bool TRACKS_CLEANER::clean_vias()
{
bool modified = false;
for( VIA* via = GetFirstVia( m_Brd->m_Track ); via != NULL;
via = GetFirstVia( via->Next() ) )
{
// Correct via m_End defects (if any), should never happen
if( via->GetStart() != via->GetEnd() )
{
wxFAIL_MSG( wxT( "Via with mismatching ends" ) );
via->SetEnd( via->GetStart() );
}
/* Important: these cleanups only do thru hole vias, they don't
* (yet) handle high density interconnects */
if( via->GetViaType() != VIA_THROUGH )
{
modified |= remove_duplicates_of_via( via );
/* To delete through Via on THT pads at same location
* Examine the list of connected pads:
* if one through pad is found, the via can be removed */
for( unsigned ii = 0; ii < via->m_PadsConnected.size(); ++ii )
{
const D_PAD *pad = via->m_PadsConnected[ii];
const LSET all_cu = LSET::AllCuMask();
if( (pad->GetLayerSet() & all_cu) == all_cu )
{
// redundant: delete the via
m_Brd->GetRatsnest()->Remove( via );
via->ViewRelease();
via->DeleteStructure();
modified = true;
break;
}
}
}
}
return modified;
}
void EXCELLON_WRITER::BuildHolesList( LAYER_PAIR aLayerPair,
bool aGenerateNPTH_list )
{
HOLE_INFO new_hole;
m_holeListBuffer.clear();
m_toolListBuffer.clear();
wxASSERT( aLayerPair.first < aLayerPair.second ); // fix the caller
// build hole list for vias
if( ! aGenerateNPTH_list ) // vias are always plated !
{
for( VIA* via = GetFirstVia( m_pcb->m_Track ); via; via = GetFirstVia( via->Next() ) )
{
int hole_sz = via->GetDrillValue();
if( hole_sz == 0 ) // Should not occur.
continue;
new_hole.m_Tool_Reference = -1; // Flag value for Not initialized
new_hole.m_Hole_Orient = 0;
new_hole.m_Hole_Diameter = hole_sz;
new_hole.m_Hole_NotPlated = false;
new_hole.m_Hole_Size.x = new_hole.m_Hole_Size.y = new_hole.m_Hole_Diameter;
new_hole.m_Hole_Shape = 0; // hole shape: round
new_hole.m_Hole_Pos = via->GetStart();
via->LayerPair( &new_hole.m_Hole_Top_Layer, &new_hole.m_Hole_Bottom_Layer );
// LayerPair() returns params with m_Hole_Bottom_Layer > m_Hole_Top_Layer
// Remember: top layer = 0 and bottom layer = 31 for through hole vias
// Any captured via should be from aLayerPair.first to aLayerPair.second exactly.
if( new_hole.m_Hole_Top_Layer != aLayerPair.first ||
new_hole.m_Hole_Bottom_Layer != aLayerPair.second )
continue;
m_holeListBuffer.push_back( new_hole );
}
}
if( aLayerPair == LAYER_PAIR( F_Cu, B_Cu ) )
{
// add holes for thru hole pads
for( MODULE* module = m_pcb->m_Modules; module; module = module->Next() )
{
for( D_PAD* pad = module->Pads(); pad; pad = pad->Next() )
{
if( !m_merge_PTH_NPTH )
{
if( !aGenerateNPTH_list && pad->GetAttribute() == PAD_ATTRIB_HOLE_NOT_PLATED )
continue;
if( aGenerateNPTH_list && pad->GetAttribute() != PAD_ATTRIB_HOLE_NOT_PLATED )
continue;
}
if( pad->GetDrillSize().x == 0 )
continue;
new_hole.m_Hole_NotPlated = (pad->GetAttribute() == PAD_ATTRIB_HOLE_NOT_PLATED);
new_hole.m_Tool_Reference = -1; // Flag is: Not initialized
new_hole.m_Hole_Orient = pad->GetOrientation();
new_hole.m_Hole_Shape = 0; // hole shape: round
new_hole.m_Hole_Diameter = std::min( pad->GetDrillSize().x, pad->GetDrillSize().y );
new_hole.m_Hole_Size.x = new_hole.m_Hole_Size.y = new_hole.m_Hole_Diameter;
if( pad->GetDrillShape() != PAD_DRILL_SHAPE_CIRCLE )
new_hole.m_Hole_Shape = 1; // oval flag set
new_hole.m_Hole_Size = pad->GetDrillSize();
new_hole.m_Hole_Pos = pad->GetPosition(); // hole position
new_hole.m_Hole_Bottom_Layer = B_Cu;
new_hole.m_Hole_Top_Layer = F_Cu; // pad holes are through holes
m_holeListBuffer.push_back( new_hole );
}
}
}
// Sort holes per increasing diameter value
sort( m_holeListBuffer.begin(), m_holeListBuffer.end(), CmpHoleSettings );
// build the tool list
int last_hole = -1; // Set to not initialized (this is a value not used
// for m_holeListBuffer[ii].m_Hole_Diameter)
bool last_notplated_opt = false;
DRILL_TOOL new_tool( 0, false );
unsigned jj;
for( unsigned ii = 0; ii < m_holeListBuffer.size(); ii++ )
{
if( m_holeListBuffer[ii].m_Hole_Diameter != last_hole ||
m_holeListBuffer[ii].m_Hole_NotPlated != last_notplated_opt )
{
new_tool.m_Diameter = m_holeListBuffer[ii].m_Hole_Diameter;
new_tool.m_Hole_NotPlated = m_holeListBuffer[ii].m_Hole_NotPlated;
m_toolListBuffer.push_back( new_tool );
last_hole = new_tool.m_Diameter;
last_notplated_opt = new_tool.m_Hole_NotPlated;
}
jj = m_toolListBuffer.size();
if( jj == 0 )
continue; // Should not occurs
m_holeListBuffer[ii].m_Tool_Reference = jj; // Tool value Initialized (value >= 1)
m_toolListBuffer.back().m_TotalCount++;
if( m_holeListBuffer[ii].m_Hole_Shape )
m_toolListBuffer.back().m_OvalCount++;
}
}
void EXCELLON_WRITER::BuildHolesList( int aFirstLayer,
int aLastLayer,
bool aExcludeThroughHoles,
bool aGenerateNPTH_list,
bool aMerge_PTH_NPTH )
{
HOLE_INFO new_hole;
int hole_value;
m_holeListBuffer.clear();
m_toolListBuffer.clear();
if( (aFirstLayer >= 0) && (aLastLayer >= 0) )
{
if( aFirstLayer > aLastLayer )
std::swap( aFirstLayer, aLastLayer );
}
if ( aGenerateNPTH_list && aMerge_PTH_NPTH )
{
return;
}
// build hole list for vias
if( ! aGenerateNPTH_list ) // vias are always plated !
{
for( VIA* via = GetFirstVia( m_pcb->m_Track ); via; via = GetFirstVia( via->Next() ) )
{
hole_value = via->GetDrillValue();
if( hole_value == 0 ) // Should not occur.
continue;
new_hole.m_Tool_Reference = -1; // Flag value for Not initialized
new_hole.m_Hole_Orient = 0;
new_hole.m_Hole_Diameter = hole_value;
new_hole.m_Hole_Size.x = new_hole.m_Hole_Size.y = new_hole.m_Hole_Diameter;
new_hole.m_Hole_Shape = 0; // hole shape: round
new_hole.m_Hole_Pos = via->GetStart();
via->LayerPair( &new_hole.m_Hole_Top_Layer, &new_hole.m_Hole_Bottom_Layer );
// LayerPair return params with m_Hole_Bottom_Layer > m_Hole_Top_Layer
// Remember: top layer = 0 and bottom layer = 31 for through hole vias
// the via should be at least from aFirstLayer to aLastLayer
if( (new_hole.m_Hole_Top_Layer > aFirstLayer) && (aFirstLayer >= 0) )
continue; // via above the first layer
if( (new_hole.m_Hole_Bottom_Layer < aLastLayer) && (aLastLayer >= 0) )
continue; // via below the last layer
if( aExcludeThroughHoles && (new_hole.m_Hole_Bottom_Layer == B_Cu)
&& (new_hole.m_Hole_Top_Layer == F_Cu) )
continue;
m_holeListBuffer.push_back( new_hole );
}
}
// build hole list for pads (assumed always through holes)
if( !aExcludeThroughHoles || aGenerateNPTH_list )
{
for( MODULE* module = m_pcb->m_Modules; module; module = module->Next() )
{
// Read and analyse pads
for( D_PAD* pad = module->Pads(); pad; pad = pad->Next() )
{
if( ! aGenerateNPTH_list &&
pad->GetAttribute() == PAD_HOLE_NOT_PLATED &&
! aMerge_PTH_NPTH )
continue;
if( aGenerateNPTH_list && pad->GetAttribute() != PAD_HOLE_NOT_PLATED )
continue;
if( pad->GetDrillSize().x == 0 )
continue;
new_hole.m_Hole_NotPlated = (pad->GetAttribute() == PAD_HOLE_NOT_PLATED);
new_hole.m_Tool_Reference = -1; // Flag is: Not initialized
new_hole.m_Hole_Orient = pad->GetOrientation();
new_hole.m_Hole_Shape = 0; // hole shape: round
new_hole.m_Hole_Diameter = std::min( pad->GetDrillSize().x, pad->GetDrillSize().y );
new_hole.m_Hole_Size.x = new_hole.m_Hole_Size.y = new_hole.m_Hole_Diameter;
if( pad->GetDrillShape() != PAD_DRILL_CIRCLE )
new_hole.m_Hole_Shape = 1; // oval flag set
new_hole.m_Hole_Size = pad->GetDrillSize();
new_hole.m_Hole_Pos = pad->GetPosition(); // hole position
new_hole.m_Hole_Bottom_Layer = B_Cu;
new_hole.m_Hole_Top_Layer = F_Cu;// pad holes are through holes
m_holeListBuffer.push_back( new_hole );
}
}
}
// Sort holes per increasing diameter value
sort( m_holeListBuffer.begin(), m_holeListBuffer.end(), CmpHoleDiameterValue );
// build the tool list
int LastHole = -1; /* Set to not initialized (this is a value not used
* for m_holeListBuffer[ii].m_Hole_Diameter) */
DRILL_TOOL new_tool( 0 );
unsigned jj;
for( unsigned ii = 0; ii < m_holeListBuffer.size(); ii++ )
{
if( m_holeListBuffer[ii].m_Hole_Diameter != LastHole )
{
new_tool.m_Diameter = ( m_holeListBuffer[ii].m_Hole_Diameter );
m_toolListBuffer.push_back( new_tool );
LastHole = new_tool.m_Diameter;
}
jj = m_toolListBuffer.size();
if( jj == 0 )
continue; // Should not occurs
m_holeListBuffer[ii].m_Tool_Reference = jj; // Tool value Initialized (value >= 1)
m_toolListBuffer.back().m_TotalCount++;
if( m_holeListBuffer[ii].m_Hole_Shape )
m_toolListBuffer.back().m_OvalCount++;
}
}
void EDA_3D_CANVAS::buildBoardThroughHolesPolygonList( SHAPE_POLY_SET& allBoardHoles,
int aSegCountPerCircle, bool aOptimizeLargeCircles )
{
// hole diameter value to change seg count by circle:
int small_hole_limit = Millimeter2iu( 1.0 );
int copper_thickness = GetPrm3DVisu().GetCopperThicknessBIU();
BOARD* pcb = GetBoard();
// Build holes of through vias:
for( TRACK* track = pcb->m_Track; track; track = track->Next() )
{
if( track->Type() != PCB_VIA_T )
continue;
VIA *via = static_cast<VIA*>( track );
if( via->GetViaType() != VIA_THROUGH )
continue;
int holediameter = via->GetDrillValue();
int hole_outer_radius = (holediameter + copper_thickness) / 2;
TransformCircleToPolygon( allBoardHoles,
via->GetStart(), hole_outer_radius,
aSegCountPerCircle );
}
// Build holes of through pads:
for( MODULE* footprint = pcb->m_Modules; footprint; footprint = footprint->Next() )
{
for( D_PAD* pad = footprint->Pads(); pad; pad = pad->Next() )
{
// Calculate a factor to apply to segcount for large holes ( > 1 mm)
// (bigger pad drill size -> more segments) because holes in pads can have
// very different sizes and optimizing this segcount gives a better look
// Mainly mounting holes have a size bigger than small_hole_limit
wxSize padHole = pad->GetDrillSize();
if( ! padHole.x ) // Not drilled pad like SMD pad
continue;
// we use the hole diameter to calculate the seg count.
// for round holes, padHole.x == padHole.y
// for oblong holes, the diameter is the smaller of (padHole.x, padHole.y)
int diam = std::min( padHole.x, padHole.y );
int segcount = aSegCountPerCircle;
if( diam > small_hole_limit )
{
double segFactor = (double)diam / small_hole_limit;
segcount = (int)(aSegCountPerCircle * segFactor);
// limit segcount to 48. For a circle this is a very good approx.
if( segcount > 48 )
segcount = 48;
}
// The hole in the body is inflated by copper thickness.
int inflate = copper_thickness;
// If not plated, no copper.
if( pad->GetAttribute () == PAD_HOLE_NOT_PLATED )
inflate = 0;
pad->BuildPadDrillShapePolygon( allBoardHoles, inflate, segcount );
}
}
allBoardHoles.Simplify();
}
void EDA_3D_CANVAS::buildBoard3DView( GLuint aBoardList, GLuint aBodyOnlyList,
REPORTER* aErrorMessages, REPORTER* aActivity )
{
BOARD* pcb = GetBoard();
// If FL_RENDER_SHOW_HOLES_IN_ZONES is true, holes are correctly removed from copper zones areas.
// If FL_RENDER_SHOW_HOLES_IN_ZONES is false, holes are not removed from copper zones areas,
// but the calculation time is twice shorter.
bool remove_Holes = isEnabled( FL_RENDER_SHOW_HOLES_IN_ZONES );
bool realistic_mode = isRealisticMode();
bool useTextures = isRealisticMode() && isEnabled( FL_RENDER_TEXTURES );
// Number of segments to convert a circle to polygon
// We use 2 values: the first gives a good shape (for instanes rond pads)
// the second is used to speed up calculations, when a poor approximation is acceptable (holes)
const int segcountforcircle = 18;
double correctionFactor = 1.0 / cos( M_PI / (segcountforcircle * 2.0) );
const int segcountLowQuality = 12; // segments to draw a circle with low quality
// to reduce time calculations
// for holes and items which do not need
// a fine representation
double correctionFactorLQ = 1.0 / cos( M_PI / (segcountLowQuality * 2.0) );
SHAPE_POLY_SET bufferPolys; // copper areas: tracks, pads and filled zones areas
// when holes are removed from zones
SHAPE_POLY_SET bufferPcbOutlines; // stores the board main outlines
SHAPE_POLY_SET bufferZonesPolys; // copper filled zones areas
// when holes are not removed from zones
SHAPE_POLY_SET currLayerHoles; // Contains holes for the current layer
SHAPE_POLY_SET allLayerHoles; // Contains holes for all layers
// Build a polygon from edge cut items
wxString msg;
if( !pcb->GetBoardPolygonOutlines( bufferPcbOutlines, allLayerHoles, &msg ) )
{
if( aErrorMessages )
{
msg << wxT("\n") << _("Unable to calculate the board outlines.\n"
"Therefore use the board boundary box.") << wxT("\n\n");
aErrorMessages->Report( msg, REPORTER::RPT_WARNING );
}
}
// Build board holes, with optimization of large holes shape.
buildBoardThroughHolesPolygonList( allLayerHoles, segcountLowQuality, true );
LSET cu_set = LSET::AllCuMask( GetPrm3DVisu().m_CopperLayersCount );
glNewList( aBoardList, GL_COMPILE );
for( LSEQ cu = cu_set.CuStack(); cu; ++cu )
{
LAYER_ID layer = *cu;
// Skip non enabled layers in normal mode,
// and internal layers in realistic mode
if( !is3DLayerEnabled( layer ) )
continue;
if( aActivity )
aActivity->Report( wxString::Format( _( "Build layer %s" ), LSET::Name( layer ) ) );
bufferPolys.RemoveAllContours();
bufferZonesPolys.RemoveAllContours();
currLayerHoles.RemoveAllContours();
// Draw track shapes:
for( TRACK* track = pcb->m_Track; track; track = track->Next() )
{
if( !track->IsOnLayer( layer ) )
continue;
track->TransformShapeWithClearanceToPolygon( bufferPolys,
0, segcountforcircle,
correctionFactor );
// Add blind/buried via holes
if( track->Type() == PCB_VIA_T )
{
VIA *via = static_cast<VIA*>( track );
if( via->GetViaType() == VIA_THROUGH )
continue; // already done
int holediameter = via->GetDrillValue();
int thickness = GetPrm3DVisu().GetCopperThicknessBIU();
int hole_outer_radius = (holediameter + thickness) / 2;
TransformCircleToPolygon( currLayerHoles,
via->GetStart(), hole_outer_radius,
segcountLowQuality );
}
}
// draw pad shapes
for( MODULE* module = pcb->m_Modules; module; module = module->Next() )
{
// Note: NPTH pads are not drawn on copper layers when the pad
// has same shape as its hole
module->TransformPadsShapesWithClearanceToPolygon( layer,
bufferPolys,
0,
segcountforcircle,
correctionFactor, true );
// Micro-wave modules may have items on copper layers
module->TransformGraphicShapesWithClearanceToPolygonSet( layer,
bufferPolys,
0,
segcountforcircle,
correctionFactor );
// pad holes are already in list.
}
// Draw copper zones. Note:
// * if the holes are removed from copper zones
// the polygons are stored in bufferPolys (which contains all other polygons)
// * if the holes are NOT removed from copper zones
// the polygons are stored in bufferZonesPolys
if( isEnabled( FL_ZONE ) )
{
for( int ii = 0; ii < pcb->GetAreaCount(); ii++ )
{
ZONE_CONTAINER* zone = pcb->GetArea( ii );
LAYER_NUM zonelayer = zone->GetLayer();
if( zonelayer == layer )
{
zone->TransformSolidAreasShapesToPolygonSet(
remove_Holes ? bufferPolys : bufferZonesPolys,
segcountLowQuality, correctionFactorLQ );
}
}
}
// draw graphic items on copper layers (texts)
for( BOARD_ITEM* item = pcb->m_Drawings; item; item = item->Next() )
{
if( !item->IsOnLayer( layer ) )
continue;
switch( item->Type() )
{
case PCB_LINE_T: // should not exist on copper layers
( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon(
bufferPolys, 0, segcountforcircle, correctionFactor );
break;
case PCB_TEXT_T:
( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet(
bufferPolys, 0, segcountLowQuality, correctionFactor );
break;
default:
break;
}
}
// bufferPolys contains polygons to merge. Many overlaps .
// Calculate merged polygons
if( bufferPolys.IsEmpty() )
continue;
// Use Clipper lib to subtract holes to copper areas
if( currLayerHoles.OutlineCount() )
{
currLayerHoles.Append(allLayerHoles);
currLayerHoles.Simplify();
bufferPolys.BooleanSubtract( currLayerHoles );
}
else
bufferPolys.BooleanSubtract( allLayerHoles );
int thickness = GetPrm3DVisu().GetLayerObjectThicknessBIU( layer );
int zpos = GetPrm3DVisu().GetLayerZcoordBIU( layer );
float zNormal = 1.0f; // When using thickness it will draw first the top and then botton (with z inverted)
// If we are not using thickness, then the z-normal has to match the layer direction
// because just one plane will be drawn
if( !thickness )
zNormal = Get3DLayer_Z_Orientation( layer );
if( realistic_mode )
{
setGLCopperColor();
}
else
{
EDA_COLOR_T color = g_ColorsSettings.GetLayerColor( layer );
SetGLColor( color );
}
// If holes are removed from copper zones, bufferPolys contains all polygons
// to draw (tracks+zones+texts).
Draw3D_SolidHorizontalPolyPolygons( bufferPolys, zpos, thickness,
GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
zNormal );
// If holes are not removed from copper zones (for calculation time reasons,
// the zone polygons are stored in bufferZonesPolys and have to be drawn now:
if( !bufferZonesPolys.IsEmpty() )
{
Draw3D_SolidHorizontalPolyPolygons( bufferZonesPolys, zpos, thickness,
GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
zNormal );
}
}
if( aActivity )
aActivity->Report( _( "Build board body" ) );
// Draw plated vertical holes inside the board, but not always. They are drawn:
// - if the board body is not shown, to show the holes.
// - or if the copper thickness is shown
if( !isEnabled( FL_SHOW_BOARD_BODY ) || isEnabled( FL_USE_COPPER_THICKNESS ) )
{
// Draw vias holes (vertical cylinders)
for( const TRACK* track = pcb->m_Track; track; track = track->Next() )
{
if( track->Type() == PCB_VIA_T )
{
const VIA *via = static_cast<const VIA*>(track);
draw3DViaHole( via );
}
}
// Draw pads holes (vertical cylinders)
for( const MODULE* module = pcb->m_Modules; module; module = module->Next() )
{
for( D_PAD* pad = module->Pads(); pad; pad = pad->Next() )
if( pad->GetAttribute () != PAD_HOLE_NOT_PLATED )
draw3DPadHole( pad );
}
}
glEndList();
// Build the body board:
glNewList( aBodyOnlyList, GL_COMPILE );
if( isRealisticMode() )
{
setGLEpoxyColor( 1.00 );
}
else
{
EDA_COLOR_T color = g_ColorsSettings.GetLayerColor( Edge_Cuts );
SetGLColor( color, 0.7 );
}
float copper_thickness = GetPrm3DVisu().GetCopperThicknessBIU();
// a small offset between substrate and external copper layer to avoid artifacts
// when drawing copper items on board
float epsilon = Millimeter2iu( 0.01 );
float zpos = GetPrm3DVisu().GetLayerZcoordBIU( B_Cu );
float board_thickness = GetPrm3DVisu().GetLayerZcoordBIU( F_Cu )
- GetPrm3DVisu().GetLayerZcoordBIU( B_Cu );
// items on copper layers and having a thickness = copper_thickness
// are drawn from zpos - copper_thickness/2 to zpos + copper_thickness
// therefore substrate position is copper_thickness/2 to
// substrate_height - copper_thickness/2
zpos += (copper_thickness + epsilon) / 2.0f;
board_thickness -= copper_thickness + epsilon;
bufferPcbOutlines.BooleanSubtract( allLayerHoles );
if( !bufferPcbOutlines.IsEmpty() )
{
Draw3D_SolidHorizontalPolyPolygons( bufferPcbOutlines, zpos + board_thickness / 2.0,
board_thickness, GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
1.0f );
}
glEndList();
}
bool PCB_EDIT_FRAME::Other_Layer_Route( TRACK* aTrack, wxDC* DC )
{
unsigned itmp;
if( aTrack == NULL )
{
if( GetActiveLayer() != GetScreen()->m_Route_Layer_TOP )
SetActiveLayer( GetScreen()->m_Route_Layer_TOP );
else
SetActiveLayer( GetScreen()->m_Route_Layer_BOTTOM );
UpdateStatusBar();
return true;
}
// Avoid more than one via on the current location:
if( GetBoard()->GetViaByPosition( g_CurrentTrackSegment->GetEnd(),
g_CurrentTrackSegment->GetLayer() ) )
return false;
for( TRACK* segm = g_FirstTrackSegment; segm; segm = segm->Next() )
{
if( segm->Type() == PCB_VIA_T && g_CurrentTrackSegment->GetEnd() == segm->GetStart() )
return false;
}
// Is the current segment Ok (no DRC error) ?
if( g_Drc_On )
{
if( BAD_DRC==m_drc->Drc( g_CurrentTrackSegment, GetBoard()->m_Track ) )
// DRC error, the change layer is not made
return false;
// Handle 2 segments.
if( g_TwoSegmentTrackBuild && g_CurrentTrackSegment->Back() )
{
if( BAD_DRC == m_drc->Drc( g_CurrentTrackSegment->Back(), GetBoard()->m_Track ) )
return false;
}
}
/* Save current state before placing a via.
* If the via cannot be placed this current state will be reused
*/
itmp = g_CurrentTrackList.GetCount();
Begin_Route( g_CurrentTrackSegment, DC );
m_canvas->CallMouseCapture( DC, wxDefaultPosition, false );
// create the via
VIA* via = new VIA( GetBoard() );
via->SetFlags( IS_NEW );
via->SetViaType( GetDesignSettings().m_CurrentViaType );
via->SetNetCode( GetBoard()->GetHighLightNetCode() );
via->SetPosition( g_CurrentTrackSegment->GetEnd() );
// for microvias, the size and hole will be changed later.
via->SetWidth( GetDesignSettings().GetCurrentViaSize());
via->SetDrill( GetDesignSettings().GetCurrentViaDrill() );
// Usual via is from copper to component.
// layer pair is B_Cu and F_Cu.
via->SetLayerPair( B_Cu, F_Cu );
LAYER_ID first_layer = GetActiveLayer();
LAYER_ID last_layer;
// prepare switch to new active layer:
if( first_layer != GetScreen()->m_Route_Layer_TOP )
last_layer = GetScreen()->m_Route_Layer_TOP;
else
last_layer = GetScreen()->m_Route_Layer_BOTTOM;
// Adjust the actual via layer pair
switch( via->GetViaType() )
{
case VIA_BLIND_BURIED:
via->SetLayerPair( first_layer, last_layer );
break;
case VIA_MICROVIA: // from external to the near neighbor inner layer
{
LAYER_ID last_inner_layer = ToLAYER_ID( ( GetBoard()->GetCopperLayerCount() - 2 ) );
if( first_layer == B_Cu )
last_layer = last_inner_layer;
else if( first_layer == F_Cu )
last_layer = In1_Cu;
else if( first_layer == last_inner_layer )
last_layer = B_Cu;
else if( first_layer == In1_Cu )
last_layer = F_Cu;
// else error: will be removed later
via->SetLayerPair( first_layer, last_layer );
// Update diameter and hole size, which where set previously
// for normal vias
NETINFO_ITEM* net = via->GetNet();
via->SetWidth( net->GetMicroViaSize() );
via->SetDrill( net->GetMicroViaDrillSize() );
}
break;
default:
break;
}
if( g_Drc_On && BAD_DRC == m_drc->Drc( via, GetBoard()->m_Track ) )
{
// DRC fault: the Via cannot be placed here ...
delete via;
m_canvas->CallMouseCapture( DC, wxDefaultPosition, false );
// delete the track(s) added in Begin_Route()
while( g_CurrentTrackList.GetCount() > itmp )
{
Delete_Segment( DC, g_CurrentTrackSegment );
}
SetCurItem( g_CurrentTrackSegment, false );
// Refresh DRC diag, erased by previous calls
if( m_drc->GetCurrentMarker() )
SetMsgPanel( m_drc->GetCurrentMarker() );
return false;
}
SetActiveLayer( last_layer );
TRACK* lastNonVia = g_CurrentTrackSegment;
/* A new via was created. It was Ok.
*/
g_CurrentTrackList.PushBack( via );
/* The via is now in linked list and we need a new track segment
* after the via, starting at via location.
* it will become the new current segment (from via to the mouse cursor)
*/
TRACK* track = (TRACK*)lastNonVia->Clone();
/* the above creates a new segment from the last entered segment, with the
* current width, flags, netcode, etc... values.
* layer, start and end point are not correct,
* and will be modified next
*/
// set the layer to the new value
track->SetLayer( GetActiveLayer() );
/* the start point is the via position and the end point is the cursor
* which also is on the via (will change when moving mouse)
*/
track->SetEnd( via->GetStart() );
track->SetStart( via->GetStart() );
g_CurrentTrackList.PushBack( track );
if( g_TwoSegmentTrackBuild )
{
// Create a second segment (we must have 2 track segments to adjust)
g_CurrentTrackList.PushBack( (TRACK*)g_CurrentTrackSegment->Clone() );
}
m_canvas->CallMouseCapture( DC, wxDefaultPosition, false );
SetMsgPanel( via );
UpdateStatusBar();
return true;
}