void EDA_3D_CANVAS::buildTechLayers3DView( REPORTER* aErrorMessages, REPORTER* aActivity )
{
BOARD* pcb = GetBoard();
bool useTextures = isRealisticMode() && isEnabled( FL_RENDER_TEXTURES );
// Number of segments to draw a circle using segments
const int segcountforcircle = 18;
double correctionFactor = 1.0 / cos( M_PI / (segcountforcircle * 2) );
const int segcountLowQuality = 12; // segments to draw a circle with low quality
// to reduce time calculations
// for holes and items which do not need
// a fine representation
double correctionFactorLQ = 1.0 / cos( M_PI / (segcountLowQuality * 2) );
// segments to draw a circle to build texts. Is is used only to build
// the shape of each segment of the stroke font, therefore no need to have
// many segments per circle.
const int segcountInStrokeFont = 8;
SHAPE_POLY_SET bufferPolys;
SHAPE_POLY_SET allLayerHoles; // Contains through holes, calculated only once
SHAPE_POLY_SET bufferPcbOutlines; // stores the board main outlines
// Build a polygon from edge cut items
wxString msg;
if( !pcb->GetBoardPolygonOutlines( bufferPcbOutlines, allLayerHoles, &msg ) )
{
if( aErrorMessages )
{
msg << wxT("\n") <<
_("Unable to calculate the board outlines.\n"
"Therefore use the board boundary box.") << wxT("\n\n");
aErrorMessages->Report( msg, REPORTER::RPT_WARNING );
}
}
// Build board holes, with no optimization of large holes shape.
buildBoardThroughHolesPolygonList( allLayerHoles, segcountLowQuality, false );
// draw graphic items, on technical layers
static const LAYER_ID teckLayerList[] = {
B_Adhes,
F_Adhes,
B_Paste,
F_Paste,
B_SilkS,
F_SilkS,
B_Mask,
F_Mask,
};
// User layers are not drawn here, only technical layers
for( LSEQ seq = LSET::AllTechMask().Seq( teckLayerList, DIM( teckLayerList ) ); seq; ++seq )
{
LAYER_ID layer = *seq;
if( !is3DLayerEnabled( layer ) )
continue;
if( layer == Edge_Cuts && isEnabled( FL_SHOW_BOARD_BODY ) )
continue;
if( aActivity )
aActivity->Report( wxString::Format( _( "Build layer %s" ), LSET::Name( layer ) ) );
bufferPolys.RemoveAllContours();
for( BOARD_ITEM* item = pcb->m_Drawings; item; item = item->Next() )
{
if( !item->IsOnLayer( layer ) )
continue;
switch( item->Type() )
{
case PCB_LINE_T:
( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon(
bufferPolys, 0, segcountforcircle, correctionFactor );
break;
case PCB_TEXT_T:
( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet(
bufferPolys, 0, segcountLowQuality, 1.0 );
break;
default:
break;
}
}
for( MODULE* module = pcb->m_Modules; module; module = module->Next() )
{
if( layer == F_SilkS || layer == B_SilkS )
{
// On silk screen layers, the pad shape is only the pad outline
// never a filled shape
D_PAD* pad = module->Pads();
int linewidth = g_DrawDefaultLineThickness;
for( ; pad; pad = pad->Next() )
{
if( !pad->IsOnLayer( layer ) )
continue;
buildPadShapeThickOutlineAsPolygon( pad, bufferPolys,
linewidth, segcountforcircle, correctionFactor );
}
}
else
module->TransformPadsShapesWithClearanceToPolygon( layer,
bufferPolys, 0, segcountforcircle, correctionFactor );
// On tech layers, use a poor circle approximation, only for texts (stroke font)
module->TransformGraphicShapesWithClearanceToPolygonSet( layer,
bufferPolys, 0, segcountforcircle, correctionFactor, segcountInStrokeFont );
}
// Draw non copper zones
if( isEnabled( FL_ZONE ) )
{
for( int ii = 0; ii < pcb->GetAreaCount(); ii++ )
{
ZONE_CONTAINER* zone = pcb->GetArea( ii );
if( !zone->IsOnLayer( layer ) )
continue;
zone->TransformSolidAreasShapesToPolygonSet(
bufferPolys, segcountLowQuality, correctionFactorLQ );
}
}
// bufferPolys contains polygons to merge. Many overlaps .
// Calculate merged polygons and remove pads and vias holes
if( bufferPolys.IsEmpty() )
continue;
// Solder mask layers are "negative" layers.
// Shapes should be removed from the full board area.
if( layer == B_Mask || layer == F_Mask )
{
SHAPE_POLY_SET cuts = bufferPolys;
bufferPolys = bufferPcbOutlines;
cuts.Append(allLayerHoles);
cuts.Simplify();
bufferPolys.BooleanSubtract( cuts );
}
// Remove holes from Solder paste layers and silkscreen
else if( layer == B_Paste || layer == F_Paste
|| layer == B_SilkS || layer == F_SilkS )
{
bufferPolys.BooleanSubtract( allLayerHoles );
}
int thickness = 0;
if( layer != B_Mask && layer != F_Mask )
thickness = GetPrm3DVisu().GetLayerObjectThicknessBIU( layer );
int zpos = GetPrm3DVisu().GetLayerZcoordBIU( layer );
if( layer == Edge_Cuts )
{
thickness = GetPrm3DVisu().GetLayerZcoordBIU( F_Cu )
- GetPrm3DVisu().GetLayerZcoordBIU( B_Cu );
zpos = GetPrm3DVisu().GetLayerZcoordBIU( B_Cu )
+ (thickness / 2);
}
else
{
// for Draw3D_SolidHorizontalPolyPolygons, zpos it the middle between bottom and top
// sides.
// However for top layers, zpos should be the bottom layer pos,
// and for bottom layers, zpos should be the top layer pos.
if( Get3DLayer_Z_Orientation( layer ) > 0 )
zpos += thickness/2;
else
zpos -= thickness/2 ;
}
float zNormal = 1.0f; // When using thickness it will draw first the top and then botton (with z inverted)
// If we are not using thickness, then the znormal must face the layer direction
// because it will draw just one plane
if( !thickness )
zNormal = Get3DLayer_Z_Orientation( layer );
setGLTechLayersColor( layer );
Draw3D_SolidHorizontalPolyPolygons( bufferPolys, zpos,
thickness, GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
zNormal );
}
}
void EDA_3D_CANVAS::buildBoard3DView( GLuint aBoardList, GLuint aBodyOnlyList,
REPORTER* aErrorMessages, REPORTER* aActivity )
{
BOARD* pcb = GetBoard();
// If FL_RENDER_SHOW_HOLES_IN_ZONES is true, holes are correctly removed from copper zones areas.
// If FL_RENDER_SHOW_HOLES_IN_ZONES is false, holes are not removed from copper zones areas,
// but the calculation time is twice shorter.
bool remove_Holes = isEnabled( FL_RENDER_SHOW_HOLES_IN_ZONES );
bool realistic_mode = isRealisticMode();
bool useTextures = isRealisticMode() && isEnabled( FL_RENDER_TEXTURES );
// Number of segments to convert a circle to polygon
// We use 2 values: the first gives a good shape (for instanes rond pads)
// the second is used to speed up calculations, when a poor approximation is acceptable (holes)
const int segcountforcircle = 18;
double correctionFactor = 1.0 / cos( M_PI / (segcountforcircle * 2.0) );
const int segcountLowQuality = 12; // segments to draw a circle with low quality
// to reduce time calculations
// for holes and items which do not need
// a fine representation
double correctionFactorLQ = 1.0 / cos( M_PI / (segcountLowQuality * 2.0) );
SHAPE_POLY_SET bufferPolys; // copper areas: tracks, pads and filled zones areas
// when holes are removed from zones
SHAPE_POLY_SET bufferPcbOutlines; // stores the board main outlines
SHAPE_POLY_SET bufferZonesPolys; // copper filled zones areas
// when holes are not removed from zones
SHAPE_POLY_SET currLayerHoles; // Contains holes for the current layer
SHAPE_POLY_SET allLayerHoles; // Contains holes for all layers
// Build a polygon from edge cut items
wxString msg;
if( !pcb->GetBoardPolygonOutlines( bufferPcbOutlines, allLayerHoles, &msg ) )
{
if( aErrorMessages )
{
msg << wxT("\n") << _("Unable to calculate the board outlines.\n"
"Therefore use the board boundary box.") << wxT("\n\n");
aErrorMessages->Report( msg, REPORTER::RPT_WARNING );
}
}
// Build board holes, with optimization of large holes shape.
buildBoardThroughHolesPolygonList( allLayerHoles, segcountLowQuality, true );
LSET cu_set = LSET::AllCuMask( GetPrm3DVisu().m_CopperLayersCount );
glNewList( aBoardList, GL_COMPILE );
for( LSEQ cu = cu_set.CuStack(); cu; ++cu )
{
LAYER_ID layer = *cu;
// Skip non enabled layers in normal mode,
// and internal layers in realistic mode
if( !is3DLayerEnabled( layer ) )
continue;
if( aActivity )
aActivity->Report( wxString::Format( _( "Build layer %s" ), LSET::Name( layer ) ) );
bufferPolys.RemoveAllContours();
bufferZonesPolys.RemoveAllContours();
currLayerHoles.RemoveAllContours();
// Draw track shapes:
for( TRACK* track = pcb->m_Track; track; track = track->Next() )
{
if( !track->IsOnLayer( layer ) )
continue;
track->TransformShapeWithClearanceToPolygon( bufferPolys,
0, segcountforcircle,
correctionFactor );
// Add blind/buried via holes
if( track->Type() == PCB_VIA_T )
{
VIA *via = static_cast<VIA*>( track );
if( via->GetViaType() == VIA_THROUGH )
continue; // already done
int holediameter = via->GetDrillValue();
int thickness = GetPrm3DVisu().GetCopperThicknessBIU();
int hole_outer_radius = (holediameter + thickness) / 2;
TransformCircleToPolygon( currLayerHoles,
via->GetStart(), hole_outer_radius,
segcountLowQuality );
}
}
// draw pad shapes
for( MODULE* module = pcb->m_Modules; module; module = module->Next() )
{
// Note: NPTH pads are not drawn on copper layers when the pad
// has same shape as its hole
module->TransformPadsShapesWithClearanceToPolygon( layer,
bufferPolys,
0,
segcountforcircle,
correctionFactor, true );
// Micro-wave modules may have items on copper layers
module->TransformGraphicShapesWithClearanceToPolygonSet( layer,
bufferPolys,
0,
segcountforcircle,
correctionFactor );
// pad holes are already in list.
}
// Draw copper zones. Note:
// * if the holes are removed from copper zones
// the polygons are stored in bufferPolys (which contains all other polygons)
// * if the holes are NOT removed from copper zones
// the polygons are stored in bufferZonesPolys
if( isEnabled( FL_ZONE ) )
{
for( int ii = 0; ii < pcb->GetAreaCount(); ii++ )
{
ZONE_CONTAINER* zone = pcb->GetArea( ii );
LAYER_NUM zonelayer = zone->GetLayer();
if( zonelayer == layer )
{
zone->TransformSolidAreasShapesToPolygonSet(
remove_Holes ? bufferPolys : bufferZonesPolys,
segcountLowQuality, correctionFactorLQ );
}
}
}
// draw graphic items on copper layers (texts)
for( BOARD_ITEM* item = pcb->m_Drawings; item; item = item->Next() )
{
if( !item->IsOnLayer( layer ) )
continue;
switch( item->Type() )
{
case PCB_LINE_T: // should not exist on copper layers
( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon(
bufferPolys, 0, segcountforcircle, correctionFactor );
break;
case PCB_TEXT_T:
( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet(
bufferPolys, 0, segcountLowQuality, correctionFactor );
break;
default:
break;
}
}
// bufferPolys contains polygons to merge. Many overlaps .
// Calculate merged polygons
if( bufferPolys.IsEmpty() )
continue;
// Use Clipper lib to subtract holes to copper areas
if( currLayerHoles.OutlineCount() )
{
currLayerHoles.Append(allLayerHoles);
currLayerHoles.Simplify();
bufferPolys.BooleanSubtract( currLayerHoles );
}
else
bufferPolys.BooleanSubtract( allLayerHoles );
int thickness = GetPrm3DVisu().GetLayerObjectThicknessBIU( layer );
int zpos = GetPrm3DVisu().GetLayerZcoordBIU( layer );
float zNormal = 1.0f; // When using thickness it will draw first the top and then botton (with z inverted)
// If we are not using thickness, then the z-normal has to match the layer direction
// because just one plane will be drawn
if( !thickness )
zNormal = Get3DLayer_Z_Orientation( layer );
if( realistic_mode )
{
setGLCopperColor();
}
else
{
EDA_COLOR_T color = g_ColorsSettings.GetLayerColor( layer );
SetGLColor( color );
}
// If holes are removed from copper zones, bufferPolys contains all polygons
// to draw (tracks+zones+texts).
Draw3D_SolidHorizontalPolyPolygons( bufferPolys, zpos, thickness,
GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
zNormal );
// If holes are not removed from copper zones (for calculation time reasons,
// the zone polygons are stored in bufferZonesPolys and have to be drawn now:
if( !bufferZonesPolys.IsEmpty() )
{
Draw3D_SolidHorizontalPolyPolygons( bufferZonesPolys, zpos, thickness,
GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
zNormal );
}
}
if( aActivity )
aActivity->Report( _( "Build board body" ) );
// Draw plated vertical holes inside the board, but not always. They are drawn:
// - if the board body is not shown, to show the holes.
// - or if the copper thickness is shown
if( !isEnabled( FL_SHOW_BOARD_BODY ) || isEnabled( FL_USE_COPPER_THICKNESS ) )
{
// Draw vias holes (vertical cylinders)
for( const TRACK* track = pcb->m_Track; track; track = track->Next() )
{
if( track->Type() == PCB_VIA_T )
{
const VIA *via = static_cast<const VIA*>(track);
draw3DViaHole( via );
}
}
// Draw pads holes (vertical cylinders)
for( const MODULE* module = pcb->m_Modules; module; module = module->Next() )
{
for( D_PAD* pad = module->Pads(); pad; pad = pad->Next() )
if( pad->GetAttribute () != PAD_HOLE_NOT_PLATED )
draw3DPadHole( pad );
}
}
glEndList();
// Build the body board:
glNewList( aBodyOnlyList, GL_COMPILE );
if( isRealisticMode() )
{
setGLEpoxyColor( 1.00 );
}
else
{
EDA_COLOR_T color = g_ColorsSettings.GetLayerColor( Edge_Cuts );
SetGLColor( color, 0.7 );
}
float copper_thickness = GetPrm3DVisu().GetCopperThicknessBIU();
// a small offset between substrate and external copper layer to avoid artifacts
// when drawing copper items on board
float epsilon = Millimeter2iu( 0.01 );
float zpos = GetPrm3DVisu().GetLayerZcoordBIU( B_Cu );
float board_thickness = GetPrm3DVisu().GetLayerZcoordBIU( F_Cu )
- GetPrm3DVisu().GetLayerZcoordBIU( B_Cu );
// items on copper layers and having a thickness = copper_thickness
// are drawn from zpos - copper_thickness/2 to zpos + copper_thickness
// therefore substrate position is copper_thickness/2 to
// substrate_height - copper_thickness/2
zpos += (copper_thickness + epsilon) / 2.0f;
board_thickness -= copper_thickness + epsilon;
bufferPcbOutlines.BooleanSubtract( allLayerHoles );
if( !bufferPcbOutlines.IsEmpty() )
{
Draw3D_SolidHorizontalPolyPolygons( bufferPcbOutlines, zpos + board_thickness / 2.0,
board_thickness, GetPrm3DVisu().m_BiuTo3Dunits, useTextures,
1.0f );
}
glEndList();
}
/**
* Function ComputeRawFilledAreas
* Supports a min thickness area constraint.
* Add non copper areas polygons (pads and tracks with clearance)
* to the filled copper area found
* in BuildFilledPolysListData after calculating filled areas in a zone
* Non filled copper areas are pads and track and their clearance areas
* The filled copper area must be computed just before.
* BuildFilledPolysListData() call this function just after creating the
* filled copper area polygon (without clearance areas)
* to do that this function:
* 1 - Creates the main outline (zone outline) using a correction to shrink the resulting area
* with m_ZoneMinThickness/2 value.
* The result is areas with a margin of m_ZoneMinThickness/2
* When drawing outline with segments having a thickness of m_ZoneMinThickness, the
* outlines will match exactly the initial outlines
* 3 - Add all non filled areas (pads, tracks) in group B with a clearance of m_Clearance +
* m_ZoneMinThickness/2
* in a buffer
* - If Thermal shapes are wanted, add non filled area, in order to create these thermal shapes
* 4 - calculates the polygon A - B
* 5 - put resulting list of polygons (filled areas) in m_FilledPolysList
* This zone contains pads with the same net.
* 6 - Remove insulated copper islands
* 7 - If Thermal shapes are wanted, remove unconnected stubs in thermal shapes:
* creates a buffer of polygons corresponding to stubs to remove
* sub them to the filled areas.
* Remove new insulated copper islands
*/
void ZONE_FILLER::computeRawFilledAreas( const ZONE_CONTAINER* aZone,
const SHAPE_POLY_SET& aSmoothedOutline,
SHAPE_POLY_SET& aRawPolys,
SHAPE_POLY_SET& aFinalPolys ) const
{
int segsPerCircle;
double correctionFactor;
int outline_half_thickness = aZone->GetMinThickness() / 2;
std::unique_ptr<SHAPE_FILE_IO> dumper( new SHAPE_FILE_IO(
s_DumpZonesWhenFilling ? "zones_dump.txt" : "", SHAPE_FILE_IO::IOM_APPEND ) );
// Set the number of segments in arc approximations
if( aZone->GetArcSegmentCount() == ARC_APPROX_SEGMENTS_COUNT_HIGHT_DEF )
segsPerCircle = ARC_APPROX_SEGMENTS_COUNT_HIGHT_DEF;
else
segsPerCircle = ARC_APPROX_SEGMENTS_COUNT_LOW_DEF;
/* calculates the coeff to compensate radius reduction of holes clearance
* due to the segment approx.
* For a circle the min radius is radius * cos( 2PI / s_CircleToSegmentsCount / 2)
* s_Correction is 1 /cos( PI/s_CircleToSegmentsCount )
*/
correctionFactor = 1.0 / cos( M_PI / (double) segsPerCircle );
if( s_DumpZonesWhenFilling )
dumper->BeginGroup( "clipper-zone" );
SHAPE_POLY_SET solidAreas = aSmoothedOutline;
solidAreas.Inflate( -outline_half_thickness, segsPerCircle );
solidAreas.Simplify( SHAPE_POLY_SET::PM_FAST );
SHAPE_POLY_SET holes;
if( s_DumpZonesWhenFilling )
dumper->Write( &solidAreas, "solid-areas" );
buildZoneFeatureHoleList( aZone, holes );
if( s_DumpZonesWhenFilling )
dumper->Write( &holes, "feature-holes" );
holes.Simplify( SHAPE_POLY_SET::PM_FAST );
if( s_DumpZonesWhenFilling )
dumper->Write( &holes, "feature-holes-postsimplify" );
// Generate the filled areas (currently, without thermal shapes, which will
// be created later).
// Use SHAPE_POLY_SET::PM_STRICTLY_SIMPLE to generate strictly simple polygons
// needed by Gerber files and Fracture()
solidAreas.BooleanSubtract( holes, SHAPE_POLY_SET::PM_STRICTLY_SIMPLE );
if( s_DumpZonesWhenFilling )
dumper->Write( &solidAreas, "solid-areas-minus-holes" );
SHAPE_POLY_SET areas_fractured = solidAreas;
areas_fractured.Fracture( SHAPE_POLY_SET::PM_FAST );
if( s_DumpZonesWhenFilling )
dumper->Write( &areas_fractured, "areas_fractured" );
aFinalPolys = areas_fractured;
SHAPE_POLY_SET thermalHoles;
// Test thermal stubs connections and add polygons to remove unconnected stubs.
// (this is a refinement for thermal relief shapes)
if( aZone->GetNetCode() > 0 )
{
buildUnconnectedThermalStubsPolygonList( thermalHoles, aZone, aFinalPolys,
correctionFactor, s_thermalRot );
}
// remove copper areas corresponding to not connected stubs
if( !thermalHoles.IsEmpty() )
{
thermalHoles.Simplify( SHAPE_POLY_SET::PM_FAST );
// Remove unconnected stubs. Use SHAPE_POLY_SET::PM_STRICTLY_SIMPLE to
// generate strictly simple polygons
// needed by Gerber files and Fracture()
solidAreas.BooleanSubtract( thermalHoles, SHAPE_POLY_SET::PM_STRICTLY_SIMPLE );
if( s_DumpZonesWhenFilling )
dumper->Write( &thermalHoles, "thermal-holes" );
// put these areas in m_FilledPolysList
SHAPE_POLY_SET th_fractured = solidAreas;
th_fractured.Fracture( SHAPE_POLY_SET::PM_FAST );
if( s_DumpZonesWhenFilling )
dumper->Write( &th_fractured, "th_fractured" );
aFinalPolys = th_fractured;
}
aRawPolys = aFinalPolys;
if( s_DumpZonesWhenFilling )
dumper->EndGroup();
}
void ZONE_CONTAINER::AddClearanceAreasPolygonsToPolysList_NG( BOARD* aPcb )
{
int segsPerCircle;
double correctionFactor;
int outline_half_thickness = m_ZoneMinThickness / 2;
std::unique_ptr<SHAPE_FILE_IO> dumper( new SHAPE_FILE_IO(
g_DumpZonesWhenFilling ? "zones_dump.txt" : "", SHAPE_FILE_IO::IOM_APPEND ) );
// Set the number of segments in arc approximations
if( m_ArcToSegmentsCount == ARC_APPROX_SEGMENTS_COUNT_HIGHT_DEF )
segsPerCircle = ARC_APPROX_SEGMENTS_COUNT_HIGHT_DEF;
else
segsPerCircle = ARC_APPROX_SEGMENTS_COUNT_LOW_DEF;
/* calculates the coeff to compensate radius reduction of holes clearance
* due to the segment approx.
* For a circle the min radius is radius * cos( 2PI / s_CircleToSegmentsCount / 2)
* s_Correction is 1 /cos( PI/s_CircleToSegmentsCount )
*/
correctionFactor = 1.0 / cos( M_PI / (double) segsPerCircle );
CPOLYGONS_LIST tmp;
if(g_DumpZonesWhenFilling)
dumper->BeginGroup("clipper-zone");
SHAPE_POLY_SET solidAreas = ConvertPolyListToPolySet( m_smoothedPoly->m_CornersList );
solidAreas.Inflate( -outline_half_thickness, segsPerCircle );
solidAreas.Simplify( POLY_CALC_MODE );
SHAPE_POLY_SET holes;
if(g_DumpZonesWhenFilling)
dumper->Write( &solidAreas, "solid-areas" );
tmp.RemoveAllContours();
buildFeatureHoleList( aPcb, holes );
if(g_DumpZonesWhenFilling)
dumper->Write( &holes, "feature-holes" );
holes.Simplify( POLY_CALC_MODE );
if (g_DumpZonesWhenFilling)
dumper->Write( &holes, "feature-holes-postsimplify" );
solidAreas.BooleanSubtract( holes, POLY_CALC_MODE );
if (g_DumpZonesWhenFilling)
dumper->Write( &solidAreas, "solid-areas-minus-holes" );
SHAPE_POLY_SET areas_fractured = solidAreas;
areas_fractured.Fracture( POLY_CALC_MODE );
if (g_DumpZonesWhenFilling)
dumper->Write( &areas_fractured, "areas_fractured" );
m_FilledPolysList = areas_fractured;
// Remove insulated islands:
if( GetNetCode() > 0 )
TestForCopperIslandAndRemoveInsulatedIslands( aPcb );
SHAPE_POLY_SET thermalHoles;
// Test thermal stubs connections and add polygons to remove unconnected stubs.
// (this is a refinement for thermal relief shapes)
if( GetNetCode() > 0 )
BuildUnconnectedThermalStubsPolygonList( thermalHoles, aPcb, this,
correctionFactor, s_thermalRot );
// remove copper areas corresponding to not connected stubs
if( !thermalHoles.IsEmpty() )
{
thermalHoles.Simplify( POLY_CALC_MODE );
// Remove unconnected stubs
solidAreas.BooleanSubtract( thermalHoles, POLY_CALC_MODE );
if( g_DumpZonesWhenFilling )
dumper->Write( &thermalHoles, "thermal-holes" );
// put these areas in m_FilledPolysList
SHAPE_POLY_SET th_fractured = solidAreas;
th_fractured.Fracture( POLY_CALC_MODE );
if( g_DumpZonesWhenFilling )
dumper->Write ( &th_fractured, "th_fractured" );
m_FilledPolysList = th_fractured;
if( GetNetCode() > 0 )
TestForCopperIslandAndRemoveInsulatedIslands( aPcb );
}
if(g_DumpZonesWhenFilling)
dumper->EndGroup();
}
/**
* Function buildBoard3DAuxLayers
* Called by CreateDrawGL_List()
* Fills the OpenGL GL_ID_BOARD draw list with items
* on aux layers only
*/
void EDA_3D_CANVAS::buildBoard3DAuxLayers( REPORTER* aErrorMessages, REPORTER* aActivity )
{
const int segcountforcircle = 18;
double correctionFactor = 1.0 / cos( M_PI / (segcountforcircle * 2) );
BOARD* pcb = GetBoard();
SHAPE_POLY_SET bufferPolys;
static const LAYER_ID sequence[] = {
Dwgs_User,
Cmts_User,
Eco1_User,
Eco2_User,
Edge_Cuts,
Margin
};
for( LSEQ aux( sequence, sequence+DIM(sequence) ); aux; ++aux )
{
LAYER_ID layer = *aux;
if( !is3DLayerEnabled( layer ) )
continue;
if( aActivity )
aActivity->Report( wxString::Format( _( "Build layer %s" ), LSET::Name( layer ) ) );
bufferPolys.RemoveAllContours();
for( BOARD_ITEM* item = pcb->m_Drawings; item; item = item->Next() )
{
if( !item->IsOnLayer( layer ) )
continue;
switch( item->Type() )
{
case PCB_LINE_T:
( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon(
bufferPolys, 0, segcountforcircle, correctionFactor );
break;
case PCB_TEXT_T:
( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet(
bufferPolys, 0, segcountforcircle, correctionFactor );
break;
default:
break;
}
}
for( MODULE* module = pcb->m_Modules; module; module = module->Next() )
{
module->TransformPadsShapesWithClearanceToPolygon( layer,
bufferPolys,
0,
segcountforcircle,
correctionFactor );
module->TransformGraphicShapesWithClearanceToPolygonSet( layer,
bufferPolys,
0,
segcountforcircle,
correctionFactor );
}
// bufferPolys contains polygons to merge. Many overlaps .
// Calculate merged polygons and remove pads and vias holes
if( bufferPolys.IsEmpty() )
continue;
bufferPolys.Simplify( polygonsCalcMode );
int thickness = GetPrm3DVisu().GetLayerObjectThicknessBIU( layer );
int zpos = GetPrm3DVisu().GetLayerZcoordBIU( layer );
// for Draw3D_SolidHorizontalPolyPolygons,
// zpos it the middle between bottom and top sides.
// However for top layers, zpos should be the bottom layer pos,
// and for bottom layers, zpos should be the top layer pos.
if( Get3DLayer_Z_Orientation( layer ) > 0 )
zpos += thickness/2;
else
zpos -= thickness/2 ;
float zNormal = 1.0f; // When using thickness it will draw first the top and then botton (with z inverted)
// If we are not using thickness, then the znormal must face the layer direction
// because it will draw just one plane
if( !thickness )
zNormal = Get3DLayer_Z_Orientation( layer );
setGLTechLayersColor( layer );
Draw3D_SolidHorizontalPolyPolygons( bufferPolys, zpos,
thickness, GetPrm3DVisu().m_BiuTo3Dunits, false,
zNormal );
}
}