// Draw 3D pads.
void EDA_3D_CANVAS::draw3DPadHole( const D_PAD* aPad )
{
// Draw the pad hole
wxSize drillsize = aPad->GetDrillSize();
bool hasHole = drillsize.x && drillsize.y;
if( !hasHole )
return;
// Store here the points to approximate hole by segments
SHAPE_POLY_SET holecornersBuffer;
int thickness = GetPrm3DVisu().GetCopperThicknessBIU();
int height = GetPrm3DVisu().GetLayerZcoordBIU( F_Cu ) -
GetPrm3DVisu().GetLayerZcoordBIU( B_Cu );
if( isRealisticMode() )
setGLCopperColor();
else
SetGLColor( DARKGRAY );
int holeZpoz = GetPrm3DVisu().GetLayerZcoordBIU( B_Cu ) - thickness / 2;
int holeHeight = height + thickness;
if( drillsize.x == drillsize.y ) // usual round hole
{
int hole_radius = ( drillsize.x + thickness ) / 2;
Draw3D_ZaxisCylinder( aPad->GetPosition(),
hole_radius, holeHeight,
thickness, holeZpoz, GetPrm3DVisu().m_BiuTo3Dunits );
}
else // Oblong hole
{
wxPoint ends_offset;
int width;
if( drillsize.x > drillsize.y ) // Horizontal oval
{
ends_offset.x = ( drillsize.x - drillsize.y ) / 2;
width = drillsize.y;
}
else // Vertical oval
{
ends_offset.y = ( drillsize.y - drillsize.x ) / 2;
width = drillsize.x;
}
RotatePoint( &ends_offset, aPad->GetOrientation() );
wxPoint start = aPad->GetPosition() + ends_offset;
wxPoint end = aPad->GetPosition() - ends_offset;
int hole_radius = ( width + thickness ) / 2;
// Draw the hole
Draw3D_ZaxisOblongCylinder( start, end, hole_radius, holeHeight,
thickness, holeZpoz, GetPrm3DVisu().m_BiuTo3Dunits );
}
}
void EDA_3D_CANVAS::draw3DViaHole( const VIA* aVia )
{
LAYER_ID top_layer, bottom_layer;
int thickness = GetPrm3DVisu().GetCopperThicknessBIU();
int inner_radius = (int)((float)aVia->GetDrillValue() * 1.01f) / 2.0f; // This add a bit more in order to correct a draw artifact while using thickness
aVia->LayerPair( &top_layer, &bottom_layer );
// Drawing via hole:
if( isRealisticMode() )
setGLCopperColor();
else
{
EDA_COLOR_T color = g_ColorsSettings.GetItemColor( VIAS_VISIBLE + aVia->GetViaType() );
SetGLColor( color );
}
int height = GetPrm3DVisu().GetLayerZcoordBIU( top_layer ) -
GetPrm3DVisu().GetLayerZcoordBIU( bottom_layer ) + thickness;
int zpos = GetPrm3DVisu().GetLayerZcoordBIU( bottom_layer ) - thickness / 2;
Draw3D_ZaxisCylinder( aVia->GetStart(), inner_radius, height,
thickness, zpos, GetPrm3DVisu().m_BiuTo3Dunits );
}
void EDA_3D_CANVAS::Draw3DViaHole( const VIA* aVia )
{
LAYER_ID top_layer, bottom_layer;
int inner_radius = aVia->GetDrillValue() / 2;
int thickness = GetPrm3DVisu().GetCopperThicknessBIU();
aVia->LayerPair( &top_layer, &bottom_layer );
// Drawing via hole:
if( isRealisticMode() )
setGLCopperColor();
else
{
EDA_COLOR_T color = g_ColorsSettings.GetItemColor( VIAS_VISIBLE + aVia->GetViaType() );
SetGLColor( color );
}
int height = GetPrm3DVisu().GetLayerZcoordBIU( top_layer ) -
GetPrm3DVisu().GetLayerZcoordBIU( bottom_layer ) - thickness;
int zpos = GetPrm3DVisu().GetLayerZcoordBIU( bottom_layer ) + thickness / 2;
Draw3D_ZaxisCylinder( aVia->GetStart(), inner_radius + thickness / 2, height,
thickness, zpos, GetPrm3DVisu().m_BiuTo3Dunits );
}
void EDA_3D_CANVAS::buildBoard3DView( GLuint aBoardList, GLuint aBodyOnlyList,
REPORTER* aErrorMessages, REPORTER* aActivity )
{
BOARD* pcb = GetBoard();
// If FL_RENDER_SHOW_HOLES_IN_ZONES is true, holes are correctly removed from copper zones areas.
// If FL_RENDER_SHOW_HOLES_IN_ZONES is false, holes are not removed from copper zones areas,
// but the calculation time is twice shorter.
bool remove_Holes = isEnabled( FL_RENDER_SHOW_HOLES_IN_ZONES );
bool realistic_mode = isRealisticMode();
bool useTextures = isRealisticMode() && isEnabled( FL_RENDER_TEXTURES );
// Number of segments to convert a circle to polygon
// We use 2 values: the first gives a good shape (for instanes rond pads)
// the second is used to speed up calculations, when a poor approximation is acceptable (holes)
const int segcountforcircle = 18;
double correctionFactor = 1.0 / cos( M_PI / (segcountforcircle * 2.0) );
const int segcountLowQuality = 12; // segments to draw a circle with low quality
// to reduce time calculations
// for holes and items which do not need
// a fine representation
double correctionFactorLQ = 1.0 / cos( M_PI / (segcountLowQuality * 2.0) );
SHAPE_POLY_SET bufferPolys; // copper areas: tracks, pads and filled zones areas
// when holes are removed from zones
SHAPE_POLY_SET bufferPcbOutlines; // stores the board main outlines
SHAPE_POLY_SET bufferZonesPolys; // copper filled zones areas
// when holes are not removed from zones
SHAPE_POLY_SET currLayerHoles; // Contains holes for the current layer
SHAPE_POLY_SET allLayerHoles; // Contains holes for all layers
// Build a polygon from edge cut items
wxString msg;
if( !pcb->GetBoardPolygonOutlines( bufferPcbOutlines, allLayerHoles, &msg ) )
{
if( aErrorMessages )
{
msg << wxT("\n") << _("Unable to calculate the board outlines.\n"
"Therefore use the board boundary box.") << wxT("\n\n");
aErrorMessages->Report( msg, REPORTER::RPT_WARNING );
}
}
// Build board holes, with optimization of large holes shape.
buildBoardThroughHolesPolygonList( allLayerHoles, segcountLowQuality, true );
LSET cu_set = LSET::AllCuMask( GetPrm3DVisu().m_CopperLayersCount );
glNewList( aBoardList, GL_COMPILE );
for( LSEQ cu = cu_set.CuStack(); cu; ++cu )
{
LAYER_ID layer = *cu;
// Skip non enabled layers in normal mode,
// and internal layers in realistic mode
if( !is3DLayerEnabled( layer ) )
continue;
if( aActivity )
aActivity->Report( wxString::Format( _( "Build layer %s" ), LSET::Name( layer ) ) );
bufferPolys.RemoveAllContours();
bufferZonesPolys.RemoveAllContours();
currLayerHoles.RemoveAllContours();
// Draw track shapes:
for( TRACK* track = pcb->m_Track; track; track = track->Next() )
{
if( !track->IsOnLayer( layer ) )
continue;
track->TransformShapeWithClearanceToPolygon( bufferPolys,
0, segcountforcircle,
correctionFactor );
// Add blind/buried via holes
if( track->Type() == PCB_VIA_T )
{
VIA *via = static_cast<VIA*>( track );
if( via->GetViaType() == VIA_THROUGH )
continue; // already done
int holediameter = via->GetDrillValue();
int thickness = GetPrm3DVisu().GetCopperThicknessBIU();
int hole_outer_radius = (holediameter + thickness) / 2;
TransformCircleToPolygon( currLayerHoles,
via->GetStart(), hole_outer_radius,
segcountLowQuality );
}
}
// draw pad shapes
for( MODULE* module = pcb->m_Modules; module; module = module->Next() )
{
// Note: NPTH pads are not drawn on copper layers when the pad
// has same shape as its hole
module->TransformPadsShapesWithClearanceToPolygon( layer,
bufferPolys,
0,
segcountforcircle,
correctionFactor, true );
// Micro-wave modules may have items on copper layers
module->TransformGraphicShapesWithClearanceToPolygonSet( layer,
bufferPolys,
0,
segcountforcircle,
correctionFactor );
// pad holes are already in list.
}
// Draw copper zones. Note:
// * if the holes are removed from copper zones
// the polygons are stored in bufferPolys (which contains all other polygons)
// * if the holes are NOT removed from copper zones
// the polygons are stored in bufferZonesPolys
if( isEnabled( FL_ZONE ) )
{
for( int ii = 0; ii < pcb->GetAreaCount(); ii++ )
{
ZONE_CONTAINER* zone = pcb->GetArea( ii );
LAYER_NUM zonelayer = zone->GetLayer();
if( zonelayer == layer )
{
zone->TransformSolidAreasShapesToPolygonSet(
remove_Holes ? bufferPolys : bufferZonesPolys,
segcountLowQuality, correctionFactorLQ );
}
}
}
// draw graphic items on copper layers (texts)
for( BOARD_ITEM* item = pcb->m_Drawings; item; item = item->Next() )
{
if( !item->IsOnLayer( layer ) )
continue;
switch( item->Type() )
{
case PCB_LINE_T: // should not exist on copper layers
( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon(
bufferPolys, 0, segcountforcircle, correctionFactor );
break;
case PCB_TEXT_T:
( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet(
bufferPolys, 0, segcountLowQuality, correctionFactor );
break;
default:
break;
}
}
// bufferPolys contains polygons to merge. Many overlaps .
// Calculate merged polygons
if( bufferPolys.IsEmpty() )
continue;
// Use Clipper lib to subtract holes to copper areas
if( currLayerHoles.OutlineCount() )
{
currLayerHoles.Append(allLayerHoles);
currLayerHoles.Simplify();
bufferPolys.BooleanSubtract( currLayerHoles );
}
else
bufferPolys.BooleanSubtract( allLayerHoles );
int thickness = GetPrm3DVisu().GetLayerObjectThicknessBIU( layer );
int zpos = GetPrm3DVisu().GetLayerZcoordBIU( layer );
float zNormal = 1.0f; // When using thickness it will draw first the top and then botton (with z inverted)
// If we are not using thickness, then the z-normal has to match the layer direction
// because just one plane will be drawn
if( !thickness )
zNormal = Get3DLayer_Z_Orientation( layer );
if( realistic_mode )
{
setGLCopperColor();
}
else
{
EDA_COLOR_T color = g_ColorsSettings.GetLayerColor( layer );
SetGLColor( color );
}
// If holes are removed from copper zones, bufferPolys contains all polygons
// to draw (tracks+zones+texts).
Draw3D_SolidHorizontalPolyPolygons( bufferPolys, zpos, thickness,
GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
zNormal );
// If holes are not removed from copper zones (for calculation time reasons,
// the zone polygons are stored in bufferZonesPolys and have to be drawn now:
if( !bufferZonesPolys.IsEmpty() )
{
Draw3D_SolidHorizontalPolyPolygons( bufferZonesPolys, zpos, thickness,
GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
zNormal );
}
}
if( aActivity )
aActivity->Report( _( "Build board body" ) );
// Draw plated vertical holes inside the board, but not always. They are drawn:
// - if the board body is not shown, to show the holes.
// - or if the copper thickness is shown
if( !isEnabled( FL_SHOW_BOARD_BODY ) || isEnabled( FL_USE_COPPER_THICKNESS ) )
{
// Draw vias holes (vertical cylinders)
for( const TRACK* track = pcb->m_Track; track; track = track->Next() )
{
if( track->Type() == PCB_VIA_T )
{
const VIA *via = static_cast<const VIA*>(track);
draw3DViaHole( via );
}
}
// Draw pads holes (vertical cylinders)
for( const MODULE* module = pcb->m_Modules; module; module = module->Next() )
{
for( D_PAD* pad = module->Pads(); pad; pad = pad->Next() )
if( pad->GetAttribute () != PAD_HOLE_NOT_PLATED )
draw3DPadHole( pad );
}
}
glEndList();
// Build the body board:
glNewList( aBodyOnlyList, GL_COMPILE );
if( isRealisticMode() )
{
setGLEpoxyColor( 1.00 );
}
else
{
EDA_COLOR_T color = g_ColorsSettings.GetLayerColor( Edge_Cuts );
SetGLColor( color, 0.7 );
}
float copper_thickness = GetPrm3DVisu().GetCopperThicknessBIU();
// a small offset between substrate and external copper layer to avoid artifacts
// when drawing copper items on board
float epsilon = Millimeter2iu( 0.01 );
float zpos = GetPrm3DVisu().GetLayerZcoordBIU( B_Cu );
float board_thickness = GetPrm3DVisu().GetLayerZcoordBIU( F_Cu )
- GetPrm3DVisu().GetLayerZcoordBIU( B_Cu );
// items on copper layers and having a thickness = copper_thickness
// are drawn from zpos - copper_thickness/2 to zpos + copper_thickness
// therefore substrate position is copper_thickness/2 to
// substrate_height - copper_thickness/2
zpos += (copper_thickness + epsilon) / 2.0f;
board_thickness -= copper_thickness + epsilon;
bufferPcbOutlines.BooleanSubtract( allLayerHoles );
if( !bufferPcbOutlines.IsEmpty() )
{
Draw3D_SolidHorizontalPolyPolygons( bufferPcbOutlines, zpos + board_thickness / 2.0,
board_thickness, GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
1.0f );
}
glEndList();
}
