bool TRACKS_CLEANER::clean_vias() { bool modified = false; for( VIA* via = GetFirstVia( m_Brd->m_Track ); via != NULL; via = GetFirstVia( via->Next() ) ) { // Correct via m_End defects (if any), should never happen if( via->GetStart() != via->GetEnd() ) { wxFAIL_MSG( wxT( "Via with mismatching ends" ) ); via->SetEnd( via->GetStart() ); } /* Important: these cleanups only do thru hole vias, they don't * (yet) handle high density interconnects */ if( via->GetViaType() != VIA_THROUGH ) { modified |= remove_duplicates_of_via( via ); /* To delete through Via on THT pads at same location * Examine the list of connected pads: * if one through pad is found, the via can be removed */ for( unsigned ii = 0; ii < via->m_PadsConnected.size(); ++ii ) { const D_PAD *pad = via->m_PadsConnected[ii]; const LSET all_cu = LSET::AllCuMask(); if( (pad->GetLayerSet() & all_cu) == all_cu ) { // redundant: delete the via m_Brd->GetRatsnest()->Remove( via ); via->ViewRelease(); via->DeleteStructure(); modified = true; break; } } } } return modified; }
void EXCELLON_WRITER::BuildHolesList( LAYER_PAIR aLayerPair, bool aGenerateNPTH_list ) { HOLE_INFO new_hole; m_holeListBuffer.clear(); m_toolListBuffer.clear(); wxASSERT( aLayerPair.first < aLayerPair.second ); // fix the caller // build hole list for vias if( ! aGenerateNPTH_list ) // vias are always plated ! { for( VIA* via = GetFirstVia( m_pcb->m_Track ); via; via = GetFirstVia( via->Next() ) ) { int hole_sz = via->GetDrillValue(); if( hole_sz == 0 ) // Should not occur. continue; new_hole.m_Tool_Reference = -1; // Flag value for Not initialized new_hole.m_Hole_Orient = 0; new_hole.m_Hole_Diameter = hole_sz; new_hole.m_Hole_NotPlated = false; new_hole.m_Hole_Size.x = new_hole.m_Hole_Size.y = new_hole.m_Hole_Diameter; new_hole.m_Hole_Shape = 0; // hole shape: round new_hole.m_Hole_Pos = via->GetStart(); via->LayerPair( &new_hole.m_Hole_Top_Layer, &new_hole.m_Hole_Bottom_Layer ); // LayerPair() returns params with m_Hole_Bottom_Layer > m_Hole_Top_Layer // Remember: top layer = 0 and bottom layer = 31 for through hole vias // Any captured via should be from aLayerPair.first to aLayerPair.second exactly. if( new_hole.m_Hole_Top_Layer != aLayerPair.first || new_hole.m_Hole_Bottom_Layer != aLayerPair.second ) continue; m_holeListBuffer.push_back( new_hole ); } } if( aLayerPair == LAYER_PAIR( F_Cu, B_Cu ) ) { // add holes for thru hole pads for( MODULE* module = m_pcb->m_Modules; module; module = module->Next() ) { for( D_PAD* pad = module->Pads(); pad; pad = pad->Next() ) { if( !m_merge_PTH_NPTH ) { if( !aGenerateNPTH_list && pad->GetAttribute() == PAD_ATTRIB_HOLE_NOT_PLATED ) continue; if( aGenerateNPTH_list && pad->GetAttribute() != PAD_ATTRIB_HOLE_NOT_PLATED ) continue; } if( pad->GetDrillSize().x == 0 ) continue; new_hole.m_Hole_NotPlated = (pad->GetAttribute() == PAD_ATTRIB_HOLE_NOT_PLATED); new_hole.m_Tool_Reference = -1; // Flag is: Not initialized new_hole.m_Hole_Orient = pad->GetOrientation(); new_hole.m_Hole_Shape = 0; // hole shape: round new_hole.m_Hole_Diameter = std::min( pad->GetDrillSize().x, pad->GetDrillSize().y ); new_hole.m_Hole_Size.x = new_hole.m_Hole_Size.y = new_hole.m_Hole_Diameter; if( pad->GetDrillShape() != PAD_DRILL_SHAPE_CIRCLE ) new_hole.m_Hole_Shape = 1; // oval flag set new_hole.m_Hole_Size = pad->GetDrillSize(); new_hole.m_Hole_Pos = pad->GetPosition(); // hole position new_hole.m_Hole_Bottom_Layer = B_Cu; new_hole.m_Hole_Top_Layer = F_Cu; // pad holes are through holes m_holeListBuffer.push_back( new_hole ); } } } // Sort holes per increasing diameter value sort( m_holeListBuffer.begin(), m_holeListBuffer.end(), CmpHoleSettings ); // build the tool list int last_hole = -1; // Set to not initialized (this is a value not used // for m_holeListBuffer[ii].m_Hole_Diameter) bool last_notplated_opt = false; DRILL_TOOL new_tool( 0, false ); unsigned jj; for( unsigned ii = 0; ii < m_holeListBuffer.size(); ii++ ) { if( m_holeListBuffer[ii].m_Hole_Diameter != last_hole || m_holeListBuffer[ii].m_Hole_NotPlated != last_notplated_opt ) { new_tool.m_Diameter = m_holeListBuffer[ii].m_Hole_Diameter; new_tool.m_Hole_NotPlated = m_holeListBuffer[ii].m_Hole_NotPlated; m_toolListBuffer.push_back( new_tool ); last_hole = new_tool.m_Diameter; last_notplated_opt = new_tool.m_Hole_NotPlated; } jj = m_toolListBuffer.size(); if( jj == 0 ) continue; // Should not occurs m_holeListBuffer[ii].m_Tool_Reference = jj; // Tool value Initialized (value >= 1) m_toolListBuffer.back().m_TotalCount++; if( m_holeListBuffer[ii].m_Hole_Shape ) m_toolListBuffer.back().m_OvalCount++; } }
void EXCELLON_WRITER::BuildHolesList( int aFirstLayer, int aLastLayer, bool aExcludeThroughHoles, bool aGenerateNPTH_list, bool aMerge_PTH_NPTH ) { HOLE_INFO new_hole; int hole_value; m_holeListBuffer.clear(); m_toolListBuffer.clear(); if( (aFirstLayer >= 0) && (aLastLayer >= 0) ) { if( aFirstLayer > aLastLayer ) std::swap( aFirstLayer, aLastLayer ); } if ( aGenerateNPTH_list && aMerge_PTH_NPTH ) { return; } // build hole list for vias if( ! aGenerateNPTH_list ) // vias are always plated ! { for( VIA* via = GetFirstVia( m_pcb->m_Track ); via; via = GetFirstVia( via->Next() ) ) { hole_value = via->GetDrillValue(); if( hole_value == 0 ) // Should not occur. continue; new_hole.m_Tool_Reference = -1; // Flag value for Not initialized new_hole.m_Hole_Orient = 0; new_hole.m_Hole_Diameter = hole_value; new_hole.m_Hole_Size.x = new_hole.m_Hole_Size.y = new_hole.m_Hole_Diameter; new_hole.m_Hole_Shape = 0; // hole shape: round new_hole.m_Hole_Pos = via->GetStart(); via->LayerPair( &new_hole.m_Hole_Top_Layer, &new_hole.m_Hole_Bottom_Layer ); // LayerPair return params with m_Hole_Bottom_Layer > m_Hole_Top_Layer // Remember: top layer = 0 and bottom layer = 31 for through hole vias // the via should be at least from aFirstLayer to aLastLayer if( (new_hole.m_Hole_Top_Layer > aFirstLayer) && (aFirstLayer >= 0) ) continue; // via above the first layer if( (new_hole.m_Hole_Bottom_Layer < aLastLayer) && (aLastLayer >= 0) ) continue; // via below the last layer if( aExcludeThroughHoles && (new_hole.m_Hole_Bottom_Layer == B_Cu) && (new_hole.m_Hole_Top_Layer == F_Cu) ) continue; m_holeListBuffer.push_back( new_hole ); } } // build hole list for pads (assumed always through holes) if( !aExcludeThroughHoles || aGenerateNPTH_list ) { for( MODULE* module = m_pcb->m_Modules; module; module = module->Next() ) { // Read and analyse pads for( D_PAD* pad = module->Pads(); pad; pad = pad->Next() ) { if( ! aGenerateNPTH_list && pad->GetAttribute() == PAD_HOLE_NOT_PLATED && ! aMerge_PTH_NPTH ) continue; if( aGenerateNPTH_list && pad->GetAttribute() != PAD_HOLE_NOT_PLATED ) continue; if( pad->GetDrillSize().x == 0 ) continue; new_hole.m_Hole_NotPlated = (pad->GetAttribute() == PAD_HOLE_NOT_PLATED); new_hole.m_Tool_Reference = -1; // Flag is: Not initialized new_hole.m_Hole_Orient = pad->GetOrientation(); new_hole.m_Hole_Shape = 0; // hole shape: round new_hole.m_Hole_Diameter = std::min( pad->GetDrillSize().x, pad->GetDrillSize().y ); new_hole.m_Hole_Size.x = new_hole.m_Hole_Size.y = new_hole.m_Hole_Diameter; if( pad->GetDrillShape() != PAD_DRILL_CIRCLE ) new_hole.m_Hole_Shape = 1; // oval flag set new_hole.m_Hole_Size = pad->GetDrillSize(); new_hole.m_Hole_Pos = pad->GetPosition(); // hole position new_hole.m_Hole_Bottom_Layer = B_Cu; new_hole.m_Hole_Top_Layer = F_Cu;// pad holes are through holes m_holeListBuffer.push_back( new_hole ); } } } // Sort holes per increasing diameter value sort( m_holeListBuffer.begin(), m_holeListBuffer.end(), CmpHoleDiameterValue ); // build the tool list int LastHole = -1; /* Set to not initialized (this is a value not used * for m_holeListBuffer[ii].m_Hole_Diameter) */ DRILL_TOOL new_tool( 0 ); unsigned jj; for( unsigned ii = 0; ii < m_holeListBuffer.size(); ii++ ) { if( m_holeListBuffer[ii].m_Hole_Diameter != LastHole ) { new_tool.m_Diameter = ( m_holeListBuffer[ii].m_Hole_Diameter ); m_toolListBuffer.push_back( new_tool ); LastHole = new_tool.m_Diameter; } jj = m_toolListBuffer.size(); if( jj == 0 ) continue; // Should not occurs m_holeListBuffer[ii].m_Tool_Reference = jj; // Tool value Initialized (value >= 1) m_toolListBuffer.back().m_TotalCount++; if( m_holeListBuffer[ii].m_Hole_Shape ) m_toolListBuffer.back().m_OvalCount++; } }
void EDA_3D_CANVAS::buildBoardThroughHolesPolygonList( SHAPE_POLY_SET& allBoardHoles, int aSegCountPerCircle, bool aOptimizeLargeCircles ) { // hole diameter value to change seg count by circle: int small_hole_limit = Millimeter2iu( 1.0 ); int copper_thickness = GetPrm3DVisu().GetCopperThicknessBIU(); BOARD* pcb = GetBoard(); // Build holes of through vias: for( TRACK* track = pcb->m_Track; track; track = track->Next() ) { if( track->Type() != PCB_VIA_T ) continue; VIA *via = static_cast<VIA*>( track ); if( via->GetViaType() != VIA_THROUGH ) continue; int holediameter = via->GetDrillValue(); int hole_outer_radius = (holediameter + copper_thickness) / 2; TransformCircleToPolygon( allBoardHoles, via->GetStart(), hole_outer_radius, aSegCountPerCircle ); } // Build holes of through pads: for( MODULE* footprint = pcb->m_Modules; footprint; footprint = footprint->Next() ) { for( D_PAD* pad = footprint->Pads(); pad; pad = pad->Next() ) { // Calculate a factor to apply to segcount for large holes ( > 1 mm) // (bigger pad drill size -> more segments) because holes in pads can have // very different sizes and optimizing this segcount gives a better look // Mainly mounting holes have a size bigger than small_hole_limit wxSize padHole = pad->GetDrillSize(); if( ! padHole.x ) // Not drilled pad like SMD pad continue; // we use the hole diameter to calculate the seg count. // for round holes, padHole.x == padHole.y // for oblong holes, the diameter is the smaller of (padHole.x, padHole.y) int diam = std::min( padHole.x, padHole.y ); int segcount = aSegCountPerCircle; if( diam > small_hole_limit ) { double segFactor = (double)diam / small_hole_limit; segcount = (int)(aSegCountPerCircle * segFactor); // limit segcount to 48. For a circle this is a very good approx. if( segcount > 48 ) segcount = 48; } // The hole in the body is inflated by copper thickness. int inflate = copper_thickness; // If not plated, no copper. if( pad->GetAttribute () == PAD_HOLE_NOT_PLATED ) inflate = 0; pad->BuildPadDrillShapePolygon( allBoardHoles, inflate, segcount ); } } allBoardHoles.Simplify(); }
void EDA_3D_CANVAS::buildBoard3DView( GLuint aBoardList, GLuint aBodyOnlyList, REPORTER* aErrorMessages, REPORTER* aActivity ) { BOARD* pcb = GetBoard(); // If FL_RENDER_SHOW_HOLES_IN_ZONES is true, holes are correctly removed from copper zones areas. // If FL_RENDER_SHOW_HOLES_IN_ZONES is false, holes are not removed from copper zones areas, // but the calculation time is twice shorter. bool remove_Holes = isEnabled( FL_RENDER_SHOW_HOLES_IN_ZONES ); bool realistic_mode = isRealisticMode(); bool useTextures = isRealisticMode() && isEnabled( FL_RENDER_TEXTURES ); // Number of segments to convert a circle to polygon // We use 2 values: the first gives a good shape (for instanes rond pads) // the second is used to speed up calculations, when a poor approximation is acceptable (holes) const int segcountforcircle = 18; double correctionFactor = 1.0 / cos( M_PI / (segcountforcircle * 2.0) ); const int segcountLowQuality = 12; // segments to draw a circle with low quality // to reduce time calculations // for holes and items which do not need // a fine representation double correctionFactorLQ = 1.0 / cos( M_PI / (segcountLowQuality * 2.0) ); SHAPE_POLY_SET bufferPolys; // copper areas: tracks, pads and filled zones areas // when holes are removed from zones SHAPE_POLY_SET bufferPcbOutlines; // stores the board main outlines SHAPE_POLY_SET bufferZonesPolys; // copper filled zones areas // when holes are not removed from zones SHAPE_POLY_SET currLayerHoles; // Contains holes for the current layer SHAPE_POLY_SET allLayerHoles; // Contains holes for all layers // Build a polygon from edge cut items wxString msg; if( !pcb->GetBoardPolygonOutlines( bufferPcbOutlines, allLayerHoles, &msg ) ) { if( aErrorMessages ) { msg << wxT("\n") << _("Unable to calculate the board outlines.\n" "Therefore use the board boundary box.") << wxT("\n\n"); aErrorMessages->Report( msg, REPORTER::RPT_WARNING ); } } // Build board holes, with optimization of large holes shape. buildBoardThroughHolesPolygonList( allLayerHoles, segcountLowQuality, true ); LSET cu_set = LSET::AllCuMask( GetPrm3DVisu().m_CopperLayersCount ); glNewList( aBoardList, GL_COMPILE ); for( LSEQ cu = cu_set.CuStack(); cu; ++cu ) { LAYER_ID layer = *cu; // Skip non enabled layers in normal mode, // and internal layers in realistic mode if( !is3DLayerEnabled( layer ) ) continue; if( aActivity ) aActivity->Report( wxString::Format( _( "Build layer %s" ), LSET::Name( layer ) ) ); bufferPolys.RemoveAllContours(); bufferZonesPolys.RemoveAllContours(); currLayerHoles.RemoveAllContours(); // Draw track shapes: for( TRACK* track = pcb->m_Track; track; track = track->Next() ) { if( !track->IsOnLayer( layer ) ) continue; track->TransformShapeWithClearanceToPolygon( bufferPolys, 0, segcountforcircle, correctionFactor ); // Add blind/buried via holes if( track->Type() == PCB_VIA_T ) { VIA *via = static_cast<VIA*>( track ); if( via->GetViaType() == VIA_THROUGH ) continue; // already done int holediameter = via->GetDrillValue(); int thickness = GetPrm3DVisu().GetCopperThicknessBIU(); int hole_outer_radius = (holediameter + thickness) / 2; TransformCircleToPolygon( currLayerHoles, via->GetStart(), hole_outer_radius, segcountLowQuality ); } } // draw pad shapes for( MODULE* module = pcb->m_Modules; module; module = module->Next() ) { // Note: NPTH pads are not drawn on copper layers when the pad // has same shape as its hole module->TransformPadsShapesWithClearanceToPolygon( layer, bufferPolys, 0, segcountforcircle, correctionFactor, true ); // Micro-wave modules may have items on copper layers module->TransformGraphicShapesWithClearanceToPolygonSet( layer, bufferPolys, 0, segcountforcircle, correctionFactor ); // pad holes are already in list. } // Draw copper zones. Note: // * if the holes are removed from copper zones // the polygons are stored in bufferPolys (which contains all other polygons) // * if the holes are NOT removed from copper zones // the polygons are stored in bufferZonesPolys if( isEnabled( FL_ZONE ) ) { for( int ii = 0; ii < pcb->GetAreaCount(); ii++ ) { ZONE_CONTAINER* zone = pcb->GetArea( ii ); LAYER_NUM zonelayer = zone->GetLayer(); if( zonelayer == layer ) { zone->TransformSolidAreasShapesToPolygonSet( remove_Holes ? bufferPolys : bufferZonesPolys, segcountLowQuality, correctionFactorLQ ); } } } // draw graphic items on copper layers (texts) for( BOARD_ITEM* item = pcb->m_Drawings; item; item = item->Next() ) { if( !item->IsOnLayer( layer ) ) continue; switch( item->Type() ) { case PCB_LINE_T: // should not exist on copper layers ( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon( bufferPolys, 0, segcountforcircle, correctionFactor ); break; case PCB_TEXT_T: ( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet( bufferPolys, 0, segcountLowQuality, correctionFactor ); break; default: break; } } // bufferPolys contains polygons to merge. Many overlaps . // Calculate merged polygons if( bufferPolys.IsEmpty() ) continue; // Use Clipper lib to subtract holes to copper areas if( currLayerHoles.OutlineCount() ) { currLayerHoles.Append(allLayerHoles); currLayerHoles.Simplify(); bufferPolys.BooleanSubtract( currLayerHoles ); } else bufferPolys.BooleanSubtract( allLayerHoles ); int thickness = GetPrm3DVisu().GetLayerObjectThicknessBIU( layer ); int zpos = GetPrm3DVisu().GetLayerZcoordBIU( layer ); float zNormal = 1.0f; // When using thickness it will draw first the top and then botton (with z inverted) // If we are not using thickness, then the z-normal has to match the layer direction // because just one plane will be drawn if( !thickness ) zNormal = Get3DLayer_Z_Orientation( layer ); if( realistic_mode ) { setGLCopperColor(); } else { EDA_COLOR_T color = g_ColorsSettings.GetLayerColor( layer ); SetGLColor( color ); } // If holes are removed from copper zones, bufferPolys contains all polygons // to draw (tracks+zones+texts). Draw3D_SolidHorizontalPolyPolygons( bufferPolys, zpos, thickness, GetPrm3DVisu().m_BiuTo3Dunits, useTextures, zNormal ); // If holes are not removed from copper zones (for calculation time reasons, // the zone polygons are stored in bufferZonesPolys and have to be drawn now: if( !bufferZonesPolys.IsEmpty() ) { Draw3D_SolidHorizontalPolyPolygons( bufferZonesPolys, zpos, thickness, GetPrm3DVisu().m_BiuTo3Dunits, useTextures, zNormal ); } } if( aActivity ) aActivity->Report( _( "Build board body" ) ); // Draw plated vertical holes inside the board, but not always. They are drawn: // - if the board body is not shown, to show the holes. // - or if the copper thickness is shown if( !isEnabled( FL_SHOW_BOARD_BODY ) || isEnabled( FL_USE_COPPER_THICKNESS ) ) { // Draw vias holes (vertical cylinders) for( const TRACK* track = pcb->m_Track; track; track = track->Next() ) { if( track->Type() == PCB_VIA_T ) { const VIA *via = static_cast<const VIA*>(track); draw3DViaHole( via ); } } // Draw pads holes (vertical cylinders) for( const MODULE* module = pcb->m_Modules; module; module = module->Next() ) { for( D_PAD* pad = module->Pads(); pad; pad = pad->Next() ) if( pad->GetAttribute () != PAD_HOLE_NOT_PLATED ) draw3DPadHole( pad ); } } glEndList(); // Build the body board: glNewList( aBodyOnlyList, GL_COMPILE ); if( isRealisticMode() ) { setGLEpoxyColor( 1.00 ); } else { EDA_COLOR_T color = g_ColorsSettings.GetLayerColor( Edge_Cuts ); SetGLColor( color, 0.7 ); } float copper_thickness = GetPrm3DVisu().GetCopperThicknessBIU(); // a small offset between substrate and external copper layer to avoid artifacts // when drawing copper items on board float epsilon = Millimeter2iu( 0.01 ); float zpos = GetPrm3DVisu().GetLayerZcoordBIU( B_Cu ); float board_thickness = GetPrm3DVisu().GetLayerZcoordBIU( F_Cu ) - GetPrm3DVisu().GetLayerZcoordBIU( B_Cu ); // items on copper layers and having a thickness = copper_thickness // are drawn from zpos - copper_thickness/2 to zpos + copper_thickness // therefore substrate position is copper_thickness/2 to // substrate_height - copper_thickness/2 zpos += (copper_thickness + epsilon) / 2.0f; board_thickness -= copper_thickness + epsilon; bufferPcbOutlines.BooleanSubtract( allLayerHoles ); if( !bufferPcbOutlines.IsEmpty() ) { Draw3D_SolidHorizontalPolyPolygons( bufferPcbOutlines, zpos + board_thickness / 2.0, board_thickness, GetPrm3DVisu().m_BiuTo3Dunits, useTextures, 1.0f ); } glEndList(); }
bool PCB_EDIT_FRAME::Other_Layer_Route( TRACK* aTrack, wxDC* DC ) { unsigned itmp; if( aTrack == NULL ) { if( GetActiveLayer() != GetScreen()->m_Route_Layer_TOP ) SetActiveLayer( GetScreen()->m_Route_Layer_TOP ); else SetActiveLayer( GetScreen()->m_Route_Layer_BOTTOM ); UpdateStatusBar(); return true; } // Avoid more than one via on the current location: if( GetBoard()->GetViaByPosition( g_CurrentTrackSegment->GetEnd(), g_CurrentTrackSegment->GetLayer() ) ) return false; for( TRACK* segm = g_FirstTrackSegment; segm; segm = segm->Next() ) { if( segm->Type() == PCB_VIA_T && g_CurrentTrackSegment->GetEnd() == segm->GetStart() ) return false; } // Is the current segment Ok (no DRC error) ? if( g_Drc_On ) { if( BAD_DRC==m_drc->Drc( g_CurrentTrackSegment, GetBoard()->m_Track ) ) // DRC error, the change layer is not made return false; // Handle 2 segments. if( g_TwoSegmentTrackBuild && g_CurrentTrackSegment->Back() ) { if( BAD_DRC == m_drc->Drc( g_CurrentTrackSegment->Back(), GetBoard()->m_Track ) ) return false; } } /* Save current state before placing a via. * If the via cannot be placed this current state will be reused */ itmp = g_CurrentTrackList.GetCount(); Begin_Route( g_CurrentTrackSegment, DC ); m_canvas->CallMouseCapture( DC, wxDefaultPosition, false ); // create the via VIA* via = new VIA( GetBoard() ); via->SetFlags( IS_NEW ); via->SetViaType( GetDesignSettings().m_CurrentViaType ); via->SetNetCode( GetBoard()->GetHighLightNetCode() ); via->SetPosition( g_CurrentTrackSegment->GetEnd() ); // for microvias, the size and hole will be changed later. via->SetWidth( GetDesignSettings().GetCurrentViaSize()); via->SetDrill( GetDesignSettings().GetCurrentViaDrill() ); // Usual via is from copper to component. // layer pair is B_Cu and F_Cu. via->SetLayerPair( B_Cu, F_Cu ); LAYER_ID first_layer = GetActiveLayer(); LAYER_ID last_layer; // prepare switch to new active layer: if( first_layer != GetScreen()->m_Route_Layer_TOP ) last_layer = GetScreen()->m_Route_Layer_TOP; else last_layer = GetScreen()->m_Route_Layer_BOTTOM; // Adjust the actual via layer pair switch( via->GetViaType() ) { case VIA_BLIND_BURIED: via->SetLayerPair( first_layer, last_layer ); break; case VIA_MICROVIA: // from external to the near neighbor inner layer { LAYER_ID last_inner_layer = ToLAYER_ID( ( GetBoard()->GetCopperLayerCount() - 2 ) ); if( first_layer == B_Cu ) last_layer = last_inner_layer; else if( first_layer == F_Cu ) last_layer = In1_Cu; else if( first_layer == last_inner_layer ) last_layer = B_Cu; else if( first_layer == In1_Cu ) last_layer = F_Cu; // else error: will be removed later via->SetLayerPair( first_layer, last_layer ); // Update diameter and hole size, which where set previously // for normal vias NETINFO_ITEM* net = via->GetNet(); via->SetWidth( net->GetMicroViaSize() ); via->SetDrill( net->GetMicroViaDrillSize() ); } break; default: break; } if( g_Drc_On && BAD_DRC == m_drc->Drc( via, GetBoard()->m_Track ) ) { // DRC fault: the Via cannot be placed here ... delete via; m_canvas->CallMouseCapture( DC, wxDefaultPosition, false ); // delete the track(s) added in Begin_Route() while( g_CurrentTrackList.GetCount() > itmp ) { Delete_Segment( DC, g_CurrentTrackSegment ); } SetCurItem( g_CurrentTrackSegment, false ); // Refresh DRC diag, erased by previous calls if( m_drc->GetCurrentMarker() ) SetMsgPanel( m_drc->GetCurrentMarker() ); return false; } SetActiveLayer( last_layer ); TRACK* lastNonVia = g_CurrentTrackSegment; /* A new via was created. It was Ok. */ g_CurrentTrackList.PushBack( via ); /* The via is now in linked list and we need a new track segment * after the via, starting at via location. * it will become the new current segment (from via to the mouse cursor) */ TRACK* track = (TRACK*)lastNonVia->Clone(); /* the above creates a new segment from the last entered segment, with the * current width, flags, netcode, etc... values. * layer, start and end point are not correct, * and will be modified next */ // set the layer to the new value track->SetLayer( GetActiveLayer() ); /* the start point is the via position and the end point is the cursor * which also is on the via (will change when moving mouse) */ track->SetEnd( via->GetStart() ); track->SetStart( via->GetStart() ); g_CurrentTrackList.PushBack( track ); if( g_TwoSegmentTrackBuild ) { // Create a second segment (we must have 2 track segments to adjust) g_CurrentTrackList.PushBack( (TRACK*)g_CurrentTrackSegment->Clone() ); } m_canvas->CallMouseCapture( DC, wxDefaultPosition, false ); SetMsgPanel( via ); UpdateStatusBar(); return true; }