACTOR,
(-dr + pad->GetOffset().x) / SCALE_FACTOR,
(-pad->GetOffset().y - radius) / SCALE_FACTOR,
(-dr + pad->GetOffset().x) / SCALE_FACTOR,
-pad->GetOffset().y / SCALE_FACTOR );
}
else // Vertical oval
{
dr = -dr;
int radius = dx;
fprintf( aFile, "LINE %g %g %g %g\n",
(-radius + pad->GetOffset().x) / SCALE_FACTOR,
(-pad->GetOffset().y - dr) / SCALE_FACTOR,
(-radius + pad->GetOffset().x ) / SCALE_FACTOR,
(-pad->GetOffset().y + dr) / SCALE_FACTOR );
fprintf( aFile, "ARC %g %g %g %g %g %g\n",
(-radius + pad->GetOffset().x ) / SCALE_FACTOR,
(-pad->GetOffset().y + dr) / SCALE_FACTOR,
(radius + pad->GetOffset().x ) / SCALE_FACTOR,
(-pad->GetOffset().y + dr) / SCALE_FACTOR,
pad->GetOffset().x / SCALE_FACTOR,
(-pad->GetOffset().y + dr) / SCALE_FACTOR );
fprintf( aFile, "LINE %g %g %g %g\n",
(radius + pad->GetOffset().x) / SCALE_FACTOR,
(-pad->GetOffset().y + dr) / SCALE_FACTOR,
(radius + pad->GetOffset().x) / SCALE_FACTOR,
(-pad->GetOffset().y - dr) / SCALE_FACTOR );
fprintf( aFile, "ARC %g %g %g %g %g %g\n",
(radius + pad->GetOffset().x) / SCALE_FACTOR,
(-pad->GetOffset().y - dr) / SCALE_FACTOR,
(-radius + pad->GetOffset().x) / SCALE_FACTOR,
(-pad->GetOffset().y - dr) / SCALE_FACTOR,
pad->GetOffset().x / SCALE_FACTOR,
(-pad->GetOffset().y - dr) / SCALE_FACTOR );
}
}
break;
case PAD_SHAPE_TRAPEZOID:
fprintf( aFile, " POLYGON %g\n",
pad->GetDrillSize().x / SCALE_FACTOR );
// XXX TO BE IMPLEMENTED! and I don't know if it could be actually imported by something
break;
}
}
fputs( "\n$ENDPADS\n\n", aFile );
// Now emit the padstacks definitions, using the combined layer masks
fputs( "$PADSTACKS\n", aFile );
// Via padstacks
for( unsigned i = 0; i < viastacks.size(); i++ )
{
VIA* via = viastacks[i];
LSET mask = via->GetLayerSet() & master_layermask;
fprintf( aFile, "PADSTACK VIA%d.%d.%s %g\n",
via->GetWidth(), via->GetDrillValue(),
fmt_mask( mask ).c_str(),
via->GetDrillValue() / SCALE_FACTOR );
for( LSEQ seq = mask.Seq( gc_seq, DIM( gc_seq ) ); seq; ++seq )
{
LAYER_ID layer = *seq;
fprintf( aFile, "PAD V%d.%d.%s %s 0 0\n",
via->GetWidth(), via->GetDrillValue(),
fmt_mask( mask ).c_str(),
GenCADLayerName( cu_count, layer ).c_str()
);
}
}
/* Component padstacks
* CAM350 don't apply correctly the FLIP semantics for padstacks, i.e. doesn't
* swap the top and bottom layers... so I need to define the shape as MIRRORX
* and define a separate 'flipped' padstack... until it appears yet another
* noncompliant importer */
for( unsigned i = 1; i < padstacks.size(); i++ )
{
D_PAD* pad = padstacks[i];
// Straight padstack
fprintf( aFile, "PADSTACK PAD%u %g\n", i, pad->GetDrillSize().x / SCALE_FACTOR );
LSET pad_set = pad->GetLayerSet() & master_layermask;
// the special gc_seq
for( LSEQ seq = pad_set.Seq( gc_seq, DIM( gc_seq ) ); seq; ++seq )
{
LAYER_ID layer = *seq;
fprintf( aFile, "PAD P%u %s 0 0\n", i, GenCADLayerName( cu_count, layer ).c_str() );
}
// Flipped padstack
fprintf( aFile, "PADSTACK PAD%uF %g\n", i, pad->GetDrillSize().x / SCALE_FACTOR );
// the normal LAYER_ID sequence is inverted from gc_seq[]
for( LSEQ seq = pad_set.Seq(); seq; ++seq )
{
LAYER_ID layer = *seq;
fprintf( aFile, "PAD P%u %s 0 0\n", i, GenCADLayerNameFlipped( cu_count, layer ).c_str() );
}
}
fputs( "$ENDPADSTACKS\n\n", aFile );
}
