void EDA_3D_CANVAS::buildTechLayers3DView( REPORTER* aErrorMessages, REPORTER* aActivity )
{
    BOARD* pcb = GetBoard();
    bool useTextures = isRealisticMode() && isEnabled( FL_RENDER_TEXTURES );

    // Number of segments to draw a circle using segments
    const int       segcountforcircle   = 18;
    double          correctionFactor    = 1.0 / cos( M_PI / (segcountforcircle * 2) );
    const int       segcountLowQuality  = 12;   // segments to draw a circle with low quality
                                                // to reduce time calculations
                                                // for holes and items which do not need
                                                // a fine representation

    double          correctionFactorLQ = 1.0 / cos( M_PI / (segcountLowQuality * 2) );

    // segments to draw a circle to build texts. Is is used only to build
    // the shape of each segment of the stroke font, therefore no need to have
    // many segments per circle.
    const int       segcountInStrokeFont = 8;

    SHAPE_POLY_SET bufferPolys;
    SHAPE_POLY_SET allLayerHoles;              // Contains through holes, calculated only once
    SHAPE_POLY_SET bufferPcbOutlines;          // stores the board main outlines

    // Build a polygon from edge cut items
    wxString msg;

    if( !pcb->GetBoardPolygonOutlines( bufferPcbOutlines, allLayerHoles, &msg ) )
    {
        if( aErrorMessages )
        {
            msg << wxT("\n") <<
                _("Unable to calculate the board outlines.\n"
                  "Therefore use the board boundary box.") << wxT("\n\n");
            aErrorMessages->Report( msg, REPORTER::RPT_WARNING );
        }
    }

    // Build board holes, with no optimization of large holes shape.
    buildBoardThroughHolesPolygonList( allLayerHoles, segcountLowQuality, false );

    // draw graphic items, on technical layers

    static const LAYER_ID teckLayerList[] = {
        B_Adhes,
        F_Adhes,
        B_Paste,
        F_Paste,
        B_SilkS,
        F_SilkS,
        B_Mask,
        F_Mask,
    };

    // User layers are not drawn here, only technical layers
    for( LSEQ seq = LSET::AllTechMask().Seq( teckLayerList, DIM( teckLayerList ) );  seq;  ++seq )
    {
        LAYER_ID layer = *seq;

        if( !is3DLayerEnabled( layer ) )
            continue;

        if( layer == Edge_Cuts && isEnabled( FL_SHOW_BOARD_BODY )  )
            continue;

        if( aActivity )
            aActivity->Report( wxString::Format( _( "Build layer %s" ), LSET::Name( layer ) ) );

        bufferPolys.RemoveAllContours();

        for( BOARD_ITEM* item = pcb->m_Drawings; item; item = item->Next() )
        {
            if( !item->IsOnLayer( layer ) )
                continue;

            switch( item->Type() )
            {
            case PCB_LINE_T:
                ( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon(
                        bufferPolys, 0, segcountforcircle, correctionFactor );
                break;

            case PCB_TEXT_T:
                ( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet(
                        bufferPolys, 0, segcountLowQuality, 1.0 );
                break;

            default:
                break;
            }
        }

        for( MODULE* module = pcb->m_Modules; module; module = module->Next() )
        {
            if( layer == F_SilkS || layer == B_SilkS )
            {
                // On silk screen layers, the pad shape is only the pad outline
                // never a filled shape
                D_PAD*  pad = module->Pads();
                int     linewidth = g_DrawDefaultLineThickness;

                for( ; pad; pad = pad->Next() )
                {
                    if( !pad->IsOnLayer( layer ) )
                        continue;

                    buildPadShapeThickOutlineAsPolygon( pad, bufferPolys,
                            linewidth, segcountforcircle, correctionFactor );
                }
            }
            else
                module->TransformPadsShapesWithClearanceToPolygon( layer,
                        bufferPolys, 0, segcountforcircle, correctionFactor );

            // On tech layers, use a poor circle approximation, only for texts (stroke font)
            module->TransformGraphicShapesWithClearanceToPolygonSet( layer,
                    bufferPolys, 0, segcountforcircle, correctionFactor, segcountInStrokeFont );
        }

        // Draw non copper zones
        if( isEnabled( FL_ZONE ) )
        {
            for( int ii = 0; ii < pcb->GetAreaCount(); ii++ )
            {
                ZONE_CONTAINER* zone = pcb->GetArea( ii );

                if( !zone->IsOnLayer( layer ) )
                    continue;

                zone->TransformSolidAreasShapesToPolygonSet(
                        bufferPolys, segcountLowQuality, correctionFactorLQ );
            }
        }

        // bufferPolys contains polygons to merge. Many overlaps .
        // Calculate merged polygons and remove pads and vias holes
        if( bufferPolys.IsEmpty() )
            continue;

        // Solder mask layers are "negative" layers.
        // Shapes should be removed from the full board area.
        if( layer == B_Mask || layer == F_Mask )
        {
            SHAPE_POLY_SET cuts = bufferPolys;
            bufferPolys = bufferPcbOutlines;

            cuts.Append(allLayerHoles);
            cuts.Simplify();

            bufferPolys.BooleanSubtract( cuts );
        }
        // Remove holes from Solder paste layers and silkscreen
        else if( layer == B_Paste || layer == F_Paste
                 || layer == B_SilkS || layer == F_SilkS  )
        {
            bufferPolys.BooleanSubtract( allLayerHoles );
        }

        int thickness = 0;

        if( layer != B_Mask && layer != F_Mask )
            thickness = GetPrm3DVisu().GetLayerObjectThicknessBIU( layer );

        int zpos = GetPrm3DVisu().GetLayerZcoordBIU( layer );

        if( layer == Edge_Cuts )
        {
            thickness = GetPrm3DVisu().GetLayerZcoordBIU( F_Cu )
                        - GetPrm3DVisu().GetLayerZcoordBIU( B_Cu );
            zpos = GetPrm3DVisu().GetLayerZcoordBIU( B_Cu )
                   + (thickness / 2);
        }
        else
        {
            // for Draw3D_SolidHorizontalPolyPolygons, zpos it the middle between bottom and top
            // sides.
            // However for top layers, zpos should be the bottom layer pos,
            // and for bottom layers, zpos should be the top layer pos.
            if( Get3DLayer_Z_Orientation( layer ) > 0 )
                zpos += thickness/2;
            else
                zpos -= thickness/2 ;
        }


        float zNormal = 1.0f; // When using thickness it will draw first the top and then botton (with z inverted)

        // If we are not using thickness, then the znormal must face the layer direction
        // because it will draw just one plane
        if( !thickness )
            zNormal = Get3DLayer_Z_Orientation( layer );


        setGLTechLayersColor( layer );
        Draw3D_SolidHorizontalPolyPolygons( bufferPolys, zpos,
                thickness, GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
                zNormal );
    }
}
void EDA_3D_CANVAS::buildBoard3DView( GLuint aBoardList, GLuint aBodyOnlyList,
                                      REPORTER* aErrorMessages, REPORTER* aActivity  )
{
    BOARD* pcb = GetBoard();

    // If FL_RENDER_SHOW_HOLES_IN_ZONES is true, holes are correctly removed from copper zones areas.
    // If FL_RENDER_SHOW_HOLES_IN_ZONES is false, holes are not removed from copper zones areas,
    // but the calculation time is twice shorter.
    bool remove_Holes = isEnabled( FL_RENDER_SHOW_HOLES_IN_ZONES );

    bool realistic_mode = isRealisticMode();
    bool useTextures = isRealisticMode() && isEnabled( FL_RENDER_TEXTURES );

    // Number of segments to convert a circle to polygon
    // We use 2 values: the first gives a good shape (for instanes rond pads)
    // the second is used to speed up calculations, when a poor approximation is acceptable (holes)
    const int       segcountforcircle   = 18;
    double          correctionFactor    = 1.0 / cos( M_PI / (segcountforcircle * 2.0) );
    const int       segcountLowQuality  = 12;   // segments to draw a circle with low quality
                                                // to reduce time calculations
                                                // for holes and items which do not need
                                                // a fine representation
    double          correctionFactorLQ  = 1.0 / cos( M_PI / (segcountLowQuality * 2.0) );

    SHAPE_POLY_SET  bufferPolys;        // copper areas: tracks, pads and filled zones areas
                                        // when holes are removed from zones
    SHAPE_POLY_SET  bufferPcbOutlines;  // stores the board main outlines
    SHAPE_POLY_SET  bufferZonesPolys;   // copper filled zones areas
                                        // when holes are not removed from zones
    SHAPE_POLY_SET  currLayerHoles;     // Contains holes for the current layer
    SHAPE_POLY_SET  allLayerHoles;      // Contains holes for all layers

    // Build a polygon from edge cut items
    wxString msg;

    if( !pcb->GetBoardPolygonOutlines( bufferPcbOutlines, allLayerHoles, &msg ) )
    {
        if( aErrorMessages )
        {
            msg << wxT("\n") << _("Unable to calculate the board outlines.\n"
                                  "Therefore use the board boundary box.") << wxT("\n\n");

            aErrorMessages->Report( msg, REPORTER::RPT_WARNING );
        }
    }

    // Build board holes, with optimization of large holes shape.
    buildBoardThroughHolesPolygonList( allLayerHoles, segcountLowQuality, true );

    LSET            cu_set = LSET::AllCuMask( GetPrm3DVisu().m_CopperLayersCount );

    glNewList( aBoardList, GL_COMPILE );

    for( LSEQ cu = cu_set.CuStack();  cu;  ++cu )
    {
        LAYER_ID layer = *cu;

        // Skip non enabled layers in normal mode,
        // and internal layers in realistic mode
        if( !is3DLayerEnabled( layer ) )
            continue;

        if( aActivity )
            aActivity->Report( wxString::Format( _( "Build layer %s" ), LSET::Name( layer ) ) );

        bufferPolys.RemoveAllContours();
        bufferZonesPolys.RemoveAllContours();
        currLayerHoles.RemoveAllContours();

        // Draw track shapes:
        for( TRACK* track = pcb->m_Track;  track;  track = track->Next() )
        {
            if( !track->IsOnLayer( layer ) )
                continue;

            track->TransformShapeWithClearanceToPolygon( bufferPolys,
                                                         0, segcountforcircle,
                                                         correctionFactor );

            // Add blind/buried via holes
            if( track->Type() == PCB_VIA_T )
            {
                VIA *via = static_cast<VIA*>( track );

                if( via->GetViaType() == VIA_THROUGH )
                    continue;   // already done

                int holediameter = via->GetDrillValue();
                int thickness = GetPrm3DVisu().GetCopperThicknessBIU();
                int hole_outer_radius = (holediameter + thickness) / 2;

                TransformCircleToPolygon( currLayerHoles,
                                          via->GetStart(), hole_outer_radius,
                                          segcountLowQuality );
            }
        }

        // draw pad shapes
        for( MODULE* module = pcb->m_Modules;  module;  module = module->Next() )
        {
            // Note: NPTH pads are not drawn on copper layers when the pad
            // has same shape as its hole
            module->TransformPadsShapesWithClearanceToPolygon( layer,
                                                               bufferPolys,
                                                               0,
                                                               segcountforcircle,
                                                               correctionFactor, true );

            // Micro-wave modules may have items on copper layers
            module->TransformGraphicShapesWithClearanceToPolygonSet( layer,
                                                                     bufferPolys,
                                                                     0,
                                                                     segcountforcircle,
                                                                     correctionFactor );

            // pad holes are already in list.
        }

        // Draw copper zones. Note:
        // * if the holes are removed from copper zones
        // the polygons are stored in bufferPolys (which contains all other polygons)
        // * if the holes are NOT removed from copper zones
        // the polygons are stored in bufferZonesPolys
        if( isEnabled( FL_ZONE ) )
        {
            for( int ii = 0; ii < pcb->GetAreaCount(); ii++ )
            {
                ZONE_CONTAINER* zone = pcb->GetArea( ii );
                LAYER_NUM       zonelayer = zone->GetLayer();

                if( zonelayer == layer )
                {
                    zone->TransformSolidAreasShapesToPolygonSet(
                        remove_Holes ? bufferPolys : bufferZonesPolys,
                        segcountLowQuality, correctionFactorLQ );
                }
            }
        }

        // draw graphic items on copper layers (texts)
        for( BOARD_ITEM* item = pcb->m_Drawings; item; item = item->Next() )
        {
            if( !item->IsOnLayer( layer ) )
                continue;

            switch( item->Type() )
            {
            case PCB_LINE_T:    // should not exist on copper layers
                ( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon(
                    bufferPolys, 0, segcountforcircle, correctionFactor );
                break;

            case PCB_TEXT_T:
                ( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet(
                    bufferPolys, 0, segcountLowQuality, correctionFactor );
                break;

            default:
                break;
            }
        }

        // bufferPolys contains polygons to merge. Many overlaps .
        // Calculate merged polygons
        if( bufferPolys.IsEmpty() )
            continue;

        // Use Clipper lib to subtract holes to copper areas
        if( currLayerHoles.OutlineCount() )
        {
            currLayerHoles.Append(allLayerHoles);
            currLayerHoles.Simplify();
            bufferPolys.BooleanSubtract( currLayerHoles );
        }
        else
            bufferPolys.BooleanSubtract( allLayerHoles );

        int thickness = GetPrm3DVisu().GetLayerObjectThicknessBIU( layer );
        int zpos = GetPrm3DVisu().GetLayerZcoordBIU( layer );

        float zNormal = 1.0f; // When using thickness it will draw first the top and then botton (with z inverted)

        // If we are not using thickness, then the z-normal has to match the layer direction
        // because just one plane will be drawn
        if( !thickness )
            zNormal = Get3DLayer_Z_Orientation( layer );

        if( realistic_mode )
        {
            setGLCopperColor();
        }
        else
        {
            EDA_COLOR_T color = g_ColorsSettings.GetLayerColor( layer );
            SetGLColor( color );
        }

        // If holes are removed from copper zones, bufferPolys contains all polygons
        // to draw (tracks+zones+texts).
        Draw3D_SolidHorizontalPolyPolygons( bufferPolys, zpos, thickness,
                                            GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
                                            zNormal );

        // If holes are not removed from copper zones (for calculation time reasons,
        // the zone polygons are stored in bufferZonesPolys and have to be drawn now:
        if( !bufferZonesPolys.IsEmpty() )
        {
            Draw3D_SolidHorizontalPolyPolygons( bufferZonesPolys, zpos, thickness,
                                    GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
                                    zNormal );
        }
    }

    if( aActivity )
        aActivity->Report( _( "Build board body" ) );

    // Draw plated vertical holes inside the board, but not always. They are drawn:
    // - if the board body is not shown, to show the holes.
    // - or if the copper thickness is shown
    if( !isEnabled( FL_SHOW_BOARD_BODY ) || isEnabled( FL_USE_COPPER_THICKNESS ) )
    {
        // Draw vias holes (vertical cylinders)
        for( const TRACK* track = pcb->m_Track;  track;  track = track->Next() )
        {
            if( track->Type() == PCB_VIA_T )
            {
                const VIA *via = static_cast<const VIA*>(track);
                draw3DViaHole( via );
            }
        }

        // Draw pads holes (vertical cylinders)
        for( const MODULE* module = pcb->m_Modules;  module;  module = module->Next() )
        {
            for( D_PAD* pad = module->Pads(); pad; pad = pad->Next() )
                if( pad->GetAttribute () != PAD_HOLE_NOT_PLATED )
                    draw3DPadHole( pad );
        }
    }

    glEndList();

    // Build the body board:
    glNewList( aBodyOnlyList, GL_COMPILE );

    if( isRealisticMode() )
    {
        setGLEpoxyColor( 1.00 );
    }
    else
    {
        EDA_COLOR_T color = g_ColorsSettings.GetLayerColor( Edge_Cuts );
        SetGLColor( color, 0.7 );
    }

    float copper_thickness = GetPrm3DVisu().GetCopperThicknessBIU();

    // a small offset between substrate and external copper layer to avoid artifacts
    // when drawing copper items on board
    float epsilon = Millimeter2iu( 0.01 );
    float zpos = GetPrm3DVisu().GetLayerZcoordBIU( B_Cu );
    float board_thickness = GetPrm3DVisu().GetLayerZcoordBIU( F_Cu )
                        - GetPrm3DVisu().GetLayerZcoordBIU( B_Cu );

    // items on copper layers and having a thickness = copper_thickness
    // are drawn from zpos - copper_thickness/2 to zpos + copper_thickness
    // therefore substrate position is copper_thickness/2 to
    // substrate_height - copper_thickness/2
    zpos += (copper_thickness + epsilon) / 2.0f;
    board_thickness -= copper_thickness + epsilon;

    bufferPcbOutlines.BooleanSubtract( allLayerHoles );

    if( !bufferPcbOutlines.IsEmpty() )
    {
        Draw3D_SolidHorizontalPolyPolygons( bufferPcbOutlines, zpos + board_thickness / 2.0,
                                            board_thickness, GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
                                            1.0f );
    }

    glEndList();
}
Пример #3
0
/**
 * Function ComputeRawFilledAreas
 * Supports a min thickness area constraint.
 * Add non copper areas polygons (pads and tracks with clearance)
 * to the filled copper area found
 * in BuildFilledPolysListData after calculating filled areas in a zone
 * Non filled copper areas are pads and track and their clearance areas
 * The filled copper area must be computed just before.
 * BuildFilledPolysListData() call this function just after creating the
 *  filled copper area polygon (without clearance areas)
 * to do that this function:
 * 1 - Creates the main outline (zone outline) using a correction to shrink the resulting area
 *     with m_ZoneMinThickness/2 value.
 *     The result is areas with a margin of m_ZoneMinThickness/2
 *     When drawing outline with segments having a thickness of m_ZoneMinThickness, the
 *      outlines will match exactly the initial outlines
 * 3 - Add all non filled areas (pads, tracks) in group B with a clearance of m_Clearance +
 *     m_ZoneMinThickness/2
 *     in a buffer
 *   - If Thermal shapes are wanted, add non filled area, in order to create these thermal shapes
 * 4 - calculates the polygon A - B
 * 5 - put resulting list of polygons (filled areas) in m_FilledPolysList
 *     This zone contains pads with the same net.
 * 6 - Remove insulated copper islands
 * 7 - If Thermal shapes are wanted, remove unconnected stubs in thermal shapes:
 *     creates a buffer of polygons corresponding to stubs to remove
 *     sub them to the filled areas.
 *     Remove new insulated copper islands
 */
void ZONE_FILLER::computeRawFilledAreas( const ZONE_CONTAINER* aZone,
        const SHAPE_POLY_SET& aSmoothedOutline,
        SHAPE_POLY_SET& aRawPolys,
        SHAPE_POLY_SET& aFinalPolys ) const
{
    int segsPerCircle;
    double correctionFactor;
    int outline_half_thickness = aZone->GetMinThickness() / 2;

    std::unique_ptr<SHAPE_FILE_IO> dumper( new SHAPE_FILE_IO(
                    s_DumpZonesWhenFilling ? "zones_dump.txt" : "", SHAPE_FILE_IO::IOM_APPEND ) );

    // Set the number of segments in arc approximations
    if( aZone->GetArcSegmentCount() == ARC_APPROX_SEGMENTS_COUNT_HIGHT_DEF  )
        segsPerCircle = ARC_APPROX_SEGMENTS_COUNT_HIGHT_DEF;
    else
        segsPerCircle = ARC_APPROX_SEGMENTS_COUNT_LOW_DEF;

    /* calculates the coeff to compensate radius reduction of holes clearance
     * due to the segment approx.
     * For a circle the min radius is radius * cos( 2PI / s_CircleToSegmentsCount / 2)
     * s_Correction is 1 /cos( PI/s_CircleToSegmentsCount  )
     */
    correctionFactor = 1.0 / cos( M_PI / (double) segsPerCircle );

    if( s_DumpZonesWhenFilling )
        dumper->BeginGroup( "clipper-zone" );

    SHAPE_POLY_SET solidAreas = aSmoothedOutline;

    solidAreas.Inflate( -outline_half_thickness, segsPerCircle );
    solidAreas.Simplify( SHAPE_POLY_SET::PM_FAST );

    SHAPE_POLY_SET holes;

    if( s_DumpZonesWhenFilling )
        dumper->Write( &solidAreas, "solid-areas" );

    buildZoneFeatureHoleList( aZone, holes );

    if( s_DumpZonesWhenFilling )
        dumper->Write( &holes, "feature-holes" );

    holes.Simplify( SHAPE_POLY_SET::PM_FAST );

    if( s_DumpZonesWhenFilling )
        dumper->Write( &holes, "feature-holes-postsimplify" );

    // Generate the filled areas (currently, without thermal shapes, which will
    // be created later).
    // Use SHAPE_POLY_SET::PM_STRICTLY_SIMPLE to generate strictly simple polygons
    // needed by Gerber files and Fracture()
    solidAreas.BooleanSubtract( holes, SHAPE_POLY_SET::PM_STRICTLY_SIMPLE );

    if( s_DumpZonesWhenFilling )
        dumper->Write( &solidAreas, "solid-areas-minus-holes" );

    SHAPE_POLY_SET areas_fractured = solidAreas;
    areas_fractured.Fracture( SHAPE_POLY_SET::PM_FAST );

    if( s_DumpZonesWhenFilling )
        dumper->Write( &areas_fractured, "areas_fractured" );

    aFinalPolys = areas_fractured;

    SHAPE_POLY_SET thermalHoles;

    // Test thermal stubs connections and add polygons to remove unconnected stubs.
    // (this is a refinement for thermal relief shapes)
    if( aZone->GetNetCode() > 0 )
    {
        buildUnconnectedThermalStubsPolygonList( thermalHoles, aZone, aFinalPolys,
                correctionFactor, s_thermalRot );

    }

    // remove copper areas corresponding to not connected stubs
    if( !thermalHoles.IsEmpty() )
    {
        thermalHoles.Simplify( SHAPE_POLY_SET::PM_FAST );
        // Remove unconnected stubs. Use SHAPE_POLY_SET::PM_STRICTLY_SIMPLE to
        // generate strictly simple polygons
        // needed by Gerber files and Fracture()
        solidAreas.BooleanSubtract( thermalHoles, SHAPE_POLY_SET::PM_STRICTLY_SIMPLE );

        if( s_DumpZonesWhenFilling )
            dumper->Write( &thermalHoles, "thermal-holes" );

        // put these areas in m_FilledPolysList
        SHAPE_POLY_SET th_fractured = solidAreas;
        th_fractured.Fracture( SHAPE_POLY_SET::PM_FAST );

        if( s_DumpZonesWhenFilling )
            dumper->Write( &th_fractured, "th_fractured" );

        aFinalPolys = th_fractured;
    }

    aRawPolys = aFinalPolys;

    if( s_DumpZonesWhenFilling )
        dumper->EndGroup();
}
void ZONE_CONTAINER::AddClearanceAreasPolygonsToPolysList_NG( BOARD* aPcb )
{
    int segsPerCircle;
    double correctionFactor;
    int outline_half_thickness = m_ZoneMinThickness / 2;


    std::unique_ptr<SHAPE_FILE_IO> dumper( new SHAPE_FILE_IO(
            g_DumpZonesWhenFilling ? "zones_dump.txt" : "", SHAPE_FILE_IO::IOM_APPEND ) );

    // Set the number of segments in arc approximations
    if( m_ArcToSegmentsCount == ARC_APPROX_SEGMENTS_COUNT_HIGHT_DEF  )
        segsPerCircle = ARC_APPROX_SEGMENTS_COUNT_HIGHT_DEF;
    else
        segsPerCircle = ARC_APPROX_SEGMENTS_COUNT_LOW_DEF;

    /* calculates the coeff to compensate radius reduction of holes clearance
     * due to the segment approx.
     * For a circle the min radius is radius * cos( 2PI / s_CircleToSegmentsCount / 2)
     * s_Correction is 1 /cos( PI/s_CircleToSegmentsCount  )
     */
    correctionFactor = 1.0 / cos( M_PI / (double) segsPerCircle );

    CPOLYGONS_LIST tmp;

    if(g_DumpZonesWhenFilling)
        dumper->BeginGroup("clipper-zone");

    SHAPE_POLY_SET solidAreas = ConvertPolyListToPolySet( m_smoothedPoly->m_CornersList );

    solidAreas.Inflate( -outline_half_thickness, segsPerCircle );
    solidAreas.Simplify( POLY_CALC_MODE );

    SHAPE_POLY_SET holes;

    if(g_DumpZonesWhenFilling)
        dumper->Write( &solidAreas, "solid-areas" );

    tmp.RemoveAllContours();
    buildFeatureHoleList( aPcb, holes );

    if(g_DumpZonesWhenFilling)
        dumper->Write( &holes, "feature-holes" );

    holes.Simplify( POLY_CALC_MODE );

    if (g_DumpZonesWhenFilling)
        dumper->Write( &holes, "feature-holes-postsimplify" );

    solidAreas.BooleanSubtract( holes, POLY_CALC_MODE );

    if (g_DumpZonesWhenFilling)
        dumper->Write( &solidAreas, "solid-areas-minus-holes" );

    SHAPE_POLY_SET areas_fractured = solidAreas;
    areas_fractured.Fracture( POLY_CALC_MODE );

    if (g_DumpZonesWhenFilling)
        dumper->Write( &areas_fractured, "areas_fractured" );

    m_FilledPolysList = areas_fractured;

    // Remove insulated islands:
    if( GetNetCode() > 0 )
        TestForCopperIslandAndRemoveInsulatedIslands( aPcb );

    SHAPE_POLY_SET thermalHoles;

    // Test thermal stubs connections and add polygons to remove unconnected stubs.
    // (this is a refinement for thermal relief shapes)
    if( GetNetCode() > 0 )
        BuildUnconnectedThermalStubsPolygonList( thermalHoles, aPcb, this,
                                                 correctionFactor, s_thermalRot );

    // remove copper areas corresponding to not connected stubs
    if( !thermalHoles.IsEmpty() )
    {
        thermalHoles.Simplify( POLY_CALC_MODE );
        // Remove unconnected stubs
        solidAreas.BooleanSubtract( thermalHoles, POLY_CALC_MODE );

        if( g_DumpZonesWhenFilling )
            dumper->Write( &thermalHoles, "thermal-holes" );

        // put these areas in m_FilledPolysList
        SHAPE_POLY_SET th_fractured = solidAreas;
        th_fractured.Fracture( POLY_CALC_MODE );

        if( g_DumpZonesWhenFilling )
            dumper->Write ( &th_fractured, "th_fractured" );

        m_FilledPolysList = th_fractured;

        if( GetNetCode() > 0 )
            TestForCopperIslandAndRemoveInsulatedIslands( aPcb );
    }

    if(g_DumpZonesWhenFilling)
        dumper->EndGroup();
}
Пример #5
0
/**
 * Function buildBoard3DAuxLayers
 * Called by CreateDrawGL_List()
 * Fills the OpenGL GL_ID_BOARD draw list with items
 * on aux layers only
 */
void EDA_3D_CANVAS::buildBoard3DAuxLayers( REPORTER* aErrorMessages, REPORTER* aActivity )
{
    const int   segcountforcircle   = 18;
    double      correctionFactor    = 1.0 / cos( M_PI / (segcountforcircle * 2) );
    BOARD*      pcb = GetBoard();

    SHAPE_POLY_SET  bufferPolys;

    static const LAYER_ID sequence[] = {
        Dwgs_User,
        Cmts_User,
        Eco1_User,
        Eco2_User,
        Edge_Cuts,
        Margin
    };

    for( LSEQ aux( sequence, sequence+DIM(sequence) );  aux;  ++aux )
    {
        LAYER_ID layer = *aux;

        if( !is3DLayerEnabled( layer ) )
            continue;

        if( aActivity )
            aActivity->Report( wxString::Format( _( "Build layer %s" ), LSET::Name( layer ) ) );

        bufferPolys.RemoveAllContours();

        for( BOARD_ITEM* item = pcb->m_Drawings; item; item = item->Next() )
        {
            if( !item->IsOnLayer( layer ) )
                continue;

            switch( item->Type() )
            {
            case PCB_LINE_T:
                ( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon(
                    bufferPolys, 0, segcountforcircle, correctionFactor );
                break;

            case PCB_TEXT_T:
                ( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet(
                    bufferPolys, 0, segcountforcircle, correctionFactor );
                break;

            default:
                break;
            }
        }

        for( MODULE* module = pcb->m_Modules; module; module = module->Next() )
        {
            module->TransformPadsShapesWithClearanceToPolygon( layer,
                                                               bufferPolys,
                                                               0,
                                                               segcountforcircle,
                                                               correctionFactor );

            module->TransformGraphicShapesWithClearanceToPolygonSet( layer,
                                                                     bufferPolys,
                                                                     0,
                                                                     segcountforcircle,
                                                                     correctionFactor );
        }

        // bufferPolys contains polygons to merge. Many overlaps .
        // Calculate merged polygons and remove pads and vias holes
        if( bufferPolys.IsEmpty() )
            continue;

        bufferPolys.Simplify( polygonsCalcMode );

        int         thickness = GetPrm3DVisu().GetLayerObjectThicknessBIU( layer );
        int         zpos = GetPrm3DVisu().GetLayerZcoordBIU( layer );
        // for Draw3D_SolidHorizontalPolyPolygons,
        // zpos it the middle between bottom and top sides.
        // However for top layers, zpos should be the bottom layer pos,
        // and for bottom layers, zpos should be the top layer pos.
        if( Get3DLayer_Z_Orientation( layer ) > 0 )
            zpos += thickness/2;
        else
            zpos -= thickness/2 ;

        float zNormal = 1.0f; // When using thickness it will draw first the top and then botton (with z inverted)

        // If we are not using thickness, then the znormal must face the layer direction
        // because it will draw just one plane
        if( !thickness )
            zNormal = Get3DLayer_Z_Orientation( layer );

        setGLTechLayersColor( layer );
        Draw3D_SolidHorizontalPolyPolygons( bufferPolys, zpos,
                                            thickness, GetPrm3DVisu().m_BiuTo3Dunits, false,
                                            zNormal );
    }
}