Ejemplo n.º 1
0
bool TRACKS_CLEANER::clean_vias()
{
    bool modified = false;

    for( VIA* via = GetFirstVia( m_Brd->m_Track ); via != NULL;
            via = GetFirstVia( via->Next() ) )
    {
        // Correct via m_End defects (if any), should never happen
        if( via->GetStart() != via->GetEnd() )
        {
            wxFAIL_MSG( wxT( "Via with mismatching ends" ) );
            via->SetEnd( via->GetStart() );
        }

        /* Important: these cleanups only do thru hole vias, they don't
         * (yet) handle high density interconnects */
        if( via->GetViaType() != VIA_THROUGH )
        {
            modified |= remove_duplicates_of_via( via );

            /* To delete through Via on THT pads at same location
             * Examine the list of connected pads:
             * if one through pad is found, the via can be removed */
            for( unsigned ii = 0; ii < via->m_PadsConnected.size(); ++ii )
            {
                const D_PAD *pad = via->m_PadsConnected[ii];

                const LSET all_cu = LSET::AllCuMask();

                if( (pad->GetLayerSet() & all_cu) == all_cu )
                {
                    // redundant: delete the via
                    m_Brd->GetRatsnest()->Remove( via );
                    via->ViewRelease();
                    via->DeleteStructure();
                    modified = true;
                    break;
                }
            }
        }
    }

    return modified;
}
void EXCELLON_WRITER::BuildHolesList( LAYER_PAIR aLayerPair,
                                      bool aGenerateNPTH_list )
{
    HOLE_INFO new_hole;

    m_holeListBuffer.clear();
    m_toolListBuffer.clear();

    wxASSERT(  aLayerPair.first < aLayerPair.second );  // fix the caller

    // build hole list for vias
    if( ! aGenerateNPTH_list )  // vias are always plated !
    {
        for( VIA* via = GetFirstVia( m_pcb->m_Track ); via; via = GetFirstVia( via->Next() ) )
        {
            int hole_sz = via->GetDrillValue();

            if( hole_sz == 0 )   // Should not occur.
                continue;

            new_hole.m_Tool_Reference = -1;         // Flag value for Not initialized
            new_hole.m_Hole_Orient    = 0;
            new_hole.m_Hole_Diameter  = hole_sz;
            new_hole.m_Hole_NotPlated = false;
            new_hole.m_Hole_Size.x = new_hole.m_Hole_Size.y = new_hole.m_Hole_Diameter;

            new_hole.m_Hole_Shape = 0;              // hole shape: round
            new_hole.m_Hole_Pos = via->GetStart();

            via->LayerPair( &new_hole.m_Hole_Top_Layer, &new_hole.m_Hole_Bottom_Layer );

            // LayerPair() returns params with m_Hole_Bottom_Layer > m_Hole_Top_Layer
            // Remember: top layer = 0 and bottom layer = 31 for through hole vias
            // Any captured via should be from aLayerPair.first to aLayerPair.second exactly.
            if( new_hole.m_Hole_Top_Layer    != aLayerPair.first ||
                new_hole.m_Hole_Bottom_Layer != aLayerPair.second )
                continue;

            m_holeListBuffer.push_back( new_hole );
        }
    }

    if( aLayerPair == LAYER_PAIR( F_Cu, B_Cu ) )
    {
        // add holes for thru hole pads
        for( MODULE* module = m_pcb->m_Modules;  module;  module = module->Next() )
        {
            for( D_PAD* pad = module->Pads();  pad;  pad = pad->Next() )
            {
                if( !m_merge_PTH_NPTH )
                {
                    if( !aGenerateNPTH_list && pad->GetAttribute() == PAD_ATTRIB_HOLE_NOT_PLATED )
                        continue;

                    if( aGenerateNPTH_list && pad->GetAttribute() != PAD_ATTRIB_HOLE_NOT_PLATED )
                        continue;
                }

                if( pad->GetDrillSize().x == 0 )
                    continue;

                new_hole.m_Hole_NotPlated = (pad->GetAttribute() == PAD_ATTRIB_HOLE_NOT_PLATED);
                new_hole.m_Tool_Reference = -1;         // Flag is: Not initialized
                new_hole.m_Hole_Orient    = pad->GetOrientation();
                new_hole.m_Hole_Shape     = 0;           // hole shape: round
                new_hole.m_Hole_Diameter  = std::min( pad->GetDrillSize().x, pad->GetDrillSize().y );
                new_hole.m_Hole_Size.x    = new_hole.m_Hole_Size.y = new_hole.m_Hole_Diameter;

                if( pad->GetDrillShape() != PAD_DRILL_SHAPE_CIRCLE )
                    new_hole.m_Hole_Shape = 1; // oval flag set

                new_hole.m_Hole_Size         = pad->GetDrillSize();
                new_hole.m_Hole_Pos          = pad->GetPosition();  // hole position
                new_hole.m_Hole_Bottom_Layer = B_Cu;
                new_hole.m_Hole_Top_Layer    = F_Cu;    // pad holes are through holes
                m_holeListBuffer.push_back( new_hole );
            }
        }
    }

    // Sort holes per increasing diameter value
    sort( m_holeListBuffer.begin(), m_holeListBuffer.end(), CmpHoleSettings );

    // build the tool list
    int last_hole = -1;     // Set to not initialized (this is a value not used
                            // for m_holeListBuffer[ii].m_Hole_Diameter)
    bool last_notplated_opt = false;

    DRILL_TOOL new_tool( 0, false );
    unsigned   jj;

    for( unsigned ii = 0; ii < m_holeListBuffer.size(); ii++ )
    {
        if( m_holeListBuffer[ii].m_Hole_Diameter != last_hole ||
            m_holeListBuffer[ii].m_Hole_NotPlated != last_notplated_opt )
        {
            new_tool.m_Diameter = m_holeListBuffer[ii].m_Hole_Diameter;
            new_tool.m_Hole_NotPlated = m_holeListBuffer[ii].m_Hole_NotPlated;
            m_toolListBuffer.push_back( new_tool );
            last_hole = new_tool.m_Diameter;
            last_notplated_opt = new_tool.m_Hole_NotPlated;
        }

        jj = m_toolListBuffer.size();

        if( jj == 0 )
            continue;                                        // Should not occurs

        m_holeListBuffer[ii].m_Tool_Reference = jj;          // Tool value Initialized (value >= 1)

        m_toolListBuffer.back().m_TotalCount++;

        if( m_holeListBuffer[ii].m_Hole_Shape )
            m_toolListBuffer.back().m_OvalCount++;
    }
}
void EXCELLON_WRITER::BuildHolesList( int aFirstLayer,
                                      int aLastLayer,
                                      bool aExcludeThroughHoles,
                                      bool aGenerateNPTH_list,
                                      bool aMerge_PTH_NPTH )
{
    HOLE_INFO new_hole;
    int       hole_value;

    m_holeListBuffer.clear();
    m_toolListBuffer.clear();

    if( (aFirstLayer >= 0) && (aLastLayer >= 0) )
    {
        if( aFirstLayer > aLastLayer )
            std::swap( aFirstLayer, aLastLayer );
    }

    if ( aGenerateNPTH_list && aMerge_PTH_NPTH )
    {
        return;
    }

    // build hole list for vias
    if( ! aGenerateNPTH_list )  // vias are always plated !
    {
        for( VIA* via = GetFirstVia( m_pcb->m_Track ); via; via = GetFirstVia( via->Next() ) )
        {
            hole_value = via->GetDrillValue();

            if( hole_value == 0 )   // Should not occur.
                continue;

            new_hole.m_Tool_Reference = -1;         // Flag value for Not initialized
            new_hole.m_Hole_Orient    = 0;
            new_hole.m_Hole_Diameter  = hole_value;
            new_hole.m_Hole_Size.x = new_hole.m_Hole_Size.y = new_hole.m_Hole_Diameter;

            new_hole.m_Hole_Shape = 0;              // hole shape: round
            new_hole.m_Hole_Pos = via->GetStart();

            via->LayerPair( &new_hole.m_Hole_Top_Layer, &new_hole.m_Hole_Bottom_Layer );

            // LayerPair return params with m_Hole_Bottom_Layer > m_Hole_Top_Layer
            // Remember: top layer = 0 and bottom layer = 31 for through hole vias
            // the via should be at least from aFirstLayer to aLastLayer
            if( (new_hole.m_Hole_Top_Layer > aFirstLayer) && (aFirstLayer >= 0) )
                continue;   // via above the first layer

            if( (new_hole.m_Hole_Bottom_Layer < aLastLayer) && (aLastLayer >= 0) )
                continue;   // via below the last layer

            if( aExcludeThroughHoles && (new_hole.m_Hole_Bottom_Layer == B_Cu)
               && (new_hole.m_Hole_Top_Layer == F_Cu) )
                continue;

            m_holeListBuffer.push_back( new_hole );
        }
    }

    // build hole list for pads (assumed always through holes)
    if( !aExcludeThroughHoles || aGenerateNPTH_list )
    {
        for( MODULE* module = m_pcb->m_Modules;  module;  module = module->Next() )
        {
            // Read and analyse pads
            for( D_PAD* pad = module->Pads();  pad;  pad = pad->Next() )
            {
                if( ! aGenerateNPTH_list &&
                    pad->GetAttribute() == PAD_HOLE_NOT_PLATED &&
                    ! aMerge_PTH_NPTH )
                    continue;

                if( aGenerateNPTH_list && pad->GetAttribute() != PAD_HOLE_NOT_PLATED )
                    continue;

                if( pad->GetDrillSize().x == 0 )
                    continue;

                new_hole.m_Hole_NotPlated = (pad->GetAttribute() == PAD_HOLE_NOT_PLATED);
                new_hole.m_Tool_Reference = -1;         // Flag is: Not initialized
                new_hole.m_Hole_Orient    = pad->GetOrientation();
                new_hole.m_Hole_Shape     = 0;           // hole shape: round
                new_hole.m_Hole_Diameter  = std::min( pad->GetDrillSize().x, pad->GetDrillSize().y );
                new_hole.m_Hole_Size.x    = new_hole.m_Hole_Size.y = new_hole.m_Hole_Diameter;

                if( pad->GetDrillShape() != PAD_DRILL_CIRCLE )
                    new_hole.m_Hole_Shape = 1; // oval flag set

                new_hole.m_Hole_Size         = pad->GetDrillSize();
                new_hole.m_Hole_Pos          = pad->GetPosition();               // hole position
                new_hole.m_Hole_Bottom_Layer = B_Cu;
                new_hole.m_Hole_Top_Layer    = F_Cu;// pad holes are through holes
                m_holeListBuffer.push_back( new_hole );
            }
        }
    }

    // Sort holes per increasing diameter value
    sort( m_holeListBuffer.begin(), m_holeListBuffer.end(), CmpHoleDiameterValue );

    // build the tool list
    int        LastHole = -1; /* Set to not initialized (this is a value not used
                               * for m_holeListBuffer[ii].m_Hole_Diameter) */
    DRILL_TOOL new_tool( 0 );
    unsigned   jj;

    for( unsigned ii = 0; ii < m_holeListBuffer.size(); ii++ )
    {
        if( m_holeListBuffer[ii].m_Hole_Diameter != LastHole )
        {
            new_tool.m_Diameter = ( m_holeListBuffer[ii].m_Hole_Diameter );
            m_toolListBuffer.push_back( new_tool );
            LastHole = new_tool.m_Diameter;
        }

        jj = m_toolListBuffer.size();

        if( jj == 0 )
            continue;                                        // Should not occurs

        m_holeListBuffer[ii].m_Tool_Reference = jj;          // Tool value Initialized (value >= 1)

        m_toolListBuffer.back().m_TotalCount++;

        if( m_holeListBuffer[ii].m_Hole_Shape )
            m_toolListBuffer.back().m_OvalCount++;
    }
}
void EDA_3D_CANVAS::buildBoardThroughHolesPolygonList( SHAPE_POLY_SET& allBoardHoles,
                                                int aSegCountPerCircle, bool aOptimizeLargeCircles )
{
    // hole diameter value to change seg count by circle:
    int small_hole_limit = Millimeter2iu( 1.0 );
    int copper_thickness = GetPrm3DVisu().GetCopperThicknessBIU();

    BOARD* pcb = GetBoard();

    // Build holes of through vias:
    for( TRACK* track = pcb->m_Track;  track;  track = track->Next() )
    {
        if( track->Type() != PCB_VIA_T )
            continue;

        VIA *via = static_cast<VIA*>( track );

        if( via->GetViaType() != VIA_THROUGH )
            continue;

        int holediameter = via->GetDrillValue();
        int hole_outer_radius = (holediameter + copper_thickness) / 2;

        TransformCircleToPolygon( allBoardHoles,
                                  via->GetStart(), hole_outer_radius,
                                  aSegCountPerCircle );
    }

    // Build holes of through pads:
    for( MODULE* footprint = pcb->m_Modules; footprint; footprint = footprint->Next() )
    {
        for( D_PAD* pad = footprint->Pads(); pad; pad = pad->Next() )
        {
            // Calculate a factor to apply to segcount for large holes ( > 1 mm)
            // (bigger pad drill size -> more segments) because holes in pads can have
            // very different sizes and optimizing this segcount gives a better look
            // Mainly mounting holes have a size bigger than small_hole_limit
            wxSize padHole = pad->GetDrillSize();

            if( ! padHole.x )       // Not drilled pad like SMD pad
                continue;

            // we use the hole diameter to calculate the seg count.
            // for round holes, padHole.x == padHole.y
            // for oblong holes, the diameter is the smaller of (padHole.x, padHole.y)
            int diam = std::min( padHole.x, padHole.y );
            int segcount = aSegCountPerCircle;

            if( diam > small_hole_limit )
            {
                double segFactor = (double)diam / small_hole_limit;
                segcount = (int)(aSegCountPerCircle * segFactor);

                // limit segcount to 48. For a circle this is a very good approx.
                if( segcount > 48 )
                    segcount = 48;
            }

            // The hole in the body is inflated by copper thickness.
            int inflate = copper_thickness;

            // If not plated, no copper.
            if( pad->GetAttribute () == PAD_HOLE_NOT_PLATED )
                inflate = 0;

            pad->BuildPadDrillShapePolygon( allBoardHoles, inflate, segcount );
        }
    }

    allBoardHoles.Simplify();
}
void EDA_3D_CANVAS::buildBoard3DView( GLuint aBoardList, GLuint aBodyOnlyList,
                                      REPORTER* aErrorMessages, REPORTER* aActivity  )
{
    BOARD* pcb = GetBoard();

    // If FL_RENDER_SHOW_HOLES_IN_ZONES is true, holes are correctly removed from copper zones areas.
    // If FL_RENDER_SHOW_HOLES_IN_ZONES is false, holes are not removed from copper zones areas,
    // but the calculation time is twice shorter.
    bool remove_Holes = isEnabled( FL_RENDER_SHOW_HOLES_IN_ZONES );

    bool realistic_mode = isRealisticMode();
    bool useTextures = isRealisticMode() && isEnabled( FL_RENDER_TEXTURES );

    // Number of segments to convert a circle to polygon
    // We use 2 values: the first gives a good shape (for instanes rond pads)
    // the second is used to speed up calculations, when a poor approximation is acceptable (holes)
    const int       segcountforcircle   = 18;
    double          correctionFactor    = 1.0 / cos( M_PI / (segcountforcircle * 2.0) );
    const int       segcountLowQuality  = 12;   // segments to draw a circle with low quality
                                                // to reduce time calculations
                                                // for holes and items which do not need
                                                // a fine representation
    double          correctionFactorLQ  = 1.0 / cos( M_PI / (segcountLowQuality * 2.0) );

    SHAPE_POLY_SET  bufferPolys;        // copper areas: tracks, pads and filled zones areas
                                        // when holes are removed from zones
    SHAPE_POLY_SET  bufferPcbOutlines;  // stores the board main outlines
    SHAPE_POLY_SET  bufferZonesPolys;   // copper filled zones areas
                                        // when holes are not removed from zones
    SHAPE_POLY_SET  currLayerHoles;     // Contains holes for the current layer
    SHAPE_POLY_SET  allLayerHoles;      // Contains holes for all layers

    // Build a polygon from edge cut items
    wxString msg;

    if( !pcb->GetBoardPolygonOutlines( bufferPcbOutlines, allLayerHoles, &msg ) )
    {
        if( aErrorMessages )
        {
            msg << wxT("\n") << _("Unable to calculate the board outlines.\n"
                                  "Therefore use the board boundary box.") << wxT("\n\n");

            aErrorMessages->Report( msg, REPORTER::RPT_WARNING );
        }
    }

    // Build board holes, with optimization of large holes shape.
    buildBoardThroughHolesPolygonList( allLayerHoles, segcountLowQuality, true );

    LSET            cu_set = LSET::AllCuMask( GetPrm3DVisu().m_CopperLayersCount );

    glNewList( aBoardList, GL_COMPILE );

    for( LSEQ cu = cu_set.CuStack();  cu;  ++cu )
    {
        LAYER_ID layer = *cu;

        // Skip non enabled layers in normal mode,
        // and internal layers in realistic mode
        if( !is3DLayerEnabled( layer ) )
            continue;

        if( aActivity )
            aActivity->Report( wxString::Format( _( "Build layer %s" ), LSET::Name( layer ) ) );

        bufferPolys.RemoveAllContours();
        bufferZonesPolys.RemoveAllContours();
        currLayerHoles.RemoveAllContours();

        // Draw track shapes:
        for( TRACK* track = pcb->m_Track;  track;  track = track->Next() )
        {
            if( !track->IsOnLayer( layer ) )
                continue;

            track->TransformShapeWithClearanceToPolygon( bufferPolys,
                                                         0, segcountforcircle,
                                                         correctionFactor );

            // Add blind/buried via holes
            if( track->Type() == PCB_VIA_T )
            {
                VIA *via = static_cast<VIA*>( track );

                if( via->GetViaType() == VIA_THROUGH )
                    continue;   // already done

                int holediameter = via->GetDrillValue();
                int thickness = GetPrm3DVisu().GetCopperThicknessBIU();
                int hole_outer_radius = (holediameter + thickness) / 2;

                TransformCircleToPolygon( currLayerHoles,
                                          via->GetStart(), hole_outer_radius,
                                          segcountLowQuality );
            }
        }

        // draw pad shapes
        for( MODULE* module = pcb->m_Modules;  module;  module = module->Next() )
        {
            // Note: NPTH pads are not drawn on copper layers when the pad
            // has same shape as its hole
            module->TransformPadsShapesWithClearanceToPolygon( layer,
                                                               bufferPolys,
                                                               0,
                                                               segcountforcircle,
                                                               correctionFactor, true );

            // Micro-wave modules may have items on copper layers
            module->TransformGraphicShapesWithClearanceToPolygonSet( layer,
                                                                     bufferPolys,
                                                                     0,
                                                                     segcountforcircle,
                                                                     correctionFactor );

            // pad holes are already in list.
        }

        // Draw copper zones. Note:
        // * if the holes are removed from copper zones
        // the polygons are stored in bufferPolys (which contains all other polygons)
        // * if the holes are NOT removed from copper zones
        // the polygons are stored in bufferZonesPolys
        if( isEnabled( FL_ZONE ) )
        {
            for( int ii = 0; ii < pcb->GetAreaCount(); ii++ )
            {
                ZONE_CONTAINER* zone = pcb->GetArea( ii );
                LAYER_NUM       zonelayer = zone->GetLayer();

                if( zonelayer == layer )
                {
                    zone->TransformSolidAreasShapesToPolygonSet(
                        remove_Holes ? bufferPolys : bufferZonesPolys,
                        segcountLowQuality, correctionFactorLQ );
                }
            }
        }

        // draw graphic items on copper layers (texts)
        for( BOARD_ITEM* item = pcb->m_Drawings; item; item = item->Next() )
        {
            if( !item->IsOnLayer( layer ) )
                continue;

            switch( item->Type() )
            {
            case PCB_LINE_T:    // should not exist on copper layers
                ( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon(
                    bufferPolys, 0, segcountforcircle, correctionFactor );
                break;

            case PCB_TEXT_T:
                ( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet(
                    bufferPolys, 0, segcountLowQuality, correctionFactor );
                break;

            default:
                break;
            }
        }

        // bufferPolys contains polygons to merge. Many overlaps .
        // Calculate merged polygons
        if( bufferPolys.IsEmpty() )
            continue;

        // Use Clipper lib to subtract holes to copper areas
        if( currLayerHoles.OutlineCount() )
        {
            currLayerHoles.Append(allLayerHoles);
            currLayerHoles.Simplify();
            bufferPolys.BooleanSubtract( currLayerHoles );
        }
        else
            bufferPolys.BooleanSubtract( allLayerHoles );

        int thickness = GetPrm3DVisu().GetLayerObjectThicknessBIU( layer );
        int zpos = GetPrm3DVisu().GetLayerZcoordBIU( layer );

        float zNormal = 1.0f; // When using thickness it will draw first the top and then botton (with z inverted)

        // If we are not using thickness, then the z-normal has to match the layer direction
        // because just one plane will be drawn
        if( !thickness )
            zNormal = Get3DLayer_Z_Orientation( layer );

        if( realistic_mode )
        {
            setGLCopperColor();
        }
        else
        {
            EDA_COLOR_T color = g_ColorsSettings.GetLayerColor( layer );
            SetGLColor( color );
        }

        // If holes are removed from copper zones, bufferPolys contains all polygons
        // to draw (tracks+zones+texts).
        Draw3D_SolidHorizontalPolyPolygons( bufferPolys, zpos, thickness,
                                            GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
                                            zNormal );

        // If holes are not removed from copper zones (for calculation time reasons,
        // the zone polygons are stored in bufferZonesPolys and have to be drawn now:
        if( !bufferZonesPolys.IsEmpty() )
        {
            Draw3D_SolidHorizontalPolyPolygons( bufferZonesPolys, zpos, thickness,
                                    GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
                                    zNormal );
        }
    }

    if( aActivity )
        aActivity->Report( _( "Build board body" ) );

    // Draw plated vertical holes inside the board, but not always. They are drawn:
    // - if the board body is not shown, to show the holes.
    // - or if the copper thickness is shown
    if( !isEnabled( FL_SHOW_BOARD_BODY ) || isEnabled( FL_USE_COPPER_THICKNESS ) )
    {
        // Draw vias holes (vertical cylinders)
        for( const TRACK* track = pcb->m_Track;  track;  track = track->Next() )
        {
            if( track->Type() == PCB_VIA_T )
            {
                const VIA *via = static_cast<const VIA*>(track);
                draw3DViaHole( via );
            }
        }

        // Draw pads holes (vertical cylinders)
        for( const MODULE* module = pcb->m_Modules;  module;  module = module->Next() )
        {
            for( D_PAD* pad = module->Pads(); pad; pad = pad->Next() )
                if( pad->GetAttribute () != PAD_HOLE_NOT_PLATED )
                    draw3DPadHole( pad );
        }
    }

    glEndList();

    // Build the body board:
    glNewList( aBodyOnlyList, GL_COMPILE );

    if( isRealisticMode() )
    {
        setGLEpoxyColor( 1.00 );
    }
    else
    {
        EDA_COLOR_T color = g_ColorsSettings.GetLayerColor( Edge_Cuts );
        SetGLColor( color, 0.7 );
    }

    float copper_thickness = GetPrm3DVisu().GetCopperThicknessBIU();

    // a small offset between substrate and external copper layer to avoid artifacts
    // when drawing copper items on board
    float epsilon = Millimeter2iu( 0.01 );
    float zpos = GetPrm3DVisu().GetLayerZcoordBIU( B_Cu );
    float board_thickness = GetPrm3DVisu().GetLayerZcoordBIU( F_Cu )
                        - GetPrm3DVisu().GetLayerZcoordBIU( B_Cu );

    // items on copper layers and having a thickness = copper_thickness
    // are drawn from zpos - copper_thickness/2 to zpos + copper_thickness
    // therefore substrate position is copper_thickness/2 to
    // substrate_height - copper_thickness/2
    zpos += (copper_thickness + epsilon) / 2.0f;
    board_thickness -= copper_thickness + epsilon;

    bufferPcbOutlines.BooleanSubtract( allLayerHoles );

    if( !bufferPcbOutlines.IsEmpty() )
    {
        Draw3D_SolidHorizontalPolyPolygons( bufferPcbOutlines, zpos + board_thickness / 2.0,
                                            board_thickness, GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
                                            1.0f );
    }

    glEndList();
}
bool PCB_EDIT_FRAME::Other_Layer_Route( TRACK* aTrack, wxDC* DC )
{
    unsigned    itmp;

    if( aTrack == NULL )
    {
        if( GetActiveLayer() != GetScreen()->m_Route_Layer_TOP )
            SetActiveLayer( GetScreen()->m_Route_Layer_TOP );
        else
            SetActiveLayer( GetScreen()->m_Route_Layer_BOTTOM );

        UpdateStatusBar();
        return true;
    }

    // Avoid more than one via on the current location:
    if( GetBoard()->GetViaByPosition( g_CurrentTrackSegment->GetEnd(),
                                      g_CurrentTrackSegment->GetLayer() ) )
        return false;

    for( TRACK* segm = g_FirstTrackSegment;  segm;  segm = segm->Next() )
    {
        if( segm->Type() == PCB_VIA_T && g_CurrentTrackSegment->GetEnd() == segm->GetStart() )
            return false;
    }

    // Is the current segment Ok (no DRC error) ?
    if( g_Drc_On )
    {
        if( BAD_DRC==m_drc->Drc( g_CurrentTrackSegment, GetBoard()->m_Track ) )
            // DRC error, the change layer is not made
            return false;

        // Handle 2 segments.
        if( g_TwoSegmentTrackBuild && g_CurrentTrackSegment->Back() )
        {
            if( BAD_DRC == m_drc->Drc( g_CurrentTrackSegment->Back(), GetBoard()->m_Track ) )
                return false;
        }
    }

    /* Save current state before placing a via.
     * If the via cannot be placed this current state will be reused
     */
    itmp = g_CurrentTrackList.GetCount();
    Begin_Route( g_CurrentTrackSegment, DC );

    m_canvas->CallMouseCapture( DC, wxDefaultPosition, false );

    // create the via
    VIA* via = new VIA( GetBoard() );
    via->SetFlags( IS_NEW );
    via->SetViaType( GetDesignSettings().m_CurrentViaType );
    via->SetNetCode( GetBoard()->GetHighLightNetCode() );
    via->SetPosition( g_CurrentTrackSegment->GetEnd() );

    // for microvias, the size and hole will be changed later.
    via->SetWidth( GetDesignSettings().GetCurrentViaSize());
    via->SetDrill( GetDesignSettings().GetCurrentViaDrill() );

    // Usual via is from copper to component.
    // layer pair is B_Cu and F_Cu.
    via->SetLayerPair( B_Cu, F_Cu );

    LAYER_ID first_layer = GetActiveLayer();
    LAYER_ID last_layer;

    // prepare switch to new active layer:
    if( first_layer != GetScreen()->m_Route_Layer_TOP )
        last_layer = GetScreen()->m_Route_Layer_TOP;
    else
        last_layer = GetScreen()->m_Route_Layer_BOTTOM;

    // Adjust the actual via layer pair
    switch( via->GetViaType() )
    {
    case VIA_BLIND_BURIED:
        via->SetLayerPair( first_layer, last_layer );
        break;

    case VIA_MICROVIA:  // from external to the near neighbor inner layer
        {
            LAYER_ID last_inner_layer = ToLAYER_ID( ( GetBoard()->GetCopperLayerCount() - 2 ) );

            if( first_layer == B_Cu )
                last_layer = last_inner_layer;
            else if( first_layer == F_Cu )
                last_layer = In1_Cu;
            else if( first_layer == last_inner_layer )
                last_layer = B_Cu;
            else if( first_layer == In1_Cu )
                last_layer = F_Cu;
            // else error: will be removed later
            via->SetLayerPair( first_layer, last_layer );

            // Update diameter and hole size, which where set previously
            // for normal vias
            NETINFO_ITEM* net = via->GetNet();
            via->SetWidth( net->GetMicroViaSize() );
            via->SetDrill( net->GetMicroViaDrillSize() );
        }
        break;

    default:
        break;
    }

    if( g_Drc_On && BAD_DRC == m_drc->Drc( via, GetBoard()->m_Track ) )
    {
        // DRC fault: the Via cannot be placed here ...
        delete via;

        m_canvas->CallMouseCapture( DC, wxDefaultPosition, false );

        // delete the track(s) added in Begin_Route()
        while( g_CurrentTrackList.GetCount() > itmp )
        {
            Delete_Segment( DC, g_CurrentTrackSegment );
        }

         SetCurItem( g_CurrentTrackSegment, false );

        // Refresh DRC diag, erased by previous calls
        if( m_drc->GetCurrentMarker() )
            SetMsgPanel( m_drc->GetCurrentMarker() );

        return false;
    }

    SetActiveLayer( last_layer );

    TRACK*  lastNonVia = g_CurrentTrackSegment;

    /* A new via was created. It was Ok.
     */
    g_CurrentTrackList.PushBack( via );

    /* The via is now in linked list and we need a new track segment
     * after the via, starting at via location.
     * it will become the new current segment (from via to the mouse cursor)
     */

    TRACK* track = (TRACK*)lastNonVia->Clone();

    /* the above creates a new segment from the last entered segment, with the
     * current width, flags, netcode, etc... values.
     * layer, start and end point are not correct,
     * and will be modified next
     */

    // set the layer to the new value
    track->SetLayer( GetActiveLayer() );

    /* the start point is the via position and the end point is the cursor
     * which also is on the via (will change when moving mouse)
     */
    track->SetEnd( via->GetStart() );
    track->SetStart( via->GetStart() );

    g_CurrentTrackList.PushBack( track );

    if( g_TwoSegmentTrackBuild )
    {
        // Create a second segment (we must have 2 track segments to adjust)
        g_CurrentTrackList.PushBack( (TRACK*)g_CurrentTrackSegment->Clone() );
    }

    m_canvas->CallMouseCapture( DC, wxDefaultPosition, false );
    SetMsgPanel( via );
    UpdateStatusBar();

    return true;
}