void MODULE::TransformPadsShapesWithClearanceToPolygon( PCB_LAYER_ID aLayer,
SHAPE_POLY_SET& aCornerBuffer, int aInflateValue, int aMaxError,
bool aSkipNPTHPadsWihNoCopper ) const
{
D_PAD* pad = PadsList();
wxSize margin;
for( ; pad != NULL; pad = pad->Next() )
{
if( aLayer != UNDEFINED_LAYER && !pad->IsOnLayer(aLayer) )
continue;
// NPTH pads are not drawn on layers if the shape size and pos is the same
// as their hole:
if( aSkipNPTHPadsWihNoCopper && pad->GetAttribute() == PAD_ATTRIB_HOLE_NOT_PLATED )
{
if( pad->GetDrillSize() == pad->GetSize() && pad->GetOffset() == wxPoint( 0, 0 ) )
{
switch( pad->GetShape() )
{
case PAD_SHAPE_CIRCLE:
if( pad->GetDrillShape() == PAD_DRILL_SHAPE_CIRCLE )
continue;
break;
case PAD_SHAPE_OVAL:
if( pad->GetDrillShape() != PAD_DRILL_SHAPE_CIRCLE )
continue;
break;
default:
break;
}
}
}
switch( aLayer )
{
case F_Mask:
case B_Mask:
margin.x = margin.y = pad->GetSolderMaskMargin() + aInflateValue;
break;
case F_Paste:
case B_Paste:
margin = pad->GetSolderPasteMargin();
margin.x += aInflateValue;
margin.y += aInflateValue;
break;
default:
margin.x = margin.y = aInflateValue;
break;
}
pad->BuildPadShapePolygon( aCornerBuffer, margin );
}
}
/* generate pads shapes on layer aLayer as polygons,
* and adds these polygons to aCornerBuffer
* aCornerBuffer = the buffer to store polygons
* aInflateValue = an additionnal size to add to pad shapes
* aCircleToSegmentsCount = number of segments to approximate a circle
* aCorrectionFactor = the correction to apply to a circle radius
* to generate the polygon.
* if aCorrectionFactor = 1.0, the polygon is inside the circle
* the radius of circle approximated by segments is
* initial radius * aCorrectionFactor
*/
void MODULE::TransformPadsShapesWithClearanceToPolygon( LAYER_NUM aLayer,
CPOLYGONS_LIST& aCornerBuffer,
int aInflateValue,
int aCircleToSegmentsCount,
double aCorrectionFactor )
{
D_PAD* pad = Pads();
wxSize margin;
for( ; pad != NULL; pad = pad->Next() )
{
if( !pad->IsOnLayer(aLayer) )
continue;
switch( aLayer )
{
case SOLDERMASK_N_FRONT:
case SOLDERMASK_N_BACK:
margin.x = margin.y = pad->GetSolderMaskMargin() + aInflateValue;
break;
case SOLDERPASTE_N_FRONT:
case SOLDERPASTE_N_BACK:
margin = pad->GetSolderPasteMargin();
margin.x += aInflateValue;
margin.y += aInflateValue;
break;
default:
margin.x = margin.y = aInflateValue;
break;
}
pad->BuildPadShapePolygon( aCornerBuffer, margin,
aCircleToSegmentsCount, aCorrectionFactor );
}
}
/* Plot a copper layer or mask.
* Silk screen layers are not plotted here.
*/
void PlotStandardLayer( BOARD *aBoard, PLOTTER* aPlotter,
LAYER_MSK aLayerMask, const PCB_PLOT_PARAMS& aPlotOpt )
{
BRDITEMS_PLOTTER itemplotter( aPlotter, aBoard, aPlotOpt );
itemplotter.SetLayerMask( aLayerMask );
EDA_DRAW_MODE_T plotMode = aPlotOpt.GetMode();
// Plot edge layer and graphic items
itemplotter.PlotBoardGraphicItems();
// Draw footprint shapes without pads (pads will plotted later)
// We plot here module texts, but they are usually on silkscreen layer,
// so they are not plot here but plot by PlotSilkScreen()
// Plot footprints fields (ref, value ...)
for( MODULE* module = aBoard->m_Modules; module; module = module->Next() )
{
if( ! itemplotter.PlotAllTextsModule( module ) )
{
wxLogMessage( _( "Your BOARD has a bad layer number for module %s" ),
GetChars( module->GetReference() ) );
}
}
for( MODULE* module = aBoard->m_Modules; module; module = module->Next() )
{
for( BOARD_ITEM* item = module->GraphicalItems(); item; item = item->Next() )
{
if( ! (aLayerMask & GetLayerMask( item->GetLayer() ) ) )
continue;
switch( item->Type() )
{
case PCB_MODULE_EDGE_T:
itemplotter.Plot_1_EdgeModule( (EDGE_MODULE*) item );
break;
default:
break;
}
}
}
// Plot footprint pads
for( MODULE* module = aBoard->m_Modules; module; module = module->Next() )
{
for( D_PAD* pad = module->Pads(); pad; pad = pad->Next() )
{
if( (pad->GetLayerMask() & aLayerMask) == 0 )
continue;
wxSize margin;
double width_adj = 0;
if( aLayerMask & ALL_CU_LAYERS )
width_adj = itemplotter.getFineWidthAdj();
switch( aLayerMask &
( SOLDERMASK_LAYER_BACK | SOLDERMASK_LAYER_FRONT |
SOLDERPASTE_LAYER_BACK | SOLDERPASTE_LAYER_FRONT ) )
{
case SOLDERMASK_LAYER_FRONT:
case SOLDERMASK_LAYER_BACK:
margin.x = margin.y = pad->GetSolderMaskMargin();
break;
case SOLDERPASTE_LAYER_FRONT:
case SOLDERPASTE_LAYER_BACK:
margin = pad->GetSolderPasteMargin();
break;
default:
break;
}
wxSize padPlotsSize;
padPlotsSize.x = pad->GetSize().x + ( 2 * margin.x ) + width_adj;
padPlotsSize.y = pad->GetSize().y + ( 2 * margin.y ) + width_adj;
// Don't draw a null size item :
if( padPlotsSize.x <= 0 || padPlotsSize.y <= 0 )
continue;
EDA_COLOR_T color = BLACK;
if( (pad->GetLayerMask() & LAYER_BACK) )
color = aBoard->GetVisibleElementColor( PAD_BK_VISIBLE );
if((pad->GetLayerMask() & LAYER_FRONT ) )
color = ColorFromInt( color | aBoard->GetVisibleElementColor( PAD_FR_VISIBLE ) );
// Temporary set the pad size to the required plot size:
wxSize tmppadsize = pad->GetSize();
pad->SetSize( padPlotsSize );
switch( pad->GetShape() )
{
case PAD_CIRCLE:
case PAD_OVAL:
if( aPlotOpt.GetSkipPlotNPTH_Pads() &&
(pad->GetSize() == pad->GetDrillSize()) &&
(pad->GetAttribute() == PAD_HOLE_NOT_PLATED) )
break;
// Fall through:
case PAD_TRAPEZOID:
case PAD_RECT:
default:
itemplotter.PlotPad( pad, color, plotMode );
break;
}
pad->SetSize( tmppadsize ); // Restore the pad size
}
}
// Plot vias on copper layers, and if aPlotOpt.GetPlotViaOnMaskLayer() is true,
// plot them on solder mask
for( TRACK* track = aBoard->m_Track; track; track = track->Next() )
{
const VIA* Via = dynamic_cast<const VIA*>( track );
if( !Via )
continue;
// vias are not plotted if not on selected layer, but if layer
// is SOLDERMASK_LAYER_BACK or SOLDERMASK_LAYER_FRONT,vias are drawn,
// only if they are on the corresponding external copper layer
int via_mask_layer = Via->GetLayerMask();
if( aPlotOpt.GetPlotViaOnMaskLayer() )
{
if( via_mask_layer & LAYER_BACK )
via_mask_layer |= SOLDERMASK_LAYER_BACK;
if( via_mask_layer & LAYER_FRONT )
via_mask_layer |= SOLDERMASK_LAYER_FRONT;
}
if( ( via_mask_layer & aLayerMask ) == 0 )
continue;
int via_margin = 0;
double width_adj = 0;
// If the current layer is a solder mask, use the global mask
// clearance for vias
if( ( aLayerMask & ( SOLDERMASK_LAYER_BACK | SOLDERMASK_LAYER_FRONT ) ) )
via_margin = aBoard->GetDesignSettings().m_SolderMaskMargin;
if( aLayerMask & ALL_CU_LAYERS )
width_adj = itemplotter.getFineWidthAdj();
int diameter = Via->GetWidth() + 2 * via_margin + width_adj;
// Don't draw a null size item :
if( diameter <= 0 )
continue;
EDA_COLOR_T color = aBoard->GetVisibleElementColor(VIAS_VISIBLE + Via->GetViaType());
// Set plot color (change WHITE to LIGHTGRAY because
// the white items are not seen on a white paper or screen
aPlotter->SetColor( color != WHITE ? color : LIGHTGRAY);
aPlotter->FlashPadCircle( Via->GetStart(), diameter, plotMode );
}
// Plot tracks (not vias) :
for( TRACK* track = aBoard->m_Track; track; track = track->Next() )
{
if( track->Type() == PCB_VIA_T )
continue;
if( (GetLayerMask( track->GetLayer() ) & aLayerMask) == 0 )
continue;
int width = track->GetWidth() + itemplotter.getFineWidthAdj();
aPlotter->SetColor( itemplotter.getColor( track->GetLayer() ) );
aPlotter->ThickSegment( track->GetStart(), track->GetEnd(), width, plotMode );
}
// Plot zones (outdated, for old boards compatibility):
for( TRACK* track = aBoard->m_Zone; track; track = track->Next() )
{
if( (GetLayerMask( track->GetLayer() ) & aLayerMask) == 0 )
continue;
int width = track->GetWidth() + itemplotter.getFineWidthAdj();
aPlotter->SetColor( itemplotter.getColor( track->GetLayer() ) );
aPlotter->ThickSegment( track->GetStart(), track->GetEnd(), width, plotMode );
}
// Plot filled ares
for( int ii = 0; ii < aBoard->GetAreaCount(); ii++ )
{
ZONE_CONTAINER* zone = aBoard->GetArea( ii );
if( ( GetLayerMask(zone->GetLayer() ) & aLayerMask ) == 0 )
continue;
itemplotter.PlotFilledAreas( zone );
}
// Adding drill marks, if required and if the plotter is able to plot them:
if( aPlotOpt.GetDrillMarksType() != PCB_PLOT_PARAMS::NO_DRILL_SHAPE )
itemplotter.PlotDrillMarks();
}
